JPH0499337A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPH0499337A
JPH0499337A JP21787890A JP21787890A JPH0499337A JP H0499337 A JPH0499337 A JP H0499337A JP 21787890 A JP21787890 A JP 21787890A JP 21787890 A JP21787890 A JP 21787890A JP H0499337 A JPH0499337 A JP H0499337A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
pad
case
solder
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21787890A
Other languages
Japanese (ja)
Inventor
Hayao Kashiwa
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21787890A priority Critical patent/JPH0499337A/en
Publication of JPH0499337A publication Critical patent/JPH0499337A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

PURPOSE: To achieve die bonding stably and highly accurately by providing a pad at a required part on a surface which is at an opposite side of an adhesion side of a semiconductor substrate and by pressing a pad on the semiconductor substrate by applying an averaged force when mounting the semiconductor substrate to a case such as a package using an adhesive.
CONSTITUTION: Since a pad 6 presses a needle 5, it does not have a main feature functioning as a circuit element which is installed on a surface at an opposite side from an adhesive of a semiconductor substrate 2 and is provided at, for example, its each corner. The semiconductor substrate 2 is retained by forceps 1 and the semiconductor substrate 2 is placed on a solder (resin bond) 4 on a case 3. At this time, while the solder 4 is wet, the semiconductor substrate 2 is not bonded horizontally in reference to a surface of the case 3. By applying a same force to for example four positions of the pad 6 which is provided at any location on the semiconductor substrate 2 by the needle 5, it is die-bonded horizontally in reference to the case 3.
COPYRIGHT: (C)1992,JPO&Japio
JP21787890A 1990-08-17 1990-08-17 Manufacture of semiconductor device Pending JPH0499337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21787890A JPH0499337A (en) 1990-08-17 1990-08-17 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21787890A JPH0499337A (en) 1990-08-17 1990-08-17 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPH0499337A true JPH0499337A (en) 1992-03-31

Family

ID=16711186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21787890A Pending JPH0499337A (en) 1990-08-17 1990-08-17 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPH0499337A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013010156A (en) * 2011-06-28 2013-01-17 Sumitomo Electric Ind Ltd Mounting method, mounting device and mounting jig
CN112059357A (en) * 2020-08-31 2020-12-11 晶澳(邢台)太阳能有限公司 Series welding machine needle pressing mechanism, series welding machine and pressing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013010156A (en) * 2011-06-28 2013-01-17 Sumitomo Electric Ind Ltd Mounting method, mounting device and mounting jig
CN112059357A (en) * 2020-08-31 2020-12-11 晶澳(邢台)太阳能有限公司 Series welding machine needle pressing mechanism, series welding machine and pressing method thereof
CN112059357B (en) * 2020-08-31 2021-11-16 晶澳(邢台)太阳能有限公司 Series welding machine needle pressing mechanism, series welding machine and pressing method thereof

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