JPH0728084A - Production of liquid crystal cell - Google Patents
Production of liquid crystal cellInfo
- Publication number
- JPH0728084A JPH0728084A JP17021493A JP17021493A JPH0728084A JP H0728084 A JPH0728084 A JP H0728084A JP 17021493 A JP17021493 A JP 17021493A JP 17021493 A JP17021493 A JP 17021493A JP H0728084 A JPH0728084 A JP H0728084A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- liquid crystal
- weir
- crystal cell
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、２枚のガラス基板間
に液晶が封入され、一方のガラス基板上にＩＣチップな
どの電子部品が実装される液晶セルの製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal cell in which liquid crystal is sealed between two glass substrates and an electronic component such as an IC chip is mounted on one glass substrate.
【０００２】[0002]
【従来の技術】ガラス基板上にＩＣチップが実装され
る、いわゆるチップ・オン・グラス式の液晶セルでは、
一方のガラス基板上に実装された駆動用ＩＣなどの電子
部品を保護するために、ドロップコーティングなどによ
り液状の樹脂を塗布することで電子部品上に被膜を形成
している。図２（ａ）は、被覆を形成する前の状態を示
しており、２枚のガラス基板１，３の間にはシール用接
着剤５により液晶が封入され、一方のガラス基板１の露
出した部位には、駆動用ＩＣ７がワイヤ９を用いたワイ
ヤボンディングにより実装されている。2. Description of the Related Art In a so-called chip-on-glass type liquid crystal cell in which an IC chip is mounted on a glass substrate,
In order to protect electronic components such as driving ICs mounted on one glass substrate, a liquid resin is applied by drop coating or the like to form a film on the electronic component. FIG. 2A shows a state before forming a coating, in which liquid crystal is sealed between the two glass substrates 1 and 3 by a sealing adhesive 5 and one of the glass substrates 1 is exposed. The driving IC 7 is mounted on the portion by wire bonding using the wire 9.
【０００３】そして、この実装された駆動用ＩＣ７上
に、樹脂による保護用の被膜を形成する。ところが、被
膜を形成する際に、樹脂の粘度，チキリトロピック性あ
るいは塗布位置などにより、図２（ｂ），（ｃ），
（ｄ）に示すように、ワイヤ９が保護用の被膜１１から
露出してしまうという問題がある。Then, a protective film made of resin is formed on the mounted driving IC 7. However, when forming the film, depending on the viscosity of the resin, the thixotropic property, the application position, etc., as shown in FIGS.
As shown in (d), there is a problem that the wire 9 is exposed from the protective film 11.
【０００４】これに対し、ガラスエポキシ基板などにＩ
Ｃチップを実装する、いわゆるチップ・オン・ボード式
のものにおいては、ＩＣチップの全周を囲む位置に、樹
脂の流れ止めとなる堰を設け、この堰の内側に樹脂を流
し込んでＩＣチップを被覆するものがある（特開昭６４
−４４０５１号公報参照）。On the other hand, a glass epoxy substrate, etc.
In the so-called chip-on-board type in which the C chip is mounted, a weir is provided around the entire circumference of the IC chip to prevent the resin from flowing, and the resin is poured inside the weir so that the IC chip Some are coated (JP-A-64)
-44051 gazette).
【０００５】このような樹脂の流れ止めとなる堰を、前
述したチップ・オン・グラス式の液晶セルに利用するこ
とを考える。この場合の液晶セルの製造工程を図３に示
す。通常の液晶セルは、（ａ）のように同サイズの２枚
のガラス基板１３，１５を用いて作製しており、一方の
ガラス基板１３上に、液晶を封止するためのシール用接
着剤１７をスクリーン印刷により形成する。（ｂ）では
ガラス基板１３，１５をシール用接着剤１７により貼り
合わせ、（ｃ）で上部のガラス基板１５を切断してガラ
ス基板１３上のＩＣチップの実装部１９を露出させる。
（ｄ）では実装部１９にＩＣチップ２１をワイヤ２３を
用いたワイヤボンディングで実装した後、（ｅ）でＩＣ
チップ２１の全周を囲むように堰２５を設け、さらに
（ｆ）で堰２５の内側に液状の樹脂を流し込んで被膜２
７を形成することになる。It is considered that such a weir, which serves as a flow stop for the resin, is used in the above-mentioned chip-on-glass type liquid crystal cell. The manufacturing process of the liquid crystal cell in this case is shown in FIG. A normal liquid crystal cell is manufactured by using two glass substrates 13 and 15 of the same size as shown in (a), and a sealing adhesive for sealing liquid crystal on one glass substrate 13. 17 is formed by screen printing. In (b), the glass substrates 13 and 15 are attached to each other with a sealing adhesive 17, and the upper glass substrate 15 is cut in (c) to expose the IC chip mounting portion 19 on the glass substrate 13.
In (d), the IC chip 21 is mounted on the mounting portion 19 by wire bonding using the wire 23, and then in (e) the IC is mounted.
A weir 25 is provided so as to surround the entire circumference of the chip 21, and a liquid resin is poured inside the weir 25 in (f) to form the coating film 2
7 will be formed.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、この場
合には、ガラス基板１３上にシール用接着剤１７のみを
設けて２枚のガラス基板１３，１５を貼り合わせた後、
上部のガラス基板１５を切断して実装部１９を露出さ
せ、さらにガラス基板１３上にシール用接着剤１７とは
別に堰２３を設けなければならず、このためガラス基板
１５の切断作業についてはガラス基板１３，１５をサイ
ズの異なるものとすることで特に問題はないが、堰２５
を単独で設けるという工程が必要となり、作業工程が多
く生産性が悪いという問題がある。However, in this case, after only the sealing adhesive 17 is provided on the glass substrate 13 and the two glass substrates 13 and 15 are bonded together,
The upper glass substrate 15 must be cut to expose the mounting portion 19, and the dam 23 must be provided on the glass substrate 13 in addition to the sealing adhesive 17. Therefore, the cutting operation of the glass substrate 15 must be performed using the glass. Although there is no particular problem by making the substrates 13 and 15 different in size, the weir 25
However, there is a problem that productivity is poor because there are many working steps.
【０００７】そこで、この発明は、液晶セルの製造作業
工程を短縮させることを目的としている。Therefore, an object of the present invention is to shorten the manufacturing work process of the liquid crystal cell.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
に、この発明は、第１ガラス基板上に、電子部品が実装
される実装部の全周を囲む堰と、液晶を封止するための
シール用接着剤とを同時に形成し、前記第１ガラス基板
との間に液晶を封入する第２ガラス基板を、前記実装部
を露出させた状態で第１ガラス基板に前記シール用接着
剤を用いて接着するとともに、前記実装部に電子部品を
実装した後、前記堰の内側に液状の樹脂を流し込んで前
記電子部品を保護する被覆を形成する方法としてある。In order to achieve the above object, the present invention is to seal a liquid crystal on a first glass substrate and a weir surrounding the entire periphery of a mounting portion on which electronic components are mounted. And a second glass substrate which forms a liquid crystal between the first glass substrate and the sealing adhesive, and the sealing adhesive is applied to the first glass substrate with the mounting portion exposed. A method of forming a coating for protecting the electronic component by pouring a liquid resin inside the weir after the electronic component is mounted on the mounting portion while being bonded by using the resin.
【０００９】[0009]
【作用】このような液晶セルの製造方法によれば、第１
ガラス基板上に、シール用接着剤と、保護用被覆を形成
するための液状樹脂の流れ止めとなる堰とを同時に形成
し、また２枚のガラス基板を接着する際には第１ガラス
基板上の実装部を露出させた状態で行うのでガラス基板
を切断する必要がなく、製造工程が短縮されたものとな
る。According to such a method of manufacturing a liquid crystal cell, the first
A sealing adhesive and a dam that serves as a flow stop for liquid resin for forming a protective coating are simultaneously formed on a glass substrate, and when two glass substrates are bonded together, the first glass substrate is used. Since it is performed with the mounting portion exposed, the glass substrate does not need to be cut, and the manufacturing process is shortened.
【００１０】[0010]
【実施例】以下、この発明の実施例を図面に基づき説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１１】図１は、この発明の一実施例を示す液晶セ
ルの製造方法を示す工程図である。この液晶セルは、相
互にサイズの異なる第１ガラス基板２９と第２ガラス基
板３１との間に液晶を封入するもので、第１ガラス基板
２９上には電子部品である駆動用ＩＣ３３を実装するた
めの実装部３５が形成されている。FIG. 1 is a process chart showing a method of manufacturing a liquid crystal cell showing an embodiment of the present invention. This liquid crystal cell encloses liquid crystal between a first glass substrate 29 and a second glass substrate 31 having different sizes, and a driving IC 33, which is an electronic component, is mounted on the first glass substrate 29. A mounting portion 35 for forming is formed.
【００１２】（ａ）では、実装部３５の全周を囲む堰３
７と、第１，第２各ガラス基板２９，３１相互を接着し
て液晶を封止するためのシール用接着剤３９とをスクリ
ーン印刷により同時に形成する。シール用接着剤３９及
び堰３７は、ＵＶ（紫外線）硬化あるいは熱硬化樹脂を
用いる。（ｂ）では、実装部３５及び堰３７が露出する
ように第２ガラス基板３１を第１ガラス基板２９に貼り
合わせ、シール用接着剤３９を硬化させて第１，第２ガ
ラス基板２９，３１相互を接着する。堰３７の硬化は、
シール用接着剤３９と同時に行われる。In (a), the weir 3 surrounding the entire circumference of the mounting portion 35.
7 and a sealing adhesive 39 for sealing the liquid crystal by adhering the first and second glass substrates 29, 31 to each other are simultaneously formed by screen printing. For the adhesive 39 for sealing and the dam 37, UV (ultraviolet) curing or thermosetting resin is used. In (b), the second glass substrate 31 is attached to the first glass substrate 29 so that the mounting portion 35 and the weir 37 are exposed, and the sealing adhesive 39 is cured to form the first and second glass substrates 29, 31. Glue each other. The hardening of the weir 37
It is performed at the same time as the sealing adhesive 39.
【００１３】次に（ｃ）で、第１ガラス基板２９上の実
装部３５に駆動用ＩＣ３３をワイヤ４１を用いたワイヤ
ボンディングにより実装する。最後に（ｄ）において、
堰３７の内側に液状の樹脂を流し込み、駆動用ＩＣ３３
を保護するための被膜４３を形成する。流し込んだ樹脂
は堰３７により塞き止められるので、ワイヤ４１が被膜
４３から露出しなくなり、樹脂の種類や流し込む位置な
どが異なっても、信頼性のある被膜４３が形成されるこ
とになる。Next, in (c), the driving IC 33 is mounted on the mounting portion 35 on the first glass substrate 29 by wire bonding using the wire 41. Finally, in (d),
Liquid resin is poured inside the weir 37 to drive IC 33.
A film 43 for protecting the is formed. Since the poured resin is blocked by the weir 37, the wire 41 is not exposed from the coating film 43, and the reliable coating film 43 is formed even if the type of resin or the pouring position is different.
【００１４】このように、第１ガラス基板２９及び第２
ガラス基板３１を相互にサイズの異なるものとすること
で、一方のガラス基板を切断する必要がなく、またシー
ル用接着剤３９と、被膜４３を形成するための樹脂の流
れ止めとなる堰３７とを同時にスクリーン印刷により形
成するので、製造工程が短縮され、生産性が向上する。Thus, the first glass substrate 29 and the second glass substrate 29
By making the glass substrates 31 different in size from each other, it is not necessary to cut one glass substrate, and the sealing adhesive 39 and the weir 37 that serves as a flow stop for the resin for forming the coating film 43. Are simultaneously formed by screen printing, the manufacturing process is shortened and the productivity is improved.
【００１５】[0015]
【発明の効果】以上説明してきたように、この発明によ
れば、第１ガラス基板上に、シール用接着剤と、保護用
被覆を形成するための液状樹脂の流れ止めとなる堰とを
同時に形成し、また２枚のガラス基板相互を接着する際
には第１ガラス基板上の実装部を露出させた状態で行う
のでガラス基板を切断する必要がなく、製造工程が短縮
されて生産性を向上させることができる。As described above, according to the present invention, the adhesive for sealing and the dam for blocking the flow of the liquid resin for forming the protective coating are simultaneously provided on the first glass substrate. When forming and adhering two glass substrates to each other, it is not necessary to cut the glass substrate because the mounting portion on the first glass substrate is exposed, and the manufacturing process is shortened to improve productivity. Can be improved.
【図１】この発明の一実施例を示す液晶セルの製造方法
を示す工程図である。FIG. 1 is a process drawing showing a method of manufacturing a liquid crystal cell showing an embodiment of the present invention.
【図２】従来例を示す液晶セルの製造方法を示す工程図
である。FIG. 2 is a process drawing showing a method of manufacturing a liquid crystal cell showing a conventional example.
【図３】他の従来例を示す液晶セルの製造方法を示す工
程図である。FIG. 3 is a process drawing showing a method of manufacturing a liquid crystal cell showing another conventional example.
２９ 第１ガラス基板 ３１ 第２ガラス基板 ３３ 駆動用ＩＣ（電子部品） ３５ 実装部 ３７ 堰 ３９ シール用接着剤 ４３ 被膜 29 First Glass Substrate 31 Second Glass Substrate 33 Driving IC (Electronic Component) 35 Mounting Part 37 Dam 39 Sealing Adhesive 43 Film
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年１０月１４日[Submission date] October 14, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、この場
合には、ガラス基板１３上にシール用接着剤１７のみを
設けて２枚のガラス基板１３，１５を貼り合わせた後、
上部のガラス基板１５を切断して実装部１９を露出さ
せ、さらにガラス基板１３上にシール用接着剤１７とは
別に堰２５を設けなければならず、このためガラス基板
１５の切断作業についてはガラス基板１３，１５をサイ
ズの異なるものとすることで特に問題はないが、堰２５
を単独で設けるという工程が必要となり、作業工程が多
く生産性が悪いという問題がある。However, in this case, after only the sealing adhesive 17 is provided on the glass substrate 13 and the two glass substrates 13 and 15 are bonded together,
The upper glass substrate 15 must be cut to expose the mounting portion 19, and the dam 25 must be provided on the glass substrate 13 in addition to the sealing adhesive 17. Therefore, for cutting the glass substrate 15, There is no particular problem in making the glass substrates 13 and 15 different in size, but the weir 25
However, there is a problem that productivity is poor because there are many working steps.
Claims (1)
れる実装部の全周を囲む堰と、液晶を封止するためのシ
ール用接着剤とを同時に形成し、前記第１ガラス基板と
の間に液晶を封入する第２ガラス基板を、前記実装部を
露出させた状態で第１ガラス基板に前記シール用接着剤
を用いて接着するとともに、前記実装部に電子部品を実
装した後、前記堰の内側に液状の樹脂を流し込んで前記
電子部品を保護する被覆を形成したことを特徴とする液
晶セルの製造方法。1. A first glass substrate on which a weir surrounding the entire periphery of a mounting portion on which an electronic component is mounted and a sealing adhesive for sealing liquid crystal are simultaneously formed. A second glass substrate for enclosing a liquid crystal between the first glass substrate and the first glass substrate with the mounting adhesive exposed, and after mounting an electronic component on the mounting portion. A method for manufacturing a liquid crystal cell, wherein a liquid resin is poured into the weir to form a coating for protecting the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17021493A JPH0728084A (en) | 1993-07-09 | 1993-07-09 | Production of liquid crystal cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17021493A JPH0728084A (en) | 1993-07-09 | 1993-07-09 | Production of liquid crystal cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0728084A true JPH0728084A (en) | 1995-01-31 |
Family
ID=15900792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17021493A Pending JPH0728084A (en) | 1993-07-09 | 1993-07-09 | Production of liquid crystal cell |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728084A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926538A2 (en) * | 1997-12-25 | 1999-06-30 | Seiko Epson Corporation | Liquid crystal display device, electronic equipment, and method for making liquid crystal display device |
| EP1151839A1 (en) * | 2000-05-01 | 2001-11-07 | Sony Chemicals Corporation | Process for producing ridgy resin film and recording medium |
| JP2002107754A (en) * | 2000-09-29 | 2002-04-10 | Optrex Corp | Flexible circuit board mounting structure for liquid crystal display panel |
| KR100712108B1 (en) * | 2004-12-10 | 2007-04-27 | 삼성에스디아이 주식회사 | Organic electroluminescence device and method for fabricating thereof |
| WO2017057303A1 (en) * | 2015-10-01 | 2017-04-06 | 三菱電機株式会社 | Liquid crystal display device |
-
1993
- 1993-07-09 JP JP17021493A patent/JPH0728084A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926538A2 (en) * | 1997-12-25 | 1999-06-30 | Seiko Epson Corporation | Liquid crystal display device, electronic equipment, and method for making liquid crystal display device |
| EP0926538A3 (en) * | 1997-12-25 | 2000-02-23 | Seiko Epson Corporation | Liquid crystal display device, electronic equipment, and method for making liquid crystal display device |
| US6151091A (en) * | 1997-12-25 | 2000-11-21 | Seiko Epson Corporation | Liquid crystal display device including film |
| EP1151839A1 (en) * | 2000-05-01 | 2001-11-07 | Sony Chemicals Corporation | Process for producing ridgy resin film and recording medium |
| US6811851B2 (en) | 2000-05-01 | 2004-11-02 | Sony Chemicals Corp. | Process for producing ridgy resin film and recording medium |
| JP2002107754A (en) * | 2000-09-29 | 2002-04-10 | Optrex Corp | Flexible circuit board mounting structure for liquid crystal display panel |
| KR100712108B1 (en) * | 2004-12-10 | 2007-04-27 | 삼성에스디아이 주식회사 | Organic electroluminescence device and method for fabricating thereof |
| WO2017057303A1 (en) * | 2015-10-01 | 2017-04-06 | 三菱電機株式会社 | Liquid crystal display device |
| JPWO2017057303A1 (en) * | 2015-10-01 | 2017-12-07 | 三菱電機株式会社 | Liquid crystal display |
| CN108139641A (en) * | 2015-10-01 | 2018-06-08 | 三菱电机株式会社 | Liquid crystal display device |
| CN108139641B (en) * | 2015-10-01 | 2021-02-05 | 三菱电机株式会社 | Liquid crystal display device having a plurality of pixel electrodes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100326836B1 (en) | Liquid crystal display apparatus having stepped section in glass substrate and method for manufacturing the same | |
| JP4970684B2 (en) | Encapsulation for electrical structural element and method of manufacturing the same | |
| JP2006147864A (en) | Semiconductor package and its manufacturing method | |
| JP2010020209A (en) | Liquid crystal display device | |
| JPH0728084A (en) | Production of liquid crystal cell | |
| US6309902B1 (en) | Method for coating semiconductor element with resin, coating resin, and liquid crystal display device | |
| WO2017057303A1 (en) | Liquid crystal display device | |
| US5281848A (en) | Tape carrier semiconductor device | |
| JPH0619124A (en) | Production of pellicle frame and semiconductor device | |
| JPH05333351A (en) | Production of liquid crystal display panel | |
| JP3536504B2 (en) | Solid-state imaging device and method of manufacturing the same | |
| US7221428B2 (en) | Curing method and apparatus | |
| JP2000019536A (en) | Manufacture of liquid crystal display device | |
| JP2009164362A (en) | Solid-state imaging apparatus and method of manufacturing the same | |
| JPH07248477A (en) | Production of liquid crystal display device | |
| JPS6395652A (en) | Formation of dam for preventing outflow of protective material | |
| JP2966578B2 (en) | Semiconductor element mounting method | |
| JP2947217B2 (en) | Tape carrier type semiconductor device | |
| JPH02251153A (en) | Resin sealing for tape carrier mounted with semiconductor element | |
| JP2005203539A (en) | Electronic device and its manufacturing method | |
| JP2003179267A (en) | Structure of package body of optodevice | |
| JP3022818B2 (en) | Solid-state imaging device and method of manufacturing the same | |
| JP3801591B2 (en) | Electronic device and manufacturing method thereof | |
| KR0147768B1 (en) | Method of adhesion of heat sink for semiconductor package | |
| KR20220091317A (en) | Flexible semiconductor package |