JP3307276B2 - Semiconductor pressure sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pressure sensor for detecting pressure using a diaphragm.

[0002]

2. Description of the Related Art FIG. 4 is a schematic configuration diagram of a conventional semiconductor pressure sensor. Reference numeral 1 denotes a pressure sensor chip, and a strain gauge resistor 3 whose resistance value changes in accordance with a change in pressure is formed on a thin diaphragm 2. The strain gauge resistor 3 is connected to an external terminal 5 by a wire 4.

A pedestal 6 made of glass or the like is joined to the pressure sensor chip 1 by anodic bonding or the like, and supports the pressure sensor chip 1. The pedestal 6 is provided with a through-hole 7 communicating with the diaphragm 2.

A package 8 houses the pressure sensor chip 1 and the pedestal 6. The package 8 has an introduction hole 9 for introducing a measured pressure into the through hole 7.

In the semiconductor pressure sensor having the above-described structure, the pressure-receiving resistance is changed from the introduction hole 9 of the package 8 to the through-hole 7 of the pedestal 6.
Applied to the diaphragm 2 via the
Is measured in accordance with the measured pressure, and the strain is electrically detected by the strain gauge resistor 3 to measure the measured pressure.

[0006]

However, in the semiconductor pressure sensor having the above-described structure, when an external force or the like is applied to the package 8, the diaphragm 2 is distorted by the external force, so that accurate pressure measurement cannot be performed. There was a problem.

The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor pressure sensor capable of accurately measuring pressure even when an external force or the like is applied to a package. It is in.

[0008]

According to the first aspect of the present invention,
A pressure sensor chip formed on a thin diaphragm having a strain gauge resistance whose resistance value changes in accordance with a pressure change, a pedestal having a through hole communicating with the diaphragm and supporting the pressure sensor chip; A package having an introduction hole for introducing a pressure to be measured into the hole, the pedestal being fixed, and containing the pressure sensor chip and the pedestal; being electrically connected to the strain gauge resistor and being drawn out of the package; in the semiconductor pressure sensor comprising and an external terminal, mountain into the package
A plurality of convex protrusions formed in a shape are provided, and
The pedestal is supported by bonding the pedestal to the pedestal at a tip end .

According to a second aspect of the present invention, a pressure change
The resistance value of the strain gauge resistance changes with a thin diaphragm
A pressure sensor chip formed on a ram;
It has a through-hole leading to a flam and supports the pressure sensor chip.
To introduce the measured pressure into the pedestal and the through hole
The pedestal is fixed and the pressure is
A package containing the sensor chip and the pedestal;
The package is electrically connected to the strain gage resistor.
In a semiconductor pressure sensor having an external terminal drawn out to the outside , a convex projection is provided on the package.
The pedestal is supported by the projections,
Providing a side wall portion surrounding the pedestal on the package;
The part and the pedestal are not adhered, and the side wall part and the pedestal are adhered.

According to a third aspect of the present invention, a pressure change
The resistance value of the strain gauge resistance changes with a thin diaphragm
A pressure sensor chip formed on a ram;
It has a through-hole leading to a flam and supports the pressure sensor chip.
To introduce the measured pressure into the pedestal and the through hole
The pedestal is fixed and the pressure is
A package containing the sensor chip and the pedestal;
The package is electrically connected to the strain gage resistor.
In a semiconductor pressure sensor having an external terminal drawn out to the outside , a convex projection is provided on the package.
The pedestal is supported by the projections,
The protrusion is raised toward the center of the introduction hole.
And the projection is bonded to the pedestal.

[0011]

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of a semiconductor pressure sensor according to one embodiment of the present invention. Reference numeral 1 denotes a pressure sensor chip, and a strain gauge resistor 3 whose resistance value changes in accordance with a change in pressure is formed on a thin diaphragm 2. The strain gauge resistor 3 is connected to an external terminal 5 by a wire 4. The material of the external terminal 5 is copper, Kovar, stainless spring steel, 42 alloy, or the like, and it is desirable that the surface is plated with gold, silver, or the like from the viewpoint of moisture resistance and oxidation prevention.

Reference numeral 6 denotes a pedestal formed of glass or the like, which is joined to the pressure sensor chip 1 by anodic bonding or the like, and supports the pressure sensor chip 1. The pedestal 6 is provided with a through-hole 7 communicating with the diaphragm 2.

Reference numeral 8 denotes a package formed of plastic or the like, which houses the pressure sensor chip 1 and the pedestal 6. The package 8 has an introduction hole 9 for introducing a measured pressure into the through hole 7.

Reference numeral 10 denotes a convex protrusion formed by processing a portion of the package 8 on which the pedestal 6 is installed into a mountain shape.
Has been fixed. At this time, the pedestal 6 and the package 8 are bonded so that the measured pressure does not leak from between the through hole 7 and the introduction hole 9.

According to the present embodiment, the pedestal 6 is formed by the convex protrusion 10 formed by processing the package 8.
Therefore, the contact area between the pedestal 6 and the package 8 can be made smaller than that of a conventional semiconductor pressure sensor, so that the external force transmitted from the package 8 to the pedestal 6 can be reduced. In addition, when the protrusion 10 is bent, the external force can be further reduced.

FIG. 2 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention. In the present embodiment, the projection 8 is provided on the package 8 as in the semiconductor pressure sensor shown in FIG. 1, but the package 8 is processed without bonding the pedestal 6 and the projection 10 with the adhesive 11. The side wall part 12 is provided by the adhesive agent 11 and the side wall part 12 and the pedestal 6 are adhered by the adhesive 11. Thereby, the pedestal 6 is fixed to the package 8, and the through hole 7 and the introduction hole 9 are formed.
To prevent the measured pressure from leaking from between

According to the present embodiment, since the pedestal 6 is supported by the protruding projections 10, the contact area between the pedestal 6 and the package 8 can be reduced as compared with the conventional semiconductor pressure sensor. External force transmitted from the base 8 to the pedestal 6 can be reduced. Further, since the pedestal 6 and the projection 10 are not bonded, the pedestal 6 and the projection 10 are not bonded.
And the side wall 12 is bent,
The external force can be further reduced.

FIG. 3 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention. In the present embodiment, the protrusion 10 is formed by processing the portion of the package 8 to which the pedestal 6 is bonded so that the height increases as the center of the introduction hole 9 approaches.
The adhesive 11 is applied so that the thickness increases as the distance from the center of the introduction hole 9 increases, and the pedestal 6 is bonded to the package 8 such that the pedestal 6 is supported by the tip of the projection 10a.

According to the present embodiment, the convex protrusion 10a
As a result, the contact area between the pedestal 6 and the package 8 can be made smaller than that of a conventional semiconductor pressure sensor, so that the external force transmitted from the package 8 to the pedestal 6 can be reduced. Further, the external force propagating from the package 8 to the pedestal 6 can be absorbed by the elasticity of the adhesive 11. Furthermore, since the pedestal 6 and the top of the protrusion 10a formed on the package 8 are bonded so as to be in contact with each other, the thickness of the adhesive 11 can be easily controlled by adjusting the height of the protrusion 10a. .

[0021]

As described above, according to the first aspect of the present invention, there is provided a pressure sensor chip formed on a thin diaphragm with a strain gauge resistor whose resistance value changes according to a pressure change. A pedestal having a through hole communicating with the diaphragm and supporting the pressure sensor chip, a package having an introduction hole for introducing a measured pressure into the through hole, the pedestal being fixed and accommodating the pressure sensor chip and the pedestal, a strain gauge In a semiconductor pressure sensor having a resistor and an external terminal electrically connected to the outside of the package, a convex projection formed in a mountain shape is formed on the package.
A plurality of them are provided, and the tip is
Since the pedestal is supported by the above, the contact area between the pedestal and the package can be made smaller than that of the conventional semiconductor pressure sensor .
Since the external force transmitted from the package to the pedestal can be further reduced, a semiconductor pressure sensor capable of accurately measuring the pressure even when an external force or the like is applied to the package can be provided.

According to the second aspect of the present invention, the pressure change
The resistance value of the strain gauge changes according to
A pressure sensor chip formed on a diaphragm;
It has a through hole to the diaphragm and supports the pressure sensor chip.
And a guide for introducing the measured pressure into the through hole.
Pressure sensor chip with an inlet and fixed base
And a package for accommodating the pedestal
External end that is pneumatically connected and pulled out of the package
In the semiconductor pressure sensor comprising and a child package
Provide a convex projection on the base and support the pedestal with the projection
At the same time, a side wall surrounding the pedestal is
The base and the pedestal are not bonded, and the side wall and the pedestal are bonded, so that the pedestal is supported by the convex protrusion.
The contact area between the pedestal and the package is
It is possible to make it smaller than the sensor,
The pedestal and the projection are not bonded, and the
A slippage occurs between the side walls and the side wall portion is bent, so that an external force transmitted from the package to the pedestal can be further reduced.

According to the third aspect of the present invention, the pressure change
The resistance value of the strain gauge changes according to
A pressure sensor chip formed on a diaphragm;
It has a through hole to the diaphragm and supports the pressure sensor chip.
And a guide for introducing the measured pressure into the through hole.
Pressure sensor chip with an inlet and fixed base
And a package for accommodating the pedestal
External end that is pneumatically connected and pulled out of the package
In a semiconductor pressure sensor having a projection and a projection, a projection is provided on the package, and the pedestal is supported by the projection.
At the same time, the projection is raised toward the center of the introduction hole.
Part, so that the projection and the pedestal are bonded ,
Together can be reduced as compared with the conventional semiconductor pressure sensor contact area between the pedestal and the package, it is possible to absorb by the elasticity of the adhesive force propagating from Pas Kke <br/> di to pedestal . Also formed on pedestal and package
To make contact with the top of the projection
The thickness of the adhesive can be controlled by adjusting the height of the
It can be done easily.

[0024]

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor pressure sensor according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention.

FIG. 3 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention.

FIG. 4 is a schematic configuration diagram of a conventional semiconductor pressure sensor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressure sensor chip 2 Diaphragm 3 Strain gauge resistance 4 Wire 5 External terminal 6 Pedestal 7 Through hole 8 Package 9 Introducing hole 10 Protrusion 11 Adhesive 12 Side wall

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01L 9/04 H01L 29/84

Claims (3)

(57) [Claims] 1. A pressure sensor chip formed by forming a strain gauge resistor whose resistance value changes according to a pressure change on a thin diaphragm, and a through hole communicating with the diaphragm to support the pressure sensor chip. A pedestal, a package having an introduction hole for introducing a pressure to be measured into the through hole, the pedestal being fixed, and a package containing the pressure sensor chip and the pedestal; and the package being electrically connected to the strain gauge resistor. A plurality of projecting protrusions formed in the package in a mountain shape, and the pedestal is provided at a tip end of the projecting portion. A semiconductor pressure sensor, wherein the pedestal is supported by bonding . 2. The resistance value changes according to the pressure change.
Formed by forming a strain gauge resistor on a thin diaphragm
A pressure sensor chip and a through hole communicating with the diaphragm
A base having the pressure sensor chip and supporting the pressure sensor chip;
With the introduction hole for introducing the measured pressure into the through hole
The pedestal is fixed to the pressure sensor chip and the
A package for accommodating the pedestal;
Outside that is pneumatically connected and pulled out of the package
A semiconductor pressure sensor comprising:
Provide a convex protrusion on the package, and
The package supports the pedestal, and the pedestal is mounted on the package.
Is provided, and the protrusion and the pedestal are not bonded.
Semiconductors pressure sensor you characterized in that so as to bond the said base and the side wall portion Te. 3. The resistance value changes according to the pressure change.
Formed by forming a strain gauge resistor on a thin diaphragm
A pressure sensor chip and a through hole communicating with the diaphragm
A base having the pressure sensor chip and supporting the pressure sensor chip;
With the introduction hole for introducing the measured pressure into the through hole
The pedestal is fixed to the pressure sensor chip and the
A package for accommodating the pedestal;
Outside that is pneumatically connected and pulled out of the package
A semiconductor pressure sensor comprising:
Provide a convex protrusion on the package, and
While supporting the writing pedestal, move toward the center of the introduction hole.
The projections to be higher Te provided, semiconductors pressure sensor you characterized in that so as to bond the said and the protrusion base.