JPH0397940U - - Google Patents

Info

Publication number
JPH0397940U
JPH0397940U JP623090U JP623090U JPH0397940U JP H0397940 U JPH0397940 U JP H0397940U JP 623090 U JP623090 U JP 623090U JP 623090 U JP623090 U JP 623090U JP H0397940 U JPH0397940 U JP H0397940U
Authority
JP
Japan
Prior art keywords
lead
width
package
lsi package
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP623090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP623090U priority Critical patent/JPH0397940U/ja
Publication of JPH0397940U publication Critical patent/JPH0397940U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａとｂは本考案の一実施例を要部斜視図
、第２図は本考案の一変形例を示す要部斜視図、
第３図は従来のパツケージの一構造例を示す要部
斜視図である。 図において、１と１１はリード、１ａと１１ａ
はリードの半田接合部、１ｂと１１ｂはリードの
根元部分、１０と３０はパツケージ、１８はパツ
ド、２０はプリント板、Ｈはパツドの幅、Ｇはパ
ツド間の間隙、Ｐはリード間隔、ＷＨはリードの
根元部分の幅、ＷＳはリードの半田接合部の幅、
をそれぞれ示す。 Figures 1a and b are perspective views of essential parts of an embodiment of the present invention, Figure 2 is a perspective view of essential parts showing a modification of the invention;
FIG. 3 is a perspective view of essential parts showing an example of the structure of a conventional package. In the figure, 1 and 11 are leads, 1a and 11a
is the solder joint of the lead, 1b and 11b are the base of the lead, 10 and 30 are the package, 18 is the pad, 20 is the printed board, H is the width of the pad, G is the gap between the pads, P is the lead spacing, WH is the width of the base of the lead, WS is the width of the solder joint of the lead,
are shown respectively.

Claims (1)

【実用新案登録請求の範囲】 側面部分から平面的、かつ並列にリード１を取
り出したＬＳＩパツケージ１０の構成において、 プリント板２０のパツド１８対応に設けられた
前記リード１の各半田接合部１ａの幅ＷＳを、当
該リード１が前記パツケージ１０によつて保持さ
れている根元部分１ｂの幅ＷＨよりも狭くしたこ
とを特徴とするＬＳＩパツケージ。[Claims for Utility Model Registration] In the structure of the LSI package 10 in which the leads 1 are taken out planarly and in parallel from the side portion, each solder joint portion 1a of the lead 1 provided corresponding to the pad 18 of the printed circuit board 20. An LSI package characterized in that a width WS is narrower than a width WH of a root portion 1b of the lead 1 held by the package 10.
JP623090U 1990-01-25 1990-01-25 Pending JPH0397940U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP623090U JPH0397940U (en) 1990-01-25 1990-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP623090U JPH0397940U (en) 1990-01-25 1990-01-25

Publications (1)

Publication Number Publication Date
JPH0397940U true JPH0397940U (en) 1991-10-09

Family

ID=31509908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP623090U Pending JPH0397940U (en) 1990-01-25 1990-01-25

Country Status (1)

Country Link
JP (1) JPH0397940U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006003738A (en) * 2004-06-18 2006-01-05 Sony Corp Rear projector
WO2017154199A1 (en) * 2016-03-11 2017-09-14 新電元工業株式会社 Semiconductor device and lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559563B2 (en) * 1972-03-07 1980-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559563B2 (en) * 1972-03-07 1980-03-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006003738A (en) * 2004-06-18 2006-01-05 Sony Corp Rear projector
JP4622332B2 (en) * 2004-06-18 2011-02-02 ソニー株式会社 Rear projector
WO2017154199A1 (en) * 2016-03-11 2017-09-14 新電元工業株式会社 Semiconductor device and lead frame
WO2017154232A1 (en) * 2016-03-11 2017-09-14 新電元工業株式会社 Semiconductor device and lead frame

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