JP2622211B2 - Semiconductor pressure sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pressure sensor package.

[0002]

2. Description of the Related Art FIGS. 3 to 5 show a conventional semiconductor pressure sensor. Reference numerals 1 and 2 denote a pair of upper and lower packages for enclosing a semiconductor pressure-sensitive element 3 therein. A lead frame 5 for connection, 5 is a pressure inlet for leading to the pressure-sensitive element 3, and 6 is an adhesive resin for bonding the upper and lower packages.

Next, the operation will be described. The upper package 1, the lead frame 4 for electrical connection, and the lower package 2 are adhered by the adhesive resin 6, and the change in the pressure-sensitive element output due to the pressure taken in from the pressure inlet 5 is output to the outside by the lead frame 4. It is intended to be taken out.

[0004]

The conventional semiconductor pressure sensor is configured as described above. Since the corners of the upper and lower packages are perpendicular to each other at the bonding portion, the bonding area at the corner is small, and the adhesive resin is small. It causes shrinkage inside and reduces the resin in the adhesive part, lowering the adhesive strength of the package,
There were problems such as causing air leaks.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a structure in which the adhesive resin does not shrink at the adhesive portion between the upper and lower packages.

[0006]

In the semiconductor pressure sensor according to the present invention, the angle formed by the package corner is made obtuse, which is conventionally a right angle, a projection is provided inside the corner of the lower package, and the projection is formed on the projection. A groove is provided in the corresponding upper package, and a groove for a resin reservoir is provided on the bonding surface of the upper and lower packages.

[0007]

According to the semiconductor pressure sensor of the present invention, the angle between the inside of the corner of the package is made obtuse, and the protrusion and the groove are provided inside the corner, so that the adhesive resin for bonding the upper and lower packages flows inside. By providing a groove as a resin reservoir on the bonding surface of the upper and lower packages, the amount of adhesive resin between the upper and lower packages is increased, thereby preventing air leak and improving the bonding strength.

[000]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 and 2, reference numerals 1 to 5 denote the same parts as those of the above-described conventional example, and reference numeral 7 denotes a projection for preventing the flow of the adhesive resin provided at a corner of the lower package 2.
By making the angle formed inside the package corner portion an obtuse angle, the bonding portion at the corner is widened to improve the bonding strength and also prevent the adhesive resin from flowing into the inside. By providing a groove in the upper package 1 corresponding to the projection 6, it is possible to prevent the package adhesive resin from flowing into the inside and air leakage. Numeral 8 is a resin reservoir groove provided on the bonding surface of the upper and lower packages. By increasing the amount of the bonding resin between the upper and lower packages, the bonding strength is improved and air leak is prevented.

[0009]

As described above, according to the present invention, it is possible to prevent the adhesive resin between the upper and lower packages from flowing into the inside, thereby improving the adhesive strength between the packages.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a semiconductor pressure sensor according to one embodiment of the present invention.

FIG. 2 is a plan view of a lower package portion of the semiconductor pressure sensor according to one embodiment of the present invention.

FIG. 3 is a side view showing a conventional semiconductor pressure sensor.

FIG. 4 is an exploded perspective view showing a conventional semiconductor pressure sensor.

FIG. 5 is a plan view of a lower package portion of a conventional semiconductor pressure sensor.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 upper package 2 lower package 3 semiconductor pressure-sensitive element 4 lead frame 5 pressure inlet 6 adhesive resin 7 protrusion for preventing adhesive resin from flowing in 8 groove for resin reservoir

Claims (1)

(57) [Claims] In a semiconductor pressure sensor in which a semiconductor pressure-sensitive element is enclosed in a pair of upper and lower packages, an angle between the inside of the corner of the package is made obtuse, and the adhesive resin flows into the inside of the corner of the lower package. A semiconductor pressure sensor comprising: a protrusion for preventing the occurrence of a protrusion; a groove provided in a portion of the upper package corresponding to the protrusion; and a resin reservoir groove provided on an adhesive surface of the upper and lower packages.