JPH0412677Y2 - - Google Patents
Info
- Publication number
- JPH0412677Y2 JPH0412677Y2 JP1986028334U JP2833486U JPH0412677Y2 JP H0412677 Y2 JPH0412677 Y2 JP H0412677Y2 JP 1986028334 U JP1986028334 U JP 1986028334U JP 2833486 U JP2833486 U JP 2833486U JP H0412677 Y2 JPH0412677 Y2 JP H0412677Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal plate
- case
- heat dissipation
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028334U JPH0412677Y2 (US20020095090A1-20020718-M00002.png) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028334U JPH0412677Y2 (US20020095090A1-20020718-M00002.png) | 1986-02-28 | 1986-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140744U JPS62140744U (US20020095090A1-20020718-M00002.png) | 1987-09-05 |
| JPH0412677Y2 true JPH0412677Y2 (US20020095090A1-20020718-M00002.png) | 1992-03-26 |
Family
ID=30831194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986028334U Expired JPH0412677Y2 (US20020095090A1-20020718-M00002.png) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412677Y2 (US20020095090A1-20020718-M00002.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018128005A1 (ja) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | コンデンサ、コンデンサユニット、コンデンサの製造方法およびコンデンサユニットの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158460A (en) * | 1980-05-12 | 1981-12-07 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
-
1986
- 1986-02-28 JP JP1986028334U patent/JPH0412677Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158460A (en) * | 1980-05-12 | 1981-12-07 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62140744U (US20020095090A1-20020718-M00002.png) | 1987-09-05 |
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