JPH08298296A - Pbga package and pbga package mounting substrate - Google Patents

Pbga package and pbga package mounting substrate

Info

Publication number
JPH08298296A
JPH08298296A JP10337195A JP10337195A JPH08298296A JP H08298296 A JPH08298296 A JP H08298296A JP 10337195 A JP10337195 A JP 10337195A JP 10337195 A JP10337195 A JP 10337195A JP H08298296 A JPH08298296 A JP H08298296A
Authority
JP
Japan
Prior art keywords
pbga package
pbga
substrate
mounting substrate
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10337195A
Other languages
Japanese (ja)
Other versions
JP3149727B2 (en
Inventor
Kazunari Kuzuhara
一功 葛原
Jiro Hashizume
二郎 橋爪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10337195A priority Critical patent/JP3149727B2/en
Publication of JPH08298296A publication Critical patent/JPH08298296A/en
Application granted granted Critical
Publication of JP3149727B2 publication Critical patent/JP3149727B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE: To prevent imperfect connection between the main body of a PBGA package and a substrate for mounting the PBGA package by making a plurality of openings for exposing solder ball junction positions and setting adequately the thickness of a substrate to be jointed to the junction surface of a solder ball of the main body of the PBGA package. CONSTITUTION: A plurality of openings 6a for exposing solder ball jointing place are formed in a substrate 6 adhered to the main body 5 of a solder ball jointing surface of a PBGA package. Inside of this, a solder ball 7 is jointed to the main body 5 of the PBGA package. The plate thickness of the substrate 6 is set in such a manner that its height becomes almost the same as the height of the solder ball 7 which can definitely connect the PBGA package 8 to a PBGA package mounting substrate 9. The PBGA package 8 is arranged to the PBGA package mounting substrate 9, and reflow is applied under pressure. By doing this, the height of the solder balls 7 can be aligned to the height with which the PBGA package 8 can be reliably jointed to the PBGA package mounting substrate 9.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体装置の実装に関
するもので、特にＰＢＧＡパッケージ及びＰＢＧＡパッ
ケージを実装するＰＢＧＡパッケージ実装用基板の構造
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting of a semiconductor device, and more particularly to the structure of a PBGA package and a PBGA package mounting substrate for mounting the PBGA package.

【０００２】[0002]

【従来の技術】図８の断面図に基づいて従来のＰＢＧＡ
パッケージの実装方法の一例について説明する。図８は
ＰＢＧＡパッケージを母基板（ＰＢＧＡパッケージ実装
用基板）に実装した状態を示す断面図である。一般的
に、ＰＢＧＡパッケージの実装は、そのＰＢＧＡパッケ
ージ本体１を実装する母基板（ＰＢＧＡパッケージ実装
用基板２）に形成された所定の電極（ランド３）上にク
リーム半田を印刷等により供給し、フラックスを塗布し
て、その位置にＰＢＧＡパッケージ本体１を配置して、
リフローにて他の電子部品（図示省略）と同時に半田付
けを行っていた。その際、特に、ＰＢＧＡパッケージ本
体１に外部から加圧は行わず、ＰＢＧＡパッケージ本体
１の自重で、ＰＢＧＡパッケージ本体１が沈み込むよう
にしてＰＢＧＡパッケージ実装用基板２上に実装してい
た。この時、クリーム半田はランド３上で略球状の半田
ボール４となり、ＰＢＧＡパッケージ実装用基板２とＰ
ＢＧＡパッケージ本体１とは、半田ボール４を介して接
続されるようになっていた。2. Description of the Related Art A conventional PBGA based on the sectional view of FIG.
An example of a package mounting method will be described. FIG. 8 is a sectional view showing a state in which the PBGA package is mounted on a mother board (PBGA package mounting board). Generally, in mounting a PBGA package, cream solder is supplied by printing or the like onto a predetermined electrode (land 3) formed on a mother board (PBGA package mounting board 2) on which the PBGA package body 1 is mounted, Apply flux and place the PBGA package body 1 at that position,
Soldering was performed simultaneously with other electronic components (not shown) by reflow. At this time, in particular, the PBGA package body 1 was not externally pressed, and the PBGA package body 1 was mounted on the PBGA package mounting substrate 2 so that the PBGA package body 1 was sunk by its own weight. At this time, the cream solder becomes a substantially spherical solder ball 4 on the land 3 and the PBGA package mounting substrate 2 and P
It was designed to be connected to the BGA package body 1 via solder balls 4.

【０００３】[0003]

【発明が解決しようとする課題】しかし、ＰＢＧＡパッ
ケージ本体１が対称性のある形状でなければ、均一に沈
み込まずにＰＢＧＡパッケージ本体１が、ＰＢＧＡパッ
ケージ実装用基板２に対して傾いて実装される可能性が
あり、その結果、ＰＢＧＡパッケージ本体１と接続され
ない半田ボール４ができるという問題点があった。However, if the PBGA package body 1 does not have a symmetrical shape, the PBGA package body 1 is mounted at an angle with respect to the PBGA package mounting substrate 2 without sinking uniformly. Therefore, there is a problem that solder balls 4 that are not connected to the PBGA package body 1 are formed.

【０００４】本発明は、上記問題点に鑑みなされたもの
で、その目的とするところは、ＰＢＧＡパッケージ本体
とＰＢＧＡパッケージ実装用基板との接続不良の発生を
防止することができる、ＰＢＧＡパッケージまたはＰＢ
ＧＡパッケージ実装用基板の構造を提供することにあ
る。The present invention has been made in view of the above problems, and an object of the present invention is to prevent a defective connection between a PBGA package body and a PBGA package mounting substrate from occurring.
It is to provide a structure of a substrate for mounting a GA package.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するた
め、請求項１記載のＰＢＧＡパッケージは、ＰＢＧＡパ
ッケージ本体の半田ボール接合面に基板が接合されてお
り、その基板に前記ＰＢＧＡパッケージ本体の半田ボー
ル接合位置を露出させる開孔が複数形成され、前記ＰＢ
ＧＡパッケージ本体とＰＢＧＡパッケージ実装用基板と
の間に半田ボールを介在させ、前記基板を前記ＰＢＧＡ
パッケージ実装用基板に当接させて、前記ＰＢＧＡパッ
ケージ本体を前記ＰＢＧＡパッケージ実装用基板に実装
した際に、前記ＰＢＧＡパッケージ本体と前記ＰＢＧＡ
パッケージ実装用基板とが確実に接続されるように、前
記基板の板厚が設定されていることを特徴とするもので
ある。In order to achieve the above object, in a PBGA package according to claim 1, a substrate is bonded to a solder ball bonding surface of a PBGA package body, and the solder of the PBGA package body is bonded to the substrate. The PB has a plurality of openings for exposing the ball bonding positions.
A solder ball is interposed between the GA package body and the PBGA package mounting substrate, and the substrate is connected to the PBGA package.
When the PBGA package body is mounted on the PBGA package mounting board by abutting on the package mounting board, the PBGA package body and the PBGA
The board thickness is set so that the board for package mounting is surely connected.

【０００６】請求項２記載のＰＢＧＡパッケージ実装用
基板は、半田ボールを介してＰＢＧＡパッケージ本体が
実装されるＰＢＧＡパッケージ実装用基板であって、前
記ＰＢＧＡパッケージ本体を実装する面に凹部が形成さ
れ、その凹部の底面に前記半田ボールが接合されるラン
ドが複数形成されており、そのランドと前記ＰＢＧＡパ
ッケージ本体との間に前記半田ボールを介在させ前記Ｐ
ＢＧＡパッケージ本体を前記ＰＢＧＡパッケージ実装用
基板に当接させて実装した際に、前記ＰＢＧＡパッケー
ジ本体と前記ＰＢＧＡパッケージ実装用基板とが確実に
接続されるように、前記凹部の深さが設定されているこ
とを特徴とするものである。A PBGA package mounting board according to a second aspect is a PBGA package mounting board on which a PBGA package body is mounted via solder balls, wherein a recess is formed on a surface on which the PBGA package body is mounted. A plurality of lands to which the solder balls are joined are formed on the bottom surface of the recess, and the solder balls are interposed between the lands and the PBGA package body.
The depth of the recess is set so that the PBGA package body and the PBGA package mounting board are surely connected to each other when the BGA package body is mounted in contact with the PBGA package mounting board. It is characterized by being present.

【０００７】請求項３記載のＰＢＧＡパッケージ実装用
基板は、半田ボールを介してＰＢＧＡパッケージ本体が
実装されるＰＢＧＡパッケージ実装用基板であって、そ
のＰＢＧＡパッケージ実装用基板の前記ＰＢＧＡパッケ
ージ本体を実装する面に基板が接合されており、その基
板に前記半田ボールが接合されるランドを露出させる開
孔が複数形成され、そのランドと前記ＰＢＧＡパッケー
ジ本体との間に前記半田ボールを介在させ前記ＰＢＧＡ
パッケージ本体を前記基板に当接させて実装した際に、
前記ＰＢＧＡパッケージ本体と前記ＰＢＧＡパッケージ
実装用基板とが確実に接続されるように、前記基板の板
厚が設定されていることを特徴とするものである。A PBGA package mounting substrate according to a third aspect is a PBGA package mounting substrate on which a PBGA package main body is mounted via solder balls, and the PBGA package mounting substrate is mounted on the PBGA package mounting substrate. A substrate is bonded to the surface, a plurality of openings are formed in the substrate to expose a land to which the solder ball is bonded, and the solder ball is interposed between the land and the PBGA package body.
When mounting the package body by abutting on the board,
The board thickness is set so that the PBGA package body and the PBGA package mounting board are securely connected to each other.

【０００８】請求項４記載のＰＢＧＡパッケージ実装用
基板は、半田ボールを介してＰＢＧＡパッケージ本体が
実装されるＰＢＧＡパッケージ実装用基板であって、前
記ＰＢＧＡパッケージ本体を実装する面に複数の突起が
形成されており、前記ＰＢＧＡパッケージ本体と前記Ｐ
ＢＧＡパッケージ実装用基板の間に前記半田ボールを介
在させ前記ＰＢＧＡパッケージ本体を前記突起に当接さ
せて実装した際に、前記ＰＢＧＡパッケージ本体と前記
ＰＢＧＡパッケージ実装用基板とが確実に接続されるよ
うに、前記突起の高さが設定されていることを特徴とす
るものである。A PBGA package mounting board according to a fourth aspect is a PBGA package mounting board on which a PBGA package body is mounted via solder balls, and a plurality of protrusions are formed on a surface on which the PBGA package body is mounted. The PBGA package body and the P
When the PBGA package main body is brought into contact with the protrusions by mounting the solder balls between the BGA package mounting substrates, the PBGA package main body and the PBGA package mounting substrate are surely connected to each other. In addition, the height of the protrusion is set.

【０００９】[0009]

【作用】請求項１記載のＰＢＧＡパッケージは、上記課
題を解決するため、ＰＢＧＡパッケージの半田ボール接
合面に、ＰＢＧＡパッケージ本体の半田ボール接合位置
を露出させる開孔を複数形成した基板を貼り合わせて構
成したもので、ＰＢＧＡパッケージとＰＢＧＡパッケー
ジ実装用基板間に半田ボールを介在させ、ＰＢＧＡパッ
ケージに貼り合わせた基板をＰＢＧＡパッケージ実装用
基板に当接させて、ＰＢＧＡパッケージをＰＢＧＡパッ
ケージ実装用基板に実装した際に、半田ボールの高さ
が、ＰＢＧＡパッケージとＰＢＧＡパッケージ実装用基
板が半田ボールを介して確実に接続される高さになるよ
うに、基板の板厚を設定したものである。In order to solve the above problems, the PBGA package according to claim 1 is formed by bonding a substrate having a plurality of openings for exposing the solder ball bonding positions of the PBGA package body to the solder ball bonding surface of the PBGA package. The PBGA package is mounted on the PBGA package mounting substrate by placing a solder ball between the PBGA package and the PBGA package mounting substrate and bringing the substrate bonded to the PBGA package into contact with the PBGA package mounting substrate. At this time, the board thickness is set so that the height of the solder ball is the height at which the PBGA package and the PBGA package mounting board are securely connected via the solder ball.

【００１０】ＰＢＧＡパッケージとＰＢＧＡパッケージ
実装用基板が半田ボールを介して確実に接続されるよう
な半田ボール高さとは、リフロー時に半田ボールが溶融
して、ＰＢＧＡパッケージ本体が沈み込み、全半田ボー
ルがＰＢＧＡパッケージ実装用基板に接続可能となる高
さのことであり、半田ボール頂点のコプラナリティを十
分に吸収できるように溶融した半田ボールの高さのこと
である。The solder ball height at which the PBGA package and the PBGA package mounting substrate are surely connected via the solder balls means that the solder balls melt during reflow and the PBGA package body sinks, and all the solder balls are It is the height at which it can be connected to the PBGA package mounting substrate, and is the height of the molten solder ball so that the coplanarity of the solder ball vertex can be sufficiently absorbed.

【００１１】以上に説明したようにＰＢＧＡパッケージ
を構成しておき、ＰＢＧＡパッケージ実装用基板へのリ
フロー半田付けによる実装の際に、ＰＢＧＡパッケージ
本体を上方から加圧してやると、ＰＢＧＡパッケージ本
体に貼り合わせた基板がＰＢＧＡパッケージ実装用基板
に当接するまでＰＢＧＡパッケージ本体が沈み込むの
で、溶融した半田ボールの高さが必ず揃うようになり、
半田ボールを介した、ＰＢＧＡパッケージとＰＢＧＡパ
ッケージ実装用基板との接続が確実に行われるようにな
る。このように、請求項１記載のＰＢＧＡパッケージで
は、基板によって、全半田ボールの高さを、ＰＢＧＡパ
ッケージとＰＢＧＡパッケージ実装用基板が半田ボール
を介して確実に接続される高さに揃えることができる。The PBGA package is constructed as described above, and when the PBGA package body is mounted on the PBGA package mounting substrate by reflow soldering, the PBGA package body is pressed from above and is bonded to the PBGA package body. Since the PBGA package body sinks until the PBGA package mounting substrate comes into contact with the PBGA package mounting substrate, the heights of the molten solder balls are always made uniform.
The connection between the PBGA package and the PBGA package mounting substrate can be reliably performed through the solder balls. As described above, in the PBGA package according to the first aspect, the height of all the solder balls can be made uniform by the substrate so that the PBGA package and the PBGA package mounting substrate can be reliably connected via the solder balls. .

【００１２】請求項２記載のＰＢＧＡパッケージ実装用
基板は、ＰＢＧＡパッケージ本体を実装する面に凹部を
形成し、その凹部の底面に半田ボールが接合されるラン
ドを複数形成したものであり、そのランドとＰＢＧＡパ
ッケージ本体との間に半田ボールを介在させＰＢＧＡパ
ッケージ本体をＰＢＧＡパッケージ実装用基板に当接さ
せて実装した際に、溶融した半田ボールの高さが揃い、
ＰＢＧＡパッケージとＰＢＧＡパッケージ実装用基板が
半田ボールを介して確実に接続されるように、凹部の深
さを設定したものである。請求項２記載のＰＢＧＡパッ
ケージ実装用基板では、凹部によって、全半田ボールの
高さを、ＰＢＧＡパッケージとＰＢＧＡパッケージ実装
用基板が半田ボールを介して確実に接続される高さに揃
えることができる。According to a second aspect of the present invention, there is provided a PBGA package mounting substrate in which a recess is formed on the surface on which the PBGA package body is mounted, and a plurality of lands to which solder balls are joined are formed on the bottom of the recess. When the PBGA package body is brought into contact with the PBGA package mounting substrate by mounting a solder ball between the PBGA package body and the PBGA package body, the heights of the melted solder balls are aligned,
The depth of the recess is set so that the PBGA package and the PBGA package mounting substrate are surely connected via the solder balls. In the PBGA package mounting substrate according to the second aspect, the height of all the solder balls can be made equal to the height at which the PBGA package and the PBGA package mounting substrate are surely connected via the solder balls by the recess.

【００１３】請求項３記載のＰＢＧＡパッケージ実装用
基板は、ＰＢＧＡパッケージ本体を実装する面に、半田
ボールが接合されるランドを露出させる開孔が複数形成
された基板を貼り合わせて構成したものであり、ランド
とＰＢＧＡパッケージ本体間に半田ボールを介在させ、
ＰＢＧＡパッケージ本体を基板に当接させて、ＰＢＧＡ
パッケージ本体をＰＢＧＡパッケージ実装用基板に実装
した際に、半田ボールの高さが、ＰＢＧＡパッケージと
ＰＢＧＡパッケージ実装用基板が半田ボールを介して確
実に接続される高さになるように、基板の板厚を設定し
たものである。請求項３記載のＰＢＧＡパッケージ実装
用基板では、基板によって、全半田ボールの高さを、Ｐ
ＢＧＡパッケージとＰＢＧＡパッケージ実装用基板が半
田ボールを介して確実に接続される高さに揃えることが
できる。A PBGA package mounting substrate according to a third aspect of the present invention is configured such that a substrate having a plurality of openings for exposing lands to which solder balls are bonded is bonded to a surface on which the PBGA package body is mounted. Yes, with solder balls interposed between the land and the PBGA package body,
Put the PBGA package body in contact with the substrate, and
When the package body is mounted on the PBGA package mounting board, the height of the solder balls is such that the PBGA package and the PBGA package mounting board are securely connected via the solder balls. The thickness is set. In the PBGA package mounting substrate according to claim 3, the height of all solder balls is set to P
The BGA package and the PBGA package mounting substrate can be aligned at a height at which they can be reliably connected via solder balls.

【００１４】請求項４記載のＰＢＧＡパッケージ実装用
基板は、ＰＢＧＡパッケージ本体を実装する面に突起を
形成し、ＰＢＧＡパッケージ本体が突起に当接するま
で、ＰＢＧＡパッケージ本体を加圧により沈み込ませれ
ば、溶融した半田ボールの高さが必ず揃い、ＰＢＧＡパ
ッケージ本体とＰＢＧＡパッケージ実装用基板の接続が
確実に行われるように構成したものである。請求項４記
載のＰＢＧＡパッケージ実装用基板では、突起によっ
て、全半田ボールの高さを、ＰＢＧＡパッケージとＰＢ
ＧＡパッケージ実装用基板が半田ボールを介して確実に
接続される高さに揃えることができる。According to another aspect of the PBGA package mounting substrate of the present invention, a protrusion is formed on the surface on which the PBGA package body is mounted, and the PBGA package body is depressed by pressure until the PBGA package body contacts the protrusion. The heights of the molten solder balls are always the same, and the PBGA package main body and the PBGA package mounting substrate are surely connected to each other. In the PBGA package mounting substrate according to claim 4, the heights of all the solder balls are set to the PBGA package and the PBGA by the protrusions.
It is possible to arrange the GA package mounting substrate at a height such that it can be reliably connected via the solder balls.

【００１５】[0015]

【実施例】図１及び図２に基づいて本発明のＰＢＧＡパ
ッケージの一実施例について説明する。図１は、ＰＢＧ
Ａパッケージを、母基板であるＰＢＧＡパッケージ実装
用基板に実装した状態を示す断面図であり、図２
（ａ），（ｂ）は、それぞれ、ＰＢＧＡパッケージの断
面図、平面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the PBGA package of the present invention will be described with reference to FIGS. Figure 1 shows PBG
2 is a cross-sectional view showing a state in which the A package is mounted on a PBGA package mounting substrate which is a mother substrate, and FIG.
(A), (b) is a sectional view and a plan view of a PBGA package, respectively.

【００１６】図２で、５はＰＢＧＡパッケージ本体、６
はＰＢＧＡパッケージ本体５の半田ボール接合面に貼り
合わされた基板で、その基板６には、個々の半田ボール
接合箇所を露出させる開孔６ａが複数形成されている。
７は、開孔６ａの内部で、ＰＢＧＡパッケージ本体５に
接合された半田ボール、８はＰＢＧＡパッケージ本体５
に半田ボール７を接合したＰＢＧＡパッケージである。
基板６の板厚は、ＰＢＧＡパッケージ８とＰＢＧＡパッ
ケージ実装用基板とを確実に接続できる半田ボールの高
さと略同じになるように設定されている。In FIG. 2, 5 is a PBGA package body, and 6
Is a substrate bonded to the solder ball bonding surface of the PBGA package body 5, and the substrate 6 has a plurality of openings 6a for exposing individual solder ball bonding portions.
7 is a solder ball bonded to the PBGA package body 5 inside the opening 6a, and 8 is a PBGA package body 5
It is a PBGA package in which the solder balls 7 are joined to the PBGA package.
The board thickness of the board 6 is set to be substantially the same as the height of the solder balls that can reliably connect the PBGA package 8 and the PBGA package mounting board.

【００１７】このようにＰＢＧＡパッケージ８を構成し
ておき、図１に示すように、ＰＢＧＡパッケージ実装用
基板９に形成されたランド１０と半田ボール７が対応す
るように、ＰＢＧＡパッケージ８をＰＢＧＡパッケージ
実装用基板９上に配置し、上方からＰＢＧＡパッケージ
８を加圧してやりながらリフローに流してやる。これに
より、ＰＢＧＡパッケージ本体５に貼り合わせた基板６
が、ＰＢＧＡパッケージ実装用基板９に当接するので、
半田ボール７の高さを、ＰＢＧＡパッケージ８とＰＢＧ
Ａパッケージ実装用基板９とを確実に接続できる高さに
揃えることができる。The PBGA package 8 is constructed in this manner, and as shown in FIG. 1, the PBGA package 8 is replaced with the PBGA package 8 so that the lands 10 formed on the PBGA package mounting substrate 9 correspond to the solder balls 7. The PBGA package 8 is placed on the mounting substrate 9 and pressure is applied to the PBGA package 8 from above to allow the PBGA package 8 to flow for reflow. As a result, the substrate 6 bonded to the PBGA package body 5
However, since it contacts the PBGA package mounting substrate 9,
The height of the solder ball 7 is set to the PBGA package 8 and the PBG.
The height can be made uniform so that the A package mounting substrate 9 can be reliably connected.

【００１８】図３及び図４に基づいて本発明のＰＢＧＡ
パッケージ実装用基板の一実施例について説明する。図
３は、ＰＢＧＡパッケージをＰＢＧＡパッケージ実装用
基板に実装した状態を示す断面図であり、図４（ａ），
（ｂ）は、それぞれ、ＰＢＧＡパッケージ実装用基板の
断面図、平面図である。図４で、１１は複数の半田ボー
ルを収納する凹部１１ａが形成されたＰＢＧＡパッケー
ジ実装用基板、１２は凹部１１ａの底面に形成された、
半田ボールが接合されるランドである。The PBGA of the present invention based on FIGS. 3 and 4.
An example of the package mounting substrate will be described. FIG. 3 is a cross-sectional view showing a state in which the PBGA package is mounted on the PBGA package mounting substrate.
(B) is a cross-sectional view and a plan view of a PBGA package mounting substrate, respectively. In FIG. 4, 11 is a PBGA package mounting substrate in which a recess 11a for housing a plurality of solder balls is formed, and 12 is formed on the bottom surface of the recess 11a.
A land to which solder balls are joined.

【００１９】図４に示すようにＰＢＧＡパッケージ実装
用基板１１を構成しておき、図３に示すように、半田ボ
ール１３を接合したＰＢＧＡパッケージ本体１４を、ラ
ンド１２と半田ボール１３が対応するように、ＰＢＧＡ
パッケージ実装用基板１１上に配置し、リフロー時、Ｐ
ＢＧＡパッケージ本体１４を上方から加圧する。これに
より、ＰＢＧＡパッケージ本体１４が、ＰＢＧＡパッケ
ージ実装用基板１１に当接するので、半田ボール１３の
高さを、ＰＢＧＡパッケージ本体１４とＰＢＧＡパッケ
ージ実装用基板１１とを確実に接続できる高さに揃える
ことができる。The PBGA package mounting substrate 11 is constructed as shown in FIG. 4, and as shown in FIG. 3, the PBGA package body 14 to which the solder balls 13 are bonded is arranged so that the land 12 and the solder ball 13 correspond to each other. To PBGA
It is placed on the package mounting board 11 and P
The BGA package body 14 is pressed from above. As a result, the PBGA package body 14 comes into contact with the PBGA package mounting board 11, so that the height of the solder balls 13 is made uniform so that the PBGA package body 14 and the PBGA package mounting board 11 can be reliably connected. You can

【００２０】図５及び図６に基づいて本発明のＰＢＧＡ
パッケージ実装用基板の異なる実施例について説明す
る。図５は、ＰＢＧＡパッケージをＰＢＧＡパッケージ
実装用基板に実装した状態を示す断面図であり、図６
（ａ），（ｂ）は、それぞれ、ＰＢＧＡパッケージ実装
用基板の断面図、平面図である。図６に示すＰＢＧＡパ
ッケージ実装用基板は、図２に示した基板６を、ＰＢＧ
Ａパッケージ実装面に張り合わせたものである。図６
で、１５はＰＢＧＡパッケージ実装用基板、１６はＰＢ
ＧＡパッケージ実装用基板１５のＰＢＧＡパッケージ実
装面に複数形成されたランド、１７はＰＢＧＡパッケー
ジ実装用基板１５のＰＢＧＡパッケージ実装面に貼り合
わされた基板で、１７ａは基板１６に形成された、個々
のランド１６を露出させる開孔である。このようにＰＢ
ＧＡパッケージ実装用基板１５を構成し、図５に示すよ
うに、ランド１６上に半田ボール１８が対応するよう
に、半田ボール１８が接合されたＰＢＧＡパッケージ本
体１９をＰＢＧＡパッケージ実装用基板１５上に配置
し、リフロー時、ＰＢＧＡパッケージ本体１９を上方か
ら加圧する。これにより、ＰＢＧＡパッケージ本体１９
が、ＰＢＧＡパッケージ実装用基板１５の表面に貼り合
わされた基板１７に当接するので、半田ボール１８の高
さを、ＰＢＧＡパッケージ本体１９とＰＢＧＡパッケー
ジ実装用基板１５とを確実に接続できる高さに揃えるこ
とができる。The PBGA of the present invention will be described with reference to FIGS. 5 and 6.
Different examples of the package mounting substrate will be described. FIG. 5 is a cross-sectional view showing a state in which the PBGA package is mounted on the PBGA package mounting board.
(A), (b) is a sectional view and a plan view of a PBGA package mounting substrate, respectively. The PBGA package mounting substrate shown in FIG. 6 is the same as the substrate 6 shown in FIG.
It is attached to the mounting surface of the A package. Figure 6
, 15 is a PBGA package mounting substrate, and 16 is PB
A plurality of lands are formed on the PBGA package mounting surface of the GA package mounting substrate 15, 17 is a substrate bonded to the PBGA package mounting surface of the PBGA package mounting substrate 15, and 17a are individual lands formed on the substrate 16. It is an opening that exposes 16. PB like this
As shown in FIG. 5, the PBGA package body 19 having the solder balls 18 bonded to the lands 16 corresponding to the solder balls 18 is formed on the PBGA package mounting substrate 15 to form the GA package mounting substrate 15. The PBGA package body 19 is placed and pressed from above during reflow. As a result, the PBGA package body 19
Contact the substrate 17 attached to the surface of the PBGA package mounting substrate 15, so that the height of the solder ball 18 is made uniform enough to reliably connect the PBGA package body 19 and the PBGA package mounting substrate 15. be able to.

【００２１】図６に示した基板１７の代わりに、基板１
７の板厚と同じ高さの突起を、ＰＢＧＡパッケージ実装
用基板上に形成してもよい。突起を形成したＰＢＧＡパ
ッケージ実装用基板のさらに異なる実施例を図７に示
す。図７（ａ），（ｂ）は、それぞれ、ＰＢＧＡパッケ
ージ実装用基板の断面図、平面図である。図７で、２０
はＰＢＧＡパッケージ実装用基板、２１はＰＢＧＡパッ
ケージ実装用基板２０のＰＢＧＡパッケージ実装面に複
数形成されたランド、２２はＰＢＧＡパッケージ実装用
基板２０のＰＢＧＡパッケージ実装面の四隅に形成され
た略直方体状の突起である。ＰＢＧＡパッケージとの接
合方法は、図５に基づいて説明した方法と同様であるの
で説明を省略する。Substrate 1 instead of substrate 17 shown in FIG.
A protrusion having the same height as the plate thickness of 7 may be formed on the PBGA package mounting substrate. FIG. 7 shows a further different embodiment of the PBGA package mounting substrate on which the protrusion is formed. 7A and 7B are a cross-sectional view and a plan view of the PBGA package mounting substrate, respectively. In FIG. 7, 20
Is a PBGA package mounting board, 21 is a plurality of lands formed on the PBGA package mounting surface of the PBGA package mounting board 20, and 22 is a substantially rectangular parallelepiped formed on the four corners of the PBGA package mounting surface of the PBGA package mounting board 20. It is a protrusion. The method of joining with the PBGA package is the same as the method described with reference to FIG.

【００２２】なお、ＰＢＧＡパッケージまたはＰＢＧＡ
パッケージ実装用基板または基板または突起は実施例に
限定されない。A PBGA package or PBGA
The package mounting substrate or substrate or protrusion is not limited to the embodiment.

【００２３】[0023]

【発明の効果】請求項１記載のＰＢＧＡパッケージ、ま
たは、請求項２乃至請求項４記載のＰＢＧＡパッケージ
実装用基板によれば、ＰＢＧＡパッケージをＰＢＧＡパ
ッケージ実装用基板に実装した場合、全半田ボールの高
さが所定の高さに揃い、ＰＢＧＡパッケージをＰＢＧＡ
パッケージ実装用基板に確実に接続することができる。According to the PBGA package according to claim 1 or the PBGA package mounting board according to claims 2 to 4, when the PBGA package is mounted on the PBGA package mounting board, all solder balls are formed. PBGA package with PBGA package
It can be reliably connected to the package mounting substrate.

【００２４】また、請求項１記載のＰＢＧＡパッケージ
によれば、ＰＢＧＡパッケージに半田ボールを接合する
際に、基板の開孔に半田ボールを直接振り込んで半田ボ
ールを供給することが可能となり、治具により半田ボー
ルをＰＢＧＡパッケージの半田ボール接合位置に整列さ
せる必要がない。According to the PBGA package of the first aspect, when the solder ball is bonded to the PBGA package, the solder ball can be directly fed into the opening of the substrate to supply the solder ball. Therefore, it is not necessary to align the solder balls at the solder ball bonding positions of the PBGA package.

【００２５】同様に、請求項３記載のＰＢＧＡパッケー
ジ実装用基板によれば、ＰＢＧＡパッケージ実装用基板
に半田ボールを接合する際に、基板の開孔に半田ボール
を直接振り込んで半田ボールを供給することが可能とな
り、治具により半田ボールをＰＢＧＡパッケージ実装用
基板の半田ボール接合位置に整列させる必要がない。Similarly, according to the PBGA package mounting substrate of the third aspect, when the solder ball is bonded to the PBGA package mounting substrate, the solder ball is directly thrown into the opening of the substrate to supply the solder ball. Therefore, it is not necessary to align the solder balls with the solder ball bonding positions on the PBGA package mounting substrate by the jig.

【００２６】さらに、請求項１記載のＰＢＧＡパッケー
ジ、または、請求項３記載のＰＢＧＡパッケージ実装用
基板を用いた場合は、それぞれの半田ボールの周囲に、
基板による壁を形成することができるので、それぞれの
半田ボール間の絶縁性を向上させることができる。Further, when the PBGA package according to claim 1 or the PBGA package mounting board according to claim 3 is used, the solder balls are provided around the respective solder balls.
Since the wall made of the substrate can be formed, the insulation between the solder balls can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のＰＢＧＡパッケージの一実施例をＰＢ
ＧＡパッケージ実装用基板に実装した状態を示す断面図
である。FIG. 1 is a PB example of a PBGA package of the present invention.
It is sectional drawing which shows the state mounted in the board | substrate for GA package mounting.

【図２】本発明のＰＢＧＡパッケージの一実施例を示す
図で、（ａ）は断面図、（ｂ）は平面図である。2A and 2B are views showing an embodiment of a PBGA package of the present invention, in which FIG. 2A is a sectional view and FIG. 2B is a plan view.

【図３】本発明のＰＢＧＡパッケージ実装用基板の一実
施例にＰＢＧＡパッケージを実装した状態を示す断面図
である。FIG. 3 is a cross-sectional view showing a state in which a PBGA package is mounted on an embodiment of the PBGA package mounting substrate of the present invention.

【図４】本発明のＰＢＧＡパッケージ実装用基板の異な
る実施例を示す図で、（ａ）は断面図、（ｂ）は平面図
である。4A and 4B are views showing another embodiment of the PBGA package mounting substrate of the present invention, in which FIG. 4A is a sectional view and FIG. 4B is a plan view.

【図５】本発明のＰＢＧＡパッケージ実装用基板の異な
る実施例にＰＢＧＡパッケージを実装した状態を示す断
面図である。FIG. 5 is a sectional view showing a PBGA package mounted on a different embodiment of the PBGA package mounting substrate of the present invention.

【図６】本発明のＰＢＧＡパッケージ実装用基板の異な
る実施例を示す図で、（ａ）は断面図、（ｂ）は平面図
である。6A and 6B are views showing another embodiment of the PBGA package mounting substrate of the present invention, wherein FIG. 6A is a sectional view and FIG. 6B is a plan view.

【図７】本発明のＰＢＧＡパッケージ実装用基板のさら
に異なる実施例を示す図で、（ａ）は断面図、（ｂ）は
平面図である。7A and 7B are views showing still another embodiment of the PBGA package mounting substrate of the present invention, wherein FIG. 7A is a sectional view and FIG. 7B is a plan view.

【図８】従来のＰＢＧＡパッケージの一例をＰＢＧＡパ
ッケージ実装用基板に実装した状態を示す断面図であ
る。FIG. 8 is a cross-sectional view showing an example of a conventional PBGA package mounted on a PBGA package mounting substrate.

【符号の説明】[Explanation of symbols]

５，１４，１９ ＰＢＧＡパッケージ本体 ６，１７ 基板 ６ａ，１７ａ 開孔 ７，１３，１８ 半田ボール ９，１１，１５，２０ ＰＢＧＡパッケージ実装用基板 １１ａ 凹部 １２，１６，２１ ランド ２２ 突起 5,14,19 PBGA package body 6,17 Substrate 6a, 17a Open hole 7,13,18 Solder ball 9,11,15,20 PBGA package mounting substrate 11a Recess 12,16,21 Land 22 Protrusion

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 ＰＢＧＡパッケージ本体の半田ボール接
合面に基板が接合されており、その基板に前記ＰＢＧＡ
パッケージ本体の半田ボール接合位置を露出させる開孔
が複数形成され、前記ＰＢＧＡパッケージ本体とＰＢＧ
Ａパッケージ実装用基板との間に半田ボールを介在さ
せ、前記基板を前記ＰＢＧＡパッケージ実装用基板に当
接させて、前記ＰＢＧＡパッケージ本体を前記ＰＢＧＡ
パッケージ実装用基板に実装した際に、前記ＰＢＧＡパ
ッケージ本体と前記ＰＢＧＡパッケージ実装用基板とが
確実に接続されるように、前記基板の板厚が設定されて
いることを特徴とするＰＢＧＡパッケージ。1. A substrate is bonded to a solder ball bonding surface of a PBGA package body, and the PBGA is bonded to the substrate.
The PBGA package body and the PBG package body are formed with a plurality of openings for exposing solder ball bonding positions of the package body.
A solder ball is interposed between the A package mounting substrate and the PBGA package mounting substrate by bringing the substrate into contact with the PBGA package mounting substrate.
A PBGA package, wherein the board thickness is set so that the PBGA package body and the PBGA package mounting board are surely connected to each other when mounted on a package mounting board. 【請求項２】 半田ボールを介してＰＢＧＡパッケージ
本体が実装されるＰＢＧＡパッケージ実装用基板であっ
て、前記ＰＢＧＡパッケージ本体を実装する面に凹部が
形成され、その凹部の底面に前記半田ボールが接合され
るランドが複数形成されており、そのランドと前記ＰＢ
ＧＡパッケージ本体との間に前記半田ボールを介在させ
前記ＰＢＧＡパッケージ本体を前記ＰＢＧＡパッケージ
実装用基板に当接させて実装した際に、前記ＰＢＧＡパ
ッケージ本体と前記ＰＢＧＡパッケージ実装用基板とが
確実に接続されるように、前記凹部の深さが設定されて
いることを特徴とするＰＢＧＡパッケージ実装用基板。2. A PBGA package mounting substrate on which a PBGA package body is mounted via solder balls, wherein a recess is formed on a surface on which the PBGA package body is mounted, and the solder ball is bonded to a bottom surface of the recess. A plurality of lands to be formed are formed, and the lands and the PB
When the PBGA package body is mounted by abutting the solder balls between the PBGA package body and the GA package body, the PBGA package body and the PBGA package mounting board are surely connected to each other. As described above, the PBGA package mounting substrate is characterized in that the depth of the recess is set. 【請求項３】 半田ボールを介してＰＢＧＡパッケージ
本体が実装されるＰＢＧＡパッケージ実装用基板であっ
て、そのＰＢＧＡパッケージ実装用基板の前記ＰＢＧＡ
パッケージ本体を実装する面に基板が接合されており、
その基板に前記半田ボールが接合されるランドを露出さ
せる開孔が複数形成され、そのランドと前記ＰＢＧＡパ
ッケージ本体との間に前記半田ボールを介在させ前記Ｐ
ＢＧＡパッケージ本体を前記基板に当接させて実装した
際に、前記ＰＢＧＡパッケージ本体と前記ＰＢＧＡパッ
ケージ実装用基板とが確実に接続されるように、前記基
板の板厚が設定されていることを特徴とするＰＢＧＡパ
ッケージ実装用基板。3. A PBGA package mounting substrate on which a PBGA package body is mounted via solder balls, the PBGA package mounting substrate being the PBGA package mounting substrate.
The board is bonded to the surface on which the package body is mounted,
A plurality of openings are formed on the substrate to expose lands to which the solder balls are bonded, and the solder balls are interposed between the lands and the PBGA package body.
The board thickness of the board is set so that the PBGA package body and the PBGA package mounting board are surely connected to each other when the BGA package body is mounted in contact with the board. A PBGA package mounting substrate. 【請求項４】 半田ボールを介してＰＢＧＡパッケージ
本体が実装されるＰＢＧＡパッケージ実装用基板であっ
て、前記ＰＢＧＡパッケージ本体を実装する面に複数の
突起が形成されており、前記ＰＢＧＡパッケージ本体と
前記ＰＢＧＡパッケージ実装用基板の間に前記半田ボー
ルを介在させ前記ＰＢＧＡパッケージ本体を前記突起に
当接させて実装した際に、前記ＰＢＧＡパッケージ本体
と前記ＰＢＧＡパッケージ実装用基板とが確実に接続さ
れるように、前記突起の高さが設定されていることを特
徴とするＰＢＧＡパッケージ実装用基板。4. A PBGA package mounting substrate on which a PBGA package body is mounted via solder balls, wherein a plurality of protrusions are formed on a surface on which the PBGA package body is mounted, and the PBGA package body and the PBGA package body. When the PBGA package mounting board is mounted by placing the solder balls between the PBGA package mounting board and the PBGA package mounting board, the PBGA package mounting board and the PBGA package mounting board are surely connected to each other. In the PBGA package mounting substrate, the height of the protrusion is set.
JP10337195A 1995-04-27 1995-04-27 PBGA package and PBGA package mounting board Expired - Fee Related JP3149727B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10337195A JP3149727B2 (en) 1995-04-27 1995-04-27 PBGA package and PBGA package mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337195A JP3149727B2 (en) 1995-04-27 1995-04-27 PBGA package and PBGA package mounting board

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JPH08298296A true JPH08298296A (en) 1996-11-12
JP3149727B2 JP3149727B2 (en) 2001-03-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035476A (en) * 2009-07-29 2011-02-17 Kyocera Corp Imaging module, imaging apparatus and method of manufacturing imaging module
CN113437033A (en) * 2021-06-28 2021-09-24 珠海格力电器股份有限公司 Packaging structure, preparation method thereof and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035476A (en) * 2009-07-29 2011-02-17 Kyocera Corp Imaging module, imaging apparatus and method of manufacturing imaging module
CN113437033A (en) * 2021-06-28 2021-09-24 珠海格力电器股份有限公司 Packaging structure, preparation method thereof and electronic device
CN113437033B (en) * 2021-06-28 2022-07-15 珠海格力电器股份有限公司 Packaging structure, preparation method thereof and electronic device

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