JP2002118197A - Circuit board and semiconductor device using the same as well as its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify manufacturing steps in a semiconductor device obtained by flip-chip connecting a semiconductor chip onto a circuit board via an elastic material. SOLUTION: The circuit board comprises an insulating board, wirings provided on the surface of the base and its external connecting terminal. The board further comprises protruding conductors provided at prescribed positions of the base, and elastic materials (elastomers) provided on the wirings of the base and the terminal so as to expose the surfaces of the protrusions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring tape, a semiconductor device using the same, and a method of manufacturing the same.
In particular, the present invention relates to a technique that is effective when applied to a semiconductor device in which a semiconductor chip is flip-chip bonded with an elastic body (elastomer) interposed on a wiring tape.

[0002]

2. Description of the Related Art Conventionally, flip chip bonding has been used as one of the methods for mounting a semiconductor chip on a wiring board provided with wiring and external connection terminals thereof and connecting external electrodes of the semiconductor chip to wiring on the wiring board. can give.

A semiconductor device manufactured by using the flip chip bonding is, for example, shown in FIGS.
As shown in (b), the wiring 102A is formed on the insulating substrate 101.
And wiring board 1 provided with external connection terminals 102B
For example, two elastic bodies (elastomers) 2A and 2B are provided thereon, and the semiconductor chip 3 is provided on the elastic bodies 2A and 2B. The semiconductor chip 3 is shown in FIG.
As shown in FIG.
2B, the external electrode 301
And the wiring 102A of the wiring substrate 1 is a projecting conductor (bump).
5 are joined. At this time, the elastic body 2A,
2B are provided on both sides of the region of the semiconductor chip 3 where the external electrodes 301 are formed, and a gap formed around the projecting conductor (bump) 5 is provided with a sealing resin such as resin (underfill). 13) is poured to seal the periphery of the projecting conductor (bump) 5. The elastic body 2
A and 2B are adhesives for adhering the wiring board 1 and the semiconductor chip 3, and are also used as a relaxation material for relieving thermal stress caused by a difference in thermal expansion coefficient between the wiring board 1 and the semiconductor chip 3. A functional material is used, for example, a thermosetting epoxy resin or the like is used. The external connection terminals 102B of the wiring board 1 are connected to ball terminals 4 such as solder balls via solder vias filled in via holes provided in the tape-shaped base material 101.

In the method of manufacturing a semiconductor device bonded by flip-chip bonding, first, wiring 102
A and its external connection terminal 102B, the external connection terminal 1
After forming the wiring board 1 in which the via hole of the portion 02B is formed, an elastic body (elastomer) is provided at a predetermined position of the wiring board 1.
2A and 2B, the semiconductor chip 3 is placed on the elastic members 2A and 2B, and the external electrodes 301 are connected to the elastic members 2A and 2B.
It is arranged so as to face B. At this time, for example, the protruding electrode 5 is provided on the external electrode 301 so that the protruding electrode 5 and the wiring 102A are in contact with each other.
Then, the elastic members 2A and 2B and the protruding electrode 5 are heated to separate the semiconductor chip 3 and the wiring board 1 from each other.
A, 2B and the semiconductor chip 3
The external electrodes 301 and the wiring 102 of the wiring board 1 are connected by the projecting conductors (bumps) 5. Thereafter, in order to seal the projecting conductors (bumps) 5, as shown in FIG. 11, a resin injection nozzle 14 is used between the two elastic bodies 2 </ b> A and 2 </ b> B from the side of the semiconductor chip 3. A sealing resin 13 such as a resin is poured. After sealing the bump 5 with the sealing resin 13, the ball terminal 4 such as a solder ball is placed on the via hole of the wiring board 1, heated and partially melted, and the solder ball and the external connection terminal 102 </ b> B are melted.
Connect.

[0005]

However, according to the conventional technique, a step of flip-chip bonding the semiconductor chip 3 and the wiring board 1 via the elastic bodies 2A and 2B,
Since the step of sealing the projecting conductor (bump) 2 is another step, there is a problem that the number of manufacturing steps increases and the manufacturing cost increases.

Further, the elastic bodies (elastomers) 2A, 2
After the step of flip-chip bonding the semiconductor chip 3 and the wiring board 1 via B, a step of pouring a sealing resin 13 between the elastic bodies 2A and 2B to seal the projecting conductor (bump) 3 is performed. However, when the sealing resin 13 is poured, voids 15 are often formed without the sealing resin 13 flowing between the bumps 5 as shown in FIG. When the voids 15 are formed, the air in the voids 15 is heated and expanded in a heat treatment in a subsequent manufacturing process, for example, a reflow process for connecting the ball terminals 4, and the bumps 5 There is a problem that the connection is poor due to peeling off from the external electrode 102A or the external electrode 301. In addition, due to the expansion of the void 15, the adhesive surface between the sealing resin 13 and the semiconductor chip 3 or the wiring board 1 is peeled off, which causes a problem of causing a package crack.

An object of the present invention is to provide a technique capable of simplifying a manufacturing process in a semiconductor device in which a semiconductor chip is flip-chip bonded on a wiring board via an elastic body.

Another object of the present invention is to provide a semiconductor device in which a semiconductor chip is flip-chip bonded on a wiring board via an elastic body, whereby a connection failure between external electrodes of the semiconductor chip and wiring can be reduced. Is to provide.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

The summary of the invention disclosed in the present invention is as follows.

(1) In a wiring board including an insulating base material, wiring provided on the surface of the base material, and external connection terminals thereof, a projecting conductor is provided at a predetermined position of the wiring,
An elastic body (elastomer) such that the surface of the projecting conductor is exposed on the wiring of the insulating base material and the external connection terminals thereof.
Is provided on the wiring board.

According to the above (1), by providing a projecting electrode on the wiring of the wiring board and providing an elastic body (elastomer) so that the projecting electrode is exposed, the semiconductor chip is provided on the wiring board. To simplify the manufacturing process when connecting the external electrodes of the semiconductor chip and the wiring.

(2) Wiring and its external connection terminals are provided on the surface of the insulating base material, projecting conductors are provided at predetermined positions of the wiring, and the wiring of the insulating base material and its external connection terminals are provided on the wiring. Providing a wiring board provided with an elastic body (elastomer) so that the surface of the projecting conductor is exposed, and providing a semiconductor chip on the elastic body of the wiring board so that a circuit forming surface thereof faces the elastic body; The semiconductor device is a semiconductor device in which external electrodes provided on a circuit forming surface of the semiconductor chip and wiring of the wiring board are connected by being sealed with the elastic body (elastomer).

According to the above (2), the conductor (projecting conductor) for connecting the external electrode of the semiconductor chip to the wiring of the wiring board.
However, since it is sealed by the elastic body (elastomer), voids are formed around the conductor, and peeling of a bonding portion and occurrence of a package crack can be reduced, so that the reliability of the semiconductor device is improved. .

(3) Wirings and their external connection terminals are formed in the wiring substrate forming area of the tape-shaped insulating base material, and projecting conductors are formed at predetermined positions of the wirings. This is a method for manufacturing a wiring board in which an elastic body (elastomer) having an opening at a position overlapping the projecting conductor in a plane is attached to the external connection terminal.

According to the above (3), by providing a projecting electrode on the wiring of the wiring board and providing an elastic body (elastomer) so that the projecting electrode is exposed, the semiconductor chip is provided on the wiring board. To simplify the manufacturing process when connecting the external electrodes of the semiconductor chip and the wiring.

(4) Wirings and their external connection terminals are formed in the wiring substrate forming area of the tape-shaped insulating base material, and projecting conductors are formed at predetermined positions of the wirings. An elastic body (elastomer) having an opening at a position overlapping the projecting conductor in a plane is attached to the external connection terminal, and the semiconductor chip is placed on the elastic body, and an external electrode forming surface of the semiconductor chip faces the elastic body. And the semiconductor chip is adhered to the wiring board via the elastic body, and the external electrodes of the semiconductor chip and the wiring of the wiring board are connected by a projecting conductor sealed by the elastic body. 6 shows a method for manufacturing a semiconductor device.

According to the above (4), by providing a projecting electrode on the wiring of the wiring board and providing an elastic body (elastomer) so that the projecting electrode is exposed, the semiconductor chip is provided on the wiring board. To simplify the manufacturing process when connecting the external electrodes of the semiconductor chip and the wiring. Therefore, the manufacturing cost of the semiconductor device can be reduced. Also, when the external electrodes of the semiconductor chip and the wiring of the wiring board are flip-chip bonded,
Since the conductor (protruding conductor) is sealed by an elastomer around the conductor, voids are formed around the conductor, and peeling of a bonding portion and occurrence of a package crack can be reduced, thereby improving the reliability of the semiconductor device. be able to.

Hereinafter, the present invention will be described in detail together with embodiments (examples) with reference to the drawings.

In all the drawings for explaining the embodiments, parts having the same function are denoted by the same reference numerals, and their repeated description will be omitted.

[0021]

(Embodiment) FIGS. 1 and 2 are schematic views showing a schematic configuration of a semiconductor device according to an embodiment of the present invention. FIG. 1A is a plan view of the semiconductor device. 1 (b)
1A is a back view of FIG. 1A, FIG. 1C is a left side view of FIG. 1A, FIG. 2A is a plan view of the semiconductor chip of FIG. FIG. 2B is a sectional view taken along line AA ′ in FIG.

FIGS. 1 (a), 1 (b) and 1 (c)
Wherein 1 is a wiring board, 2 is an elastic body (elastomer),
3 is a semiconductor chip and 4 is a ball terminal. FIG.
2A and 2B, reference numeral 101 denotes an insulating substrate;
102A is a wiring, 102B is an external connection terminal, 301 is an external electrode of a semiconductor chip, and 5 is a conductor (projecting conductor).

The semiconductor device of the present embodiment is, for example, shown in FIG.
As shown in (a), FIG. 1 (b), and FIG. 1 (c), an elastic body (elastomer) is formed on one main surface (surface) of the wiring board 1.
The semiconductor chip 3 is adhered to the wiring board 1 with a ball terminal 4 made of, for example, Pb-Sn-based solder connected to a surface (back surface) of the wiring substrate 1 facing the front surface (back surface). Grid Array) type semiconductor device. Although not shown in FIG. 1, the semiconductor chip 3 used in the semiconductor device of this embodiment is a center pad type semiconductor chip in which external electrodes are linearly provided near a center line of a circuit forming surface. Suppose there is.

Further, in the semiconductor device of this embodiment, FIG.
As shown in FIG. 2A and FIG.
Are the insulating substrate 101 and the wiring 10 provided on the surface thereof.
2A and its external connection terminal 102B.
The wiring 102A and its external connection terminal 102B
On the upper side, the semiconductor chip 3 is provided via the elastic body 2,
The external electrodes 301 of the semiconductor chip 3 are bonded so that the surfaces on which the external electrodes 301 are formed face each other.
01 and the wiring 102A of the wiring board are electrically connected by a conductor (projection conductor) 5 sealed with the elastic body (elastomer) 2. Also, the external connection terminal 102
B is connected to the ball terminal 4 via a via hole provided in the insulating substrate 101.

FIGS. 3 to 8 are schematic views for explaining a method of manufacturing the semiconductor device of this embodiment.
4 (a), 5 (a) and 6 (a) are schematic plan views for explaining a method of manufacturing a wiring board, and FIGS. 3 (b), 4 (b) and 6 (b). 3A and FIG.
FIG. 5A is a sectional view taken along line BB ′ of FIG.
FIG. 7B is a cross-sectional view taken along line CC ′ of FIG.
8A and FIG. 8A are schematic plan views for explaining a method of manufacturing a semiconductor device using the wiring substrate, and FIG.
8A and FIG. 8B respectively show FIG. 7A and FIG.
13 is a sectional view taken along line BB ′ of FIG. Hereinafter, a method for manufacturing the semiconductor device of the present embodiment will be described with reference to FIGS. The semiconductor chip 3 used in the semiconductor device
Is a center pad type semiconductor chip in which external electrodes are linearly provided near the center line of the circuit formation surface.

First, as shown in FIGS. 3 (a) and 3 (b), a wiring 102A having a predetermined wiring pattern is formed in a wiring board forming region 1 'of an insulating tape-shaped base material 6 made of, for example, polyimide. And an external connection terminal 102B, and a via hole 103 is opened in the external connection terminal 102B portion of the tape-shaped base material 6. The wiring 102A and the external connection terminal 102B are provided on the surface of the tape-shaped base material 6,
For example, on a conductive thin film such as a copper foil, a resist corresponding to a predetermined wiring pattern is formed, a plating layer is formed on the conductive thin film using the resist as a mask, and then the resist is removed. This time, the conductive thin film is formed by etching using the plating layer as a mask. The via hole 103 is formed, for example, by
It is formed by an etching process using a resist film as a mask, an opening by a laser, or the like. Further, on the tape-shaped base material 6, a wiring board forming area 1 'as shown in FIG.
And a similar wiring pattern is formed in each wiring board formation region 1 '.

Next, as shown in FIGS. 4A and 4B, projecting conductors (bumps) 5 are formed at predetermined positions of the wiring 102A. The projecting conductor 5 is, for example, Pb-
A method in which a solder ball such as Sn-based solder is placed on the wiring 102A and partially melted,
u) There is a method of forming a stud bump using a wire.

Next, as shown in FIGS. 5A and 5B, an elastic body (elastomer) 2 having an opening 201 at a position corresponding to the projecting conductor 5 formed on the wiring 102A is prepared. prepare. The elastic body 2 is prepared, for example, by adding an additive such as a filler to a thermosetting epoxy resin at a predetermined ratio so as to obtain a predetermined elastic modulus. At this time, a cover film 7 is provided on one main surface of the elastic body 2 as shown in FIG. The opening 201 is formed to have the same size as the projecting electrode 5 or a little smaller than the projecting electrode 5.

Next, as shown in FIGS. 6A and 6B, the wiring 102A formed in the wiring board forming region 1 'of the tape-like substrate 6 and the external connection terminals 102B are placed on the wiring 102A. The elastic body 2 provided with the cover film 7 shown in FIG. 5A and FIG. 5B is arranged. At this time, the elastic body 2 is positioned so that the opening 201 overlaps the projecting conductor 5 on the wiring 102A in a plane, so that the projecting conductor 5 is inserted into the opening 201. Be placed. At this time, by making the opening 201 of the elastic body 2 smaller than the projecting conductor 5, the projecting conductor 5 is pushed into the opening 201 so that the projecting conductor 5 is pushed into the opening 201.
It can be inserted without gaps.

According to the above procedure, the tape-shaped base material 6 in which the wiring board 1 used in the semiconductor device of the present embodiment is formed in each wiring board forming area 1 'is formed.

Next, a cover film on the surface of the elastic body (elastomer) 2 provided on the wiring board forming region 1 'of the tape-like base material 6 as shown in FIGS. 6 (a) and 6 (b) 7, the center pad type semiconductor chip 3 is placed on the elastic body 2 so that the external electrode forming surface faces the elastic body 2 as shown in FIGS. 7 (a) and 7 (b). Then, the external electrode 301 and the protruding electrode 5 are aligned and arranged.

Next, for example, the elastic body 2 is heated and the semiconductor chip 3 is pressed to bond the semiconductor chip 3 to the elastic body 2 and to connect the external electrode 301 of the semiconductor chip 3 to the semiconductor chip 3. The projecting conductor 5 is connected. At this time, the protruding conductors 5 are shown in FIGS.
As shown in (b), the periphery is surrounded by the elastic body (elastomer) 2, so that the external electrodes 301 of the semiconductor chip 3 and the wiring 102 A of the wiring board 1 are flip-chip bonded by the projecting conductor 5. At the same time, the joint portion is sealed (sealed) by the elastic body 2. That is, in the method of manufacturing a semiconductor device according to the present embodiment, the step of flip-chip bonding the external electrodes of the semiconductor chip and the wiring of the wiring board and the step of sealing the bonding portion can be performed in one step.

Thereafter, a ball terminal 4 made of, for example, a Pb-Sn-based solder is placed on the via hole 103 provided in the tape-shaped base material 6, and the ball terminal 4 is partially melted. It flows into the via hole 103, and as shown in FIGS. 8A and 8B, the ball terminal 4 and the external connection terminal 102B are electrically connected. Thereafter, when the tape-shaped base material 6 is cut at the outer peripheral portion of the wiring substrate forming region 1 ', a semiconductor device as shown in FIGS. 2A and 2B is obtained.

As described above, according to this embodiment,
A protruding conductor (bump) 5 is provided at a predetermined position on a wiring 102A formed on the surface of the insulating base material 101, and the wiring 102A is formed.
A and the projecting conductor 5 on the external connection terminal 102B.
By using the wiring board 1 provided with the elastic body (elastomer) 2 so that the surface of the
The external electrode 301 and the wiring 102A are flip-chip bonded so that the surface on which the external electrode 301 is formed faces the elastic body 2, and at the same time, the bonding portion can be sealed. For this reason, the flip chip bonding step and the bonding section sealing step, which were two steps in the related art, are performed in one step, so that the number of manufacturing steps can be reduced, and the manufacturing cost of the semiconductor device can be reduced. .

When flip-chip bonding is performed using the wiring substrate 1, the external electrode 301 and the wiring 102A are connected.
(Bump) 5 for electrically connecting the conductor 5 is sealed (sealed) by the elastic body (elastomer).
, The occurrence of voids in the periphery of the semiconductor device and the occurrence of peeling of the bonding portion and cracking of the package can be reduced, and the reliability of the semiconductor device can be improved.

FIGS. 9A and 9B are schematic sectional views showing application examples of the semiconductor device of the above embodiment.

In the above embodiment, a semiconductor device in which one center pad type semiconductor chip 3 is flip-chip bonded on the wiring board 1 has been described as an example. However, the present invention is not limited to this. For example, FIG. As shown in the above, on the center pad type semiconductor device 3 which is flip-chip bonded to the wiring board 1 described in the above embodiment,
For example, the external electrodes 90 may extend along two sides of the circuit forming surface.
1 may be a semiconductor device in which the semiconductor chips 9 provided with 1 are stacked. In this case, the external electrode 901 of the semiconductor chip 9 is connected to the wiring 102A on the wiring board by the bonding wire 10, and the center pad type semiconductor chip 3 and the semiconductor chip 9, the bonding wire 10, and the connection portion thereof are stacked. Is sealed with a mold resin 11.

Further, the semiconductor chip to be flip-chip connected on the wiring board 1 described in the above embodiment is not limited to the center pad type semiconductor device 3 described in the above embodiment.
A semiconductor chip in which external electrodes are formed along two sides of a circuit forming surface as shown in FIG.
Also in this case, as described in the above embodiment, the protruding electrode 5 is provided at a predetermined position of the wiring 102A formed on the insulating substrate 101, and an elastic portion having an opening at a position corresponding to the protruding electrode 5 is formed. By manufacturing the wiring board provided with the body (elastomer), the step of flip-chip bonding and the step of sealing the bonding portion can be performed in one step, and the number of manufacturing steps is reduced, and the manufacturing cost is reduced.

As described above, the present invention has been specifically described based on the above-described embodiment. However, the present invention is not limited to the above-described embodiment, and may be variously modified without departing from the gist thereof. Of course.

[0040]

According to the invention disclosed in the present invention,
The effect obtained by the representative one will be briefly described as follows.

(1) In a semiconductor device in which a semiconductor chip is flip-chip bonded on a wiring board via an elastic body, the manufacturing process can be simplified.

(2) In a semiconductor device in which a semiconductor chip is flip-chip bonded on a wiring board via an elastic body, it is possible to reduce the connection failure between the external electrodes of the semiconductor chip and the wiring.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a schematic configuration of a semiconductor device according to one embodiment of the present invention.

FIG. 2 is a schematic diagram showing a schematic configuration of a semiconductor device according to one embodiment of the present invention.

FIG. 3 is a schematic view for explaining the method for manufacturing the semiconductor device according to the embodiment.

FIG. 4 is a schematic view for explaining the method for manufacturing the semiconductor device according to the present embodiment.

FIG. 5 is a schematic view for explaining the method for manufacturing the semiconductor device according to the embodiment.

FIG. 6 is a schematic diagram for explaining the method for manufacturing the semiconductor device according to the present embodiment.

FIG. 7 is a schematic view for explaining the method for manufacturing the semiconductor device according to the present embodiment.

FIG. 8 is a schematic view for explaining the method for manufacturing the semiconductor device according to the present embodiment.

FIG. 9 is a schematic sectional view showing an application example of the semiconductor device of the embodiment.

FIG. 10 is a schematic diagram showing a schematic configuration of a conventional flip-chip bonded semiconductor device.

FIG. 11 is a schematic diagram for explaining a conventional method of sealing a flip-chip bonded semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 101 Insulating base material 102A Wiring 102B External connection terminal 103 Via hole 2 Elastic body (Elastomer) 201 Elastomer opening 3 Center pad type semiconductor chip 301 External electrode 4 Ball terminal 5 Projection conductor (bump) 6 Tape shape Base material 7 Cover film 8 Adhesive 9 Semiconductor chip 901 External electrode 10 Bonding wire 11 Sealing resin 12 Semiconductor chip 1201 External electrode 13 Sealing resin (underfill) 14 Nozzle 15 Void

Claims (4)

[Claims] 1. A wiring board comprising an insulating base material, wiring provided on a surface of the base material, and external connection terminals thereof, wherein a projecting conductor is provided at a predetermined position of the wiring, Elastic body (elastomer) such that the surface of the projecting conductor is exposed on the wiring and the external connection terminals thereof.
A wiring board, comprising: 2. A wiring and an external connection terminal thereof are provided on the surface of the insulating base material, a projecting conductor is provided at a predetermined position of the wiring, and the wiring and the external connection terminal of the insulating base material are provided on the wiring. A wiring board provided with an elastic body (elastomer) such that the surface of the projecting conductor is exposed; and a semiconductor chip provided on the elastic body of the wiring board such that a circuit forming surface thereof faces the elastic body. A semiconductor device, wherein an external electrode provided on a circuit formation surface of a semiconductor chip and a wiring of the wiring substrate are connected by being sealed with the elastic body (elastomer). 3. A wiring and an external connection terminal are formed in a wiring board forming area of a tape-shaped insulating base material, a projecting conductor is formed at a predetermined position of the wiring, and a wiring and an external of the wiring board forming area are formed. A method of manufacturing a wiring board, comprising: attaching an elastic body (elastomer) having an opening at a position overlapping with the projecting conductor in a plane on the connection terminal. 4. A wiring and an external connection terminal are formed in a wiring board forming area of a tape-shaped insulating base material, a projecting conductor is formed at a predetermined position of the wiring, and a wiring and an external wiring in the wiring board forming area are formed. An elastic body (elastomer) having an opening at a position overlapping the projecting conductor in a plane is attached to the connection terminal, and the semiconductor chip is placed on the elastic body so that an external electrode forming surface faces the elastic body. And bonding the semiconductor chip to the wiring board via the elastic body, and connecting the external electrodes of the semiconductor chip and the wiring of the wiring board by a projecting conductor sealed by the elastic body. A method for manufacturing a semiconductor device, comprising: