JPH04171968A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPH04171968A JPH04171968A JP30006890A JP30006890A JPH04171968A JP H04171968 A JPH04171968 A JP H04171968A JP 30006890 A JP30006890 A JP 30006890A JP 30006890 A JP30006890 A JP 30006890A JP H04171968 A JPH04171968 A JP H04171968A
- Authority
- JP
- Japan
- Prior art keywords
- plate frame
- resin
- chip
- inner leads
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置及びその製造方法に関し、特にフィ
ルムキャリヤを用いたＴＡＢＩＣパッケージの構造及び
樹脂封止方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly to a structure of a TABIC package using a film carrier and a resin sealing method.
従来のフィルムキャリヤを用いた半導体装置の製造方法
を図面を用いて説明する。A method of manufacturing a semiconductor device using a conventional film carrier will be described with reference to the drawings.
まず第３図（ａ）に示すように、サスペンダー３とベー
スフィルム４とこの上に一体的に形成されたアウターリ
ード５とインナーリード７とからなるキャリヤテープの
サスペンダー３上のインナーリード部に薄い板枠ＩＡを
接着剤により固定する０次で吸着台６上に保持されたＩ
Ｃチップ１０のバンプ２をインナーリード７の下側に位
置合せする。First, as shown in FIG. 3(a), a thin film is attached to the inner lead portion of the carrier tape on the suspender 3, which is made up of the suspender 3, the base film 4, and the outer lead 5 and inner lead 7 integrally formed thereon. I held on the suction table 6 in zero order fixing the plate frame IA with adhesive
The bumps 2 of the C chip 10 are aligned below the inner leads 7.
次に第３図（ｂ）に示すように、ヒーターを内蔵し４０
０〜５００℃に加熱されたボンディングツール９により
インナーリード７とバンプ２とを押圧してボンディング
する。Next, as shown in Figure 3(b), a heater is built in and the
The inner lead 7 and the bump 2 are pressed and bonded using a bonding tool 9 heated to 0 to 500°C.
次に第３図（Ｃ）に示すように、ノズル１１より液状の
樹脂１２を吐出させて、板枠ＩＡ内のＩＣチップ１０と
インナーリード７の表面に保護膜を形成する。Next, as shown in FIG. 3(C), liquid resin 12 is discharged from the nozzle 11 to form a protective film on the surfaces of the IC chip 10 and the inner leads 7 in the plate frame IA.
上述した従来の半導体装置の製造方法では、薄い板枠Ｉ
Ａをインナーリードボンディング前にフィルムキャリヤ
に接着しておく為に、板枠ＩＡに前もって接着剤を塗布
しそしてフィルムキャリヤに圧着し、一定の時間加熱し
て硬化しなければならないため、フィルムキャリヤの製
作工程時間が長くなるばかりでなく、板枠の接着の際に
誤まってインナーリード７を曲げてしまうことが多く、
結果的にはコスト的に非常に割高となってしまうという
問題があった。In the conventional semiconductor device manufacturing method described above, the thin plate frame I
In order to bond A to the film carrier before inner lead bonding, adhesive must be applied to the plate frame IA in advance, pressed to the film carrier, and heated for a certain period of time to cure. Not only does the manufacturing process take longer, but the inner lead 7 is often bent by mistake when bonding the board frame.
As a result, there was a problem in that the cost was extremely high.
一方板枠をなくし、ＩＣチップ表面上のみに樹脂を塗布
しようとすると、ＩＣチップのコーナー部にまで樹脂が
広がらないためにＩＣチップの表面の一部が露出し、水
分の侵入によりＩＣチップが損傷を受ける等の問題があ
った。これに対しＩＣチップ及びインナーリード部分に
も十分樹脂を塗布し、ＩＣチップ表面を完全に封止しよ
うとすると、第４図（ａ＞、（ｂ）の平面図及びＡ−Ａ
′線断面図に示すように、インナーリード７に塗布され
た樹脂１２は、インナーリード７の間か狭い為、毛細管
現象によりアウターリード５の部分にまで広がり、結局
アウターリードボンディングに支障を生じるという問題
点があった。On the other hand, if you remove the board frame and try to apply resin only to the surface of the IC chip, the resin will not spread to the corners of the IC chip, and a part of the surface of the IC chip will be exposed, causing the IC chip to deteriorate due to moisture intrusion. There were problems such as damage. On the other hand, if you try to completely seal the IC chip surface by applying enough resin to the IC chip and inner lead parts, the plan view and A-A of FIG.
As shown in the cross-sectional view taken along the line ', the resin 12 applied to the inner leads 7 spreads to the outer leads 5 due to capillary action due to the narrow space between the inner leads 7, which eventually causes problems in outer lead bonding. There was a problem.
第１の発明の半導体装置は、フィルムキャリヤのインナ
ーリードにバンプにより接続されたＩＣチップと、この
ＩＣチップとインナーリードの表面を覆う封止樹脂とを
有する半導体装置において、前記封止樹脂の表面または
内部に封止樹脂の塗布位置を制限するための板枠を設け
たものである。A semiconductor device according to a first aspect of the invention includes an IC chip connected to inner leads of a film carrier by bumps, and a sealing resin that covers the surfaces of the IC chip and the inner leads, wherein the semiconductor device has a surface of the sealing resin. Alternatively, a plate frame is provided inside to limit the position where the sealing resin is applied.
第２の発明の半導体装置の製造方法は、ＩＣチップのバ
ンプ上にフィルムキャリヤのインナーリードをボンディ
ングする工程と、前記ＩＣチップの周辺部上の前記イン
ナーリードの上に板枠を載置したのち、少くともこの板
枠内の前記インナーリードとＩＣチップの表面に封止樹
脂を塗布する工程とを含んで構成される。A method for manufacturing a semiconductor device according to a second aspect of the invention includes the steps of bonding inner leads of a film carrier onto the bumps of an IC chip, and placing a plate frame on the inner leads on the periphery of the IC chip. , at least the step of applying a sealing resin to the inner leads and the surface of the IC chip within the plate frame.
次に本発明について図面を用いて説明する。 Next, the present invention will be explained using the drawings.
第１図（ａ）〜（Ｃ）は本発明の第１の実施例を説明す
るためのフィルムキャリヤとＩＣチップの断面図である
。FIGS. 1A to 1C are cross-sectional views of a film carrier and an IC chip for explaining a first embodiment of the present invention.
まず第１図（ａ）に示すように、吸着台６上に保持され
たＩＣチップ１０のバンプ２とベースフィルム４上にア
ウターリード５と一体的に形成されたインナーリード７
とを熱圧着によりボンディングする０次で薄い板枠ｌを
フィルムキャリヤのサスペンダ３上に載せる。First, as shown in FIG. 1(a), the inner leads 7 are integrally formed with the outer leads 5 on the bumps 2 of the IC chip 10 held on the suction table 6 and the base film 4.
A zero-order thin plate frame l to which the two are bonded by thermocompression bonding is placed on the suspenders 3 of the film carrier.
次に第１図（ｂ）に示すよ“うに、ノズル１１を用い樹
脂１２を板枠１の表面、ＩＣチップ１０の表面及びイン
ナーリード７の部分に塗布する。−定時間放置しておく
と板枠１とインナーリード７との間に樹脂１２が侵透す
るが、板枠１の外側へは表面張力により樹脂１２がはみ
出すことはない。又板枠１上に塗布された樹脂１２も板
枠外へのはみ出しは阻止される。Next, as shown in FIG. 1(b), the resin 12 is applied to the surface of the board frame 1, the surface of the IC chip 10, and the inner lead 7 using the nozzle 11. Although the resin 12 penetrates between the plate frame 1 and the inner lead 7, the resin 12 does not protrude to the outside of the plate frame 1 due to surface tension.Also, the resin 12 applied on the plate frame 1 also Extrusion outside the frame is prevented.
この結果板枠１自体は第１図（ｃ）に示すように、樹脂
１２に挟まれる形となるため離脱することはない、又樹
脂１２内の気泡は、板枠内側の樹脂部分より脱泡してい
く為、封止した際の気泡の残りを低減させることが出来
る。又従来の板枠を前もってフィルムキャリヤに接着し
ておく場合に比べ、本実施例では単に封止する際に板枠
１をフィルムキャリヤ上に搭載するだけなので、板枠１
の固定は樹脂の硬化と同時に行なうことができる為、製
造コストが低減される。更にインナーリードボンディン
グ後のフィルムキャリヤに板枠１を搭載するので、イン
ナーリード７に損傷を与えることもなくなる。As a result, the board frame 1 itself is sandwiched between the resin 12 as shown in FIG. As a result, it is possible to reduce the amount of air bubbles left after sealing. Furthermore, compared to the conventional case in which the plate frame is adhered to the film carrier in advance, in this embodiment, the plate frame 1 is simply mounted on the film carrier when sealing.
can be fixed at the same time as the resin is cured, reducing manufacturing costs. Furthermore, since the plate frame 1 is mounted on the film carrier after inner lead bonding, the inner leads 7 are not damaged.
第２図（ａ）〜（ｃ）は本発明の第２の実施例を説明す
るためのフィルムキャリヤとＩＣチップの断面図である
。FIGS. 2(a) to 2(c) are cross-sectional views of a film carrier and an IC chip for explaining a second embodiment of the present invention.
まず第２図（ａ）に示すように、第１の実施例と同様に
、ＩＣチップ１０のバンプ２にインナーリード７をボン
ディングしたのち、下面に樹脂１２Ａを塗布した薄い板
枠１をサスペンダ３上に載せる。この樹脂１２Ａにより
板枠１の位置ずれを防止することができる。以下第２図
（ｂ）。First, as shown in FIG. 2(a), similarly to the first embodiment, the inner leads 7 are bonded to the bumps 2 of the IC chip 10, and then a thin plate frame 1 whose lower surface is coated with resin 12A is attached to the suspender 3. Put it on top. This resin 12A can prevent the plate frame 1 from shifting. Figure 2(b) below.
（ｃ）に示すように、ノズル１１より樹脂１２を滴下し
、板枠１．インナーリード７及びＩＣチップ１０の表面
に樹脂１２を塗布して硬化させる。As shown in (c), resin 12 is dripped from the nozzle 11 and the plate frame 1. A resin 12 is applied to the surfaces of the inner leads 7 and the IC chip 10 and cured.
上記実施例においては板枠１の表面にも樹脂１２を塗布
する場合について説明したが、板枠１の内部のインナー
リード及びＩＣチップの表面にのみ塗布してもよい。In the above embodiment, a case has been described in which the resin 12 is also applied to the surface of the plate frame 1, but the resin 12 may be applied only to the inner leads and the surfaces of the IC chips inside the plate frame 1.
以上説明したように本発明は、板枠をフィルムキャリヤ
に搭載したのちインナーリードとＩＣチップ上に樹脂を
塗布することにより、インナーリードを曲げることなく
、板枠の固定を樹脂の硬化と共に行うことができる。従
って作業時間を短縮できると共にアウターリードへの樹
脂のはみ出しを防ぐことができる。As explained above, the present invention is capable of fixing the plate frame while the resin hardens without bending the inner leads by applying resin onto the inner leads and the IC chip after the plate frame is mounted on the film carrier. I can do it. Therefore, the working time can be shortened and the resin can be prevented from spilling out onto the outer leads.
第１図及び第２図は本発明の第１及び第２の実施例を説
明するためのフィルムキャリヤとＩＣチップの断面図、
第３図及び第４図は従来例を説明するためのフィルムキ
ャリヤとＩＣチップの断面図及び平面図と断面図である
。
１、ＩＡ・・・板枠、２・・・バンプ、３・・・サスペ
ンダ、４・・・ベースフィルム、５・・・アウターリー
ド、６・・・吸着台、７・・・インナーリード、９・・
・ボンディングツール、１０・・・ＩＣチップ、１１・
・・ノズル、１２．１２Ａ・・・樹脂。1 and 2 are cross-sectional views of a film carrier and an IC chip for explaining the first and second embodiments of the present invention,
3 and 4 are a sectional view, a plan view, and a sectional view of a film carrier and an IC chip for explaining a conventional example. 1. IA... Board frame, 2... Bump, 3... Suspender, 4... Base film, 5... Outer lead, 6... Suction stand, 7... Inner lead, 9・・・
・Bonding tool, 10...IC chip, 11・
...Nozzle, 12.12A...Resin.
Claims (1)
接続されたＩＣチップと、このＩＣチップとインナーリ
ードの表面を覆う封止樹脂とを有する半導体装置におい
て、前記封止樹脂の表面または内部に封止樹脂の塗布位
置を制限するための板枠を設けたことを特徴とする半導
体装置。 ２、ＩＣチップのバンプ上にフィルムキャリヤのインナ
ーリードをボンディングする工程と、前記ＩＣチップの
周辺部上の前記インナーリードの上に板枠を載置したの
ち、少くともこの板枠内の前記インナーリードとＩＣチ
ップの表面に封止樹脂を塗布する工程とを含むことを特
徴とする半導体装置の製造方法。[Claims] 1. A semiconductor device having an IC chip connected to inner leads of a film carrier by bumps, and a sealing resin that covers the surfaces of the IC chip and the inner leads, wherein the surface of the sealing resin or 1. A semiconductor device characterized by having a plate frame provided therein for restricting a position where a sealing resin is applied. 2. Bonding the inner leads of the film carrier onto the bumps of the IC chip, and placing a plate frame on the inner leads on the periphery of the IC chip, and then bonding at least the inner leads in the plate frame. A method for manufacturing a semiconductor device, comprising the step of applying a sealing resin to the surfaces of a lead and an IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30006890A JPH04171968A (en) | 1990-11-06 | 1990-11-06 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30006890A JPH04171968A (en) | 1990-11-06 | 1990-11-06 | Semiconductor device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04171968A true JPH04171968A (en) | 1992-06-19 |
Family
ID=17880315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30006890A Pending JPH04171968A (en) | 1990-11-06 | 1990-11-06 | Semiconductor device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04171968A (en) |
-
1990
- 1990-11-06 JP JP30006890A patent/JPH04171968A/en active Pending
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