JPH0560636A - Semiconductor pressure sensor - Google Patents

Abstract

PURPOSE:To prevent the deformation and breakage of a wire by providing a die pad fixing protrusion at the rear face of a package cap and fixing a die pad via a die bond agent. CONSTITUTION:A die pad fixing protrusion 13 is formed to project at the rear face of a package cap 8. A die pad 4 is fixed to the front end of the protrusion via a die bond agent 14. The die pad 4 is securely hung by a die pad supporting lead 10 and the protrusion 13. Since the protrusion 13 is formed in the cap 8, the die pad 4 is not shifted and rigidly fixed. Moreover, since a resin is not used under the die pad 4, it never happens that the die pad 4 is raised by the resin to cause the deformation and breakage of a wire.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor pressure sensor,
In particular, it relates to fixing a die pad mounted on a package base.

[0002]

2. Description of the Related Art FIGS. 4 and 5 are a sectional view and a perspective view of a conventional semiconductor pressure sensor, in which 1 is a glass pedestal,
2 is a semiconductor pressure sensor chip bonded on the glass pedestal 1; 3 is a vacuum chamber formed by etching the back surface of the semiconductor pressure sensor chip 2 and bonding the glass pedestal 1 in vacuum; A die pad adhered to the pedestal 1 with an adhesive resin 5, 6 is a package base for fixing the die pad 4 with a fixing resin 7, 8 is a package cap joined to the package base 6 with a sealing resin 9, and 10 is a package for the die pad 4. A die pad support lead fixed to 6 and a lead 11 connected to the semiconductor pressure sensor chip 2 by a wire 12 and taking out the output of an electric circuit (not shown) formed on the surface of the chip to the outside.

Next, the operation will be described. When the atmospheric pressure changes, the bridge resistance (not shown) formed on the surface of the semiconductor sensor chip 2 changes due to the pressure difference with the vacuum chamber 3, and the amount of change is sent to the outside through the wire 12 and the lead 11 as a signal, Can be detected.

[0004]

Since the conventional semiconductor pressure sensor is constructed as described above, there are problems that the die pad is likely to move up and down during assembly and wire deformation and disconnection are likely to occur. .. In particular, when fixing the die pad to the package base, the die pad was sometimes lifted by the die pad fixing resin, which could lead to wire deformation.

The present invention has been made to solve the above problems, and an object thereof is to suppress the vertical movement of the die pad and prevent wire deformation and wire disconnection without using resin under the die pad. To do.

[0006]

A semiconductor pressure sensor according to the present invention is provided with a die pad fixing protrusion on the back surface of a package cap, and the die pad is fixed via a die bonding agent.

Further, the package base is also provided with a supporting projection so that the projection of the package cap is received through the die pad.

[0008]

The semiconductor pressure sensor according to the present invention can be fixed without displacement of the die pad because the die pad fixing protrusion is provided on the package cap.
Since no resin is used under the die pad, the die pad cannot be lifted by the resin, and wire deformation and disconnection do not occur.

Further, since the package base is also provided with the supporting protrusions, even if the resin goes under the die pad, the resin does not come into contact with the die pad and unnecessary stress can be prevented.

[0010]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIGS. 1 and 2, a point different from the conventional example is that a protrusion 13 for fixing the die pad 4 is provided on the back surface of the package cap 8, and the die pad 4 is attached to the tip of the protrusion 13 via a die bonding agent 14. It is fixed, and the conventional fixing resin 7 under the die pad 4 is eliminated. That is, in this structure, the die pad 4 is suspended and fixed by the die pad supporting lead 10 and the die pad fixing protrusion 13, and the resin under the die pad is not necessary.

Embodiment 2. Although the die pad fixing protrusion is provided only on the package cap 8 in the above embodiment, the die pad supporting protrusion 15 for receiving the die pad fixing protrusion 13 may be provided on the package base 6 as shown in FIG.

[0012]

As described above, according to the present invention, the die pad is suspended and fixed by the support leads and the fixing projections so that there is no resin under the die pad. It has the effect of preventing deformation and disconnection.

Further, since the package base is also provided with the protrusion, even if the resin for bonding the fixing protrusion and the die pad flows into the package base, the die pad does not come into contact with the resin and is not subjected to unnecessary stress.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor pressure sensor according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an embodiment of the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional semiconductor pressure sensor.

FIG. 5 is a perspective view showing a conventional semiconductor pressure sensor.

[Explanation of symbols]

 1 Glass Pedestal 2 Semiconductor Pressure Sensor Chip 3 Vacuum Chamber 4 Die Pad 5 Glass Pedestal Adhesive Resin 6 Package Base 8 Package Cap 9 Sealing Resin 10 Die Pad Support Lead 11 Lead 12 Wire 13 Die Pad Fixing Protrusion 14 Die Bonding Agent 15 Support Protrusion

Claims (2)

[Claims] 1. A pedestal of a semiconductor pressure sensor chip is mounted and fixed on a package base via a die pad, wherein a die pad fixing protrusion is provided on a back surface of a cap joined to the package base. ,
A semiconductor pressure characterized in that one of the opposite directions of the die pad is supported by the die pad fixing protrusion through the adhesive resin to support the die pad, and the other is supported by a die pad support lead integrally formed with the die pad, and the die pad is suspended and fixed. Sensor. 2. The semiconductor pressure sensor according to claim 1, wherein a support protrusion is provided on the package base corresponding to the die pad fixing protrusion.