JPH0422694A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0422694A JPH0422694A JP2127772A JP12777290A JPH0422694A JP H0422694 A JPH0422694 A JP H0422694A JP 2127772 A JP2127772 A JP 2127772A JP 12777290 A JP12777290 A JP 12777290A JP H0422694 A JPH0422694 A JP H0422694A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- panel
- circuit board
- electric circuit
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＩＣカード、特に電気回路基板を支持する
フレームの構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a frame that supports an IC card, particularly an electric circuit board.
第３図は従来例として、電気回路基板を支持するフレー
ムに保護パネル固定のために接着シートを用いたＩＣカ
ードの構造を示す断面図である。FIG. 3 is a sectional view showing the structure of a conventional IC card in which an adhesive sheet is used to fix a protective panel to a frame supporting an electric circuit board.
図において、１は電子部品、２はこの電子部品１を搭載
した電気回路基板、３はこの電気回路基板２を支持する
フレーム、４は上記電子部品１及び基板２等を保護する
表・裏パネル、５はこのパネル４を固定する接着シート
である。In the figure, 1 is an electronic component, 2 is an electric circuit board on which the electronic component 1 is mounted, 3 is a frame that supports the electric circuit board 2, and 4 is a front and back panel that protects the electronic component 1, the board 2, etc. , 5 is an adhesive sheet for fixing this panel 4.
以上のように、パネル４を固定するために接着シート５
を用いたＩＣカードにおいて、接着シート５はパネル４
を電子部品１及びフレーム３に固定している。As mentioned above, the adhesive sheet 5 is used to fix the panel 4.
In the IC card using the adhesive sheet 5, the panel 4
is fixed to the electronic component 1 and the frame 3.
従来のＩＣカードは以上のように構成されているので、
パネル４をフレーム３に接着させる時、圧力をかけるこ
とによって、接着シート５がパネル４とフレーム３の間
から外へはみ出してくるために外観が悪くなるので、は
み出し分を取り除く作業を行う必要があり、また、上記
作業時にフレーム３及びパネル４に傷が付き易い等の問
題点があった。Conventional IC cards are configured as described above, so
When bonding the panel 4 to the frame 3, applying pressure causes the adhesive sheet 5 to protrude from between the panel 4 and the frame 3, resulting in a poor appearance, so it is necessary to remove the protruding portion. Moreover, there were other problems such as the frame 3 and panel 4 being easily damaged during the above-mentioned work.
この発明は上記のような問題点を解消するためになされ
たもので、余分な接着剤のはみ出しをなくし、作業効率
及び外観の向上を図ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to eliminate excess adhesive from protruding and improve work efficiency and appearance.
この発明に係るＩＣカードは、電子部品を搭載した電気
回路基板及び上記電気回路基板を支持するフレームを覆
うパネルの固定に接着シートを用いたＩＣカードにおい
て、上記フレームのパネル貼付面の外周部に凹溝に設け
たものである。An IC card according to the present invention is an IC card in which an adhesive sheet is used to fix a panel covering an electric circuit board on which electronic components are mounted and a panel that covers a frame that supports the electric circuit board. It is provided in a groove.
この発明におけるフレームの凹溝は、接着シートを介し
てパネルをフレームに接着する際の余分な接着剤が流れ
込むことにより、接着剤のはみ出しを防止する。The concave groove of the frame in this invention prevents the adhesive from extruding by allowing excess adhesive to flow in when the panel is bonded to the frame via the adhesive sheet.
以下、この発明の一実施礼を図について説明する。第１
図、第２図において、１〜５は上記従来例と同一部品を
示しており、６はフレーム３のパネル４との貼付面７外
周部に設けられた凹溝である。Hereinafter, one embodiment of this invention will be explained with reference to the drawings. 1st
In the drawings and FIG. 2, 1 to 5 indicate the same parts as those in the conventional example, and 6 is a groove provided on the outer circumference of the surface 7 of the frame 3 that is attached to the panel 4.
以上のようにフレーム３の周りに凹溝６をめぐらすこと
により、接着シートの余分な接着剤がこの凹溝に流れ込
むようになり、外へはみ出すことを防止する。By arranging the groove 6 around the frame 3 as described above, excess adhesive from the adhesive sheet flows into the groove and is prevented from spilling out.
以上のように二゛の発明によれば、フレームに凹溝を設
けるという簡単な構成で、余分な接着剤のはみ出しを防
げるため、作業効率が向上し、また、外観が良くなる効
果がある。As described above, according to the second invention, the simple structure of providing a groove in the frame can prevent excess adhesive from spilling out, thereby improving work efficiency and improving the appearance.
第１図はこの発明の一実施例によるＩＣカードの構造を
示す断面図、第２図はそのフレームのみの斜視図、第３
図は従来例によるＩＣカードの構造を示す断面図である
。
図中、１は電子部品、２は電気回路基板、３はフレーム
、４はパネル、５は接着シート、６は凹溝、７は貼付面
である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a sectional view showing the structure of an IC card according to an embodiment of the present invention, FIG. 2 is a perspective view of only its frame, and FIG.
The figure is a sectional view showing the structure of a conventional IC card. In the figure, 1 is an electronic component, 2 is an electric circuit board, 3 is a frame, 4 is a panel, 5 is an adhesive sheet, 6 is a groove, and 7 is an attachment surface. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
板を支持するフレームと、上記電気回路基板を覆うパネ
ルを有し、このパネルを接着シートを介して上記フレー
ム及び電子部品に貼付して支持するものにおいて、上記
フレームのパネル貼付面外周部に凹溝を設けたことを特
徴とするＩＣカード。It has an electric circuit board on which electronic components are mounted, a frame that supports the electric circuit board, and a panel that covers the electric circuit board, and this panel is attached to the frame and the electronic component via an adhesive sheet to support it. An IC card, characterized in that a concave groove is provided on the outer periphery of the panel attachment surface of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127772A JPH0422694A (en) | 1990-05-17 | 1990-05-17 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2127772A JPH0422694A (en) | 1990-05-17 | 1990-05-17 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0422694A true JPH0422694A (en) | 1992-01-27 |
Family
ID=14968316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2127772A Pending JPH0422694A (en) | 1990-05-17 | 1990-05-17 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422694A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790525B2 (en) | 2000-09-28 | 2004-09-14 | Dai Nippon Printing Co., Ltd. | Decorative material |
-
1990
- 1990-05-17 JP JP2127772A patent/JPH0422694A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790525B2 (en) | 2000-09-28 | 2004-09-14 | Dai Nippon Printing Co., Ltd. | Decorative material |
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