JPH04103009U - モノリシツクマイクロ波ｉｃ増幅回路 - Google Patents
モノリシツクマイクロ波ｉｃ増幅回路Info
- Publication number
- JPH04103009U JPH04103009U JP499991U JP499991U JPH04103009U JP H04103009 U JPH04103009 U JP H04103009U JP 499991 U JP499991 U JP 499991U JP 499991 U JP499991 U JP 499991U JP H04103009 U JPH04103009 U JP H04103009U
- Authority
- JP
- Japan
- Prior art keywords
- amplifier circuit
- monolithic microwave
- transmission line
- microwave
- amplifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical group [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 230000003321 amplification Effects 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP499991U JPH04103009U (ja) | 1991-02-08 | 1991-02-08 | モノリシツクマイクロ波ｉｃ増幅回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP499991U JPH04103009U (ja) | 1991-02-08 | 1991-02-08 | モノリシツクマイクロ波ｉｃ増幅回路 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04103009U true JPH04103009U (ja) | 1992-09-04 |
Family
ID=31735216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP499991U Pending JPH04103009U (ja) | 1991-02-08 | 1991-02-08 | モノリシツクマイクロ波ｉｃ増幅回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04103009U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5200541B2 (ja) * | 2005-10-24 | 2013-06-05 | 日本電気株式会社 | 分布型増幅器、集積回路および送受信器 |
-
1991
- 1991-02-08 JP JP499991U patent/JPH04103009U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5200541B2 (ja) * | 2005-10-24 | 2013-06-05 | 日本電気株式会社 | 分布型増幅器、集積回路および送受信器 |
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