JPH0342684Y2 - - Google Patents
Info
- Publication number
- JPH0342684Y2 JPH0342684Y2 JP5304986U JP5304986U JPH0342684Y2 JP H0342684 Y2 JPH0342684 Y2 JP H0342684Y2 JP 5304986 U JP5304986 U JP 5304986U JP 5304986 U JP5304986 U JP 5304986U JP H0342684 Y2 JPH0342684 Y2 JP H0342684Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- lcd
- assembly frame
- notch
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
【考案の詳細な説明】
〔考案の目的〕
（産業上の利用分野）
本考案は、基板にLSI（大規模集積回路）素子
を塔載封着し、かつLCD（液晶表示装置）接続子
挿着部を形成するためのIC基板用組立枠体に関
する。[Detailed explanation of the invention] [Purpose of the invention] (Industrial application field) The invention is based on a method of mounting and sealing an LSI (Large-Scale Integrated Circuit) element on a substrate and inserting an LCD (Liquid Crystal Display) connector. The present invention relates to an IC board assembly frame for forming a mounting part.
（従来の技術）
従来、IC基板の組立は、プリント基板のLSI素
子搭載部位に封着用枠を載置し、この枠内にエポ
キシ系樹脂を注入してLSI素子を封着する。この
基板を基板ケースに嵌め込み、この上面にLCD
接続子挿着部を有するLCDケースを重合させて
IC基板が完成する。このIC基板の組立において
は、LSI素子封着用枠の載置、基板ケースへの嵌
め込み、基板ケースとLCDケースとの重合等の
作業が繁雑で面倒であり、この改善が要望されて
いる。(Prior Art) Conventionally, when assembling an IC board, a sealing frame is placed on the LSI element mounting area of the printed circuit board, and an epoxy resin is injected into this frame to seal the LSI element. Insert this board into the board case and display the LCD on the top surface.
By overlapping the LCD case with the connector insertion part
The IC board is completed. When assembling this IC board, operations such as placing the LSI element sealing frame, fitting it into the board case, and overlapping the board case and LCD case are complicated and troublesome, and improvements are desired.
（考案が解決しようとする問題点）
本考案は上記事情を考慮してなされたもので、
組立枠体を基板に嵌合させるだけの簡単な操作で
LSI素子封着用枠とLCD接続子挿着部とを形成す
ることができるIC基板用組立枠体を提供するこ
とを目的とする。(Problems that the invention attempts to solve) This invention was made in consideration of the above circumstances.
Easy operation, just fit the assembly frame to the board.
An object of the present invention is to provide an assembly frame for an IC board that can form an LSI element sealing frame and an LCD connector insertion part.
（問題点を解決するための手段）
本考案は上記の目的を達成するために、LSI素
子封着用枠とLCD接続子挿着部とを一体的に設
けたものである。すなわち、基板のLSI素子塔載
部位に対応する透孔と、LCD接続子挿着部位に
対応する切欠と、基板の所定部位に嵌合する嵌合
部とを具備したIC基板用組立枠体である。
(Means for Solving the Problems) In order to achieve the above object, the present invention provides an LSI element sealing frame and an LCD connector insertion portion integrally. In other words, it is an assembly frame for an IC board that has a through hole corresponding to the LSI element mounting part of the board, a notch corresponding to the LCD connector insertion part, and a fitting part that fits into a predetermined part of the board. be.
（作用）
基板の所定部位に、この組立枠体の嵌合部を嵌
合させて取り付けると、組立枠体の透孔と切欠と
は、基板のLSI素子搭載部とLCD接続端子の位置
にそれぞれ合致する。そこで、この透孔内にエポ
キシ系樹脂を注入すると、透孔部は樹脂流れ止め
の枠となりLSI素子の封着が適確にできる。また
組立枠体の切欠にLCD接続子を挿入すると基板
のLCD接続端子へ容易に接続することができる。(Function) When the fitting part of this assembly frame is fitted and attached to the predetermined part of the board, the through hole and notch of the assembly frame are located at the positions of the LSI element mounting part and the LCD connection terminal of the board, respectively. Match. Therefore, when an epoxy resin is injected into this hole, the hole becomes a frame to prevent the resin from flowing, and the LSI element can be properly sealed. Furthermore, by inserting the LCD connector into the notch in the assembly frame, it can be easily connected to the LCD connecting terminal on the board.
（実施例） 本考案の詳細を図示の実施例により説明する。(Example) The details of the invention will be explained with reference to the illustrated embodiments.
第２図に示すプリント基板５は、長方形状のガ
ラスエポキシ樹脂からなり、そのほぼ中央にLSI
素子塔載部６、長辺の一方にLCD接続端子７、
これに対向する他方の長辺に組立枠体１を取り付
けるための切欠８がそれぞれ設けられている。第
１図に示す組立枠体１はPPS樹脂からなり、基板
５のLSI素子搭載部６に対応する方形状の透孔２
と、LCD接続端子７に対応し、かつLCD接続子
（図示しない）に適合する切欠３と、基板５の切
欠８に嵌合する嵌合部４とを有している。 The printed circuit board 5 shown in FIG. 2 is made of rectangular glass epoxy resin, and has an LSI installed approximately in the center.
Element mounting part 6, LCD connection terminal 7 on one of the long sides,
A notch 8 for attaching the assembly frame 1 is provided on the other long side opposite to this. The assembly frame 1 shown in FIG.
, a notch 3 that corresponds to the LCD connection terminal 7 and fits an LCD connector (not shown), and a fitting part 4 that fits into the notch 8 of the substrate 5.
第３図に示すように、この組立枠体１の嵌合部
４を切欠８に嵌め込んで基板５に取り付けると、
透孔２はLSI素子塔載部６に、切欠３はLCD接続
端子７にそれぞれ合致する。透孔２部はLSI素子
封着用枠を形成するので、この透孔２内にエポキ
シ系樹脂を注入すれば、樹脂が流出することなく
LSI素子を封着することができる。また切欠３は
LCD接続子挿着部を形成するので、この切欠３
にLCD接続子を挿着することにより、基板５の
LCD接続が容易に行なわれる。 As shown in FIG. 3, when the fitting part 4 of this assembly frame 1 is fitted into the notch 8 and attached to the board 5,
The through hole 2 matches the LSI element mounting part 6, and the notch 3 matches the LCD connection terminal 7, respectively. The second part of the through hole forms the frame for LSI element sealing, so if you inject epoxy resin into the through hole 2, the resin will not flow out.
LSI elements can be sealed. Also, notch 3 is
This notch 3 forms the LCD connector insertion part.
By inserting the LCD connector into the board 5.
LCD connection is easily made.
〔考案の効果〕
以上のように本考案は、基板のLSI素子塔載部
位に対応する透孔と、LCD接続子挿着部位に対
応する切欠と、基板の所定部位に嵌合する嵌合部
とを具備したIC基板用組立枠体であり、この組
立枠体を基板に嵌着させるだけの簡単な操作で
LSI素子封着用枠およびLCD接続子挿着部を形成
することができ、LSI素子の封着およびLCDの接
続をきわめて容易に行うことができるものであ
る。[Effects of the invention] As described above, the present invention has a through hole corresponding to the LSI element mounting part of the board, a notch corresponding to the LCD connector insertion part, and a fitting part that fits into a predetermined part of the board. This is an assembly frame for IC boards that is equipped with
It is possible to form a frame for LSI element sealing and an LCD connector insertion part, and it is possible to seal the LSI element and connect the LCD extremely easily.
第１図は本考案の実施例を示す斜視図、第２図
は本考案の組立枠体を取り付ける基板を示す斜視
図、第３図は本考案の組立枠を基板に取り付けた
状態を示す斜視図である。
１……組立枠体、２……透孔、３……切欠、４
……嵌合部、５……基板。
Fig. 1 is a perspective view showing an embodiment of the invention, Fig. 2 is a perspective view showing a board to which the assembly frame of the invention is attached, and Fig. 3 is a perspective view showing the assembly frame of the invention attached to the board. It is a diagram. 1... Assembly frame body, 2... Through hole, 3... Notch, 4
...Fitting part, 5... Board.
Claims (1)
挿着部を形成するためのIC基板用組立枠体にお
いて、前記基板のLSI素子塔載部位に対応する透
孔と、前記LCD接続子挿着部位に対応する切欠
と、前記基板の所定部位に嵌合する嵌合部とを具
備したIC基板用組立枠体。 In an IC board assembly frame for mounting and sealing an LSI element on a board and forming an LCD connector insertion part, a through hole corresponding to the LSI element mounting part of the board and the LCD connector are provided. An assembly frame for an IC board, comprising a notch corresponding to an insertion part and a fitting part that fits into a predetermined part of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304986U JPH0342684Y2 (en) | 1986-04-09 | 1986-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304986U JPH0342684Y2 (en) | 1986-04-09 | 1986-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62163955U JPS62163955U (en) | 1987-10-17 |
| JPH0342684Y2 true JPH0342684Y2 (en) | 1991-09-06 |
Family
ID=30878760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5304986U Expired JPH0342684Y2 (en) | 1986-04-09 | 1986-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0342684Y2 (en) |
-
1986
- 1986-04-09 JP JP5304986U patent/JPH0342684Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62163955U (en) | 1987-10-17 |
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