JPH0397815A - 接合用インサート材 - Google Patents

接合用インサート材

Info

Publication number
JPH0397815A
JPH0397815A JP23409989A JP23409989A JPH0397815A JP H0397815 A JPH0397815 A JP H0397815A JP 23409989 A JP23409989 A JP 23409989A JP 23409989 A JP23409989 A JP 23409989A JP H0397815 A JPH0397815 A JP H0397815A
Authority
JP
Japan
Prior art keywords
insert material
joining
copper
contg
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23409989A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525932B2 (enrdf_load_stackoverflow
Inventor
Tsuguo Honda
本田　嗣男
Shizuo Mukai
迎　静雄
Kazumasa Nishio
一政 西尾
Hirohisa Masumoto
益本　広久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuroki Kogyosho Co Ltd
Original Assignee
Kuroki Kogyosho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuroki Kogyosho Co Ltd filed Critical Kuroki Kogyosho Co Ltd
Priority to JP23409989A priority Critical patent/JPH0397815A/ja
Publication of JPH0397815A publication Critical patent/JPH0397815A/ja
Publication of JPH0525932B2 publication Critical patent/JPH0525932B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
JP23409989A 1989-09-08 1989-09-08 接合用インサート材 Granted JPH0397815A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23409989A JPH0397815A (ja) 1989-09-08 1989-09-08 接合用インサート材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23409989A JPH0397815A (ja) 1989-09-08 1989-09-08 接合用インサート材

Publications (2)

Publication Number Publication Date
JPH0397815A true JPH0397815A (ja) 1991-04-23
JPH0525932B2 JPH0525932B2 (enrdf_load_stackoverflow) 1993-04-14

Family

ID=16965609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23409989A Granted JPH0397815A (ja) 1989-09-08 1989-09-08 接合用インサート材

Country Status (1)

Country Link
JP (1) JPH0397815A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107552945A (zh) * 2017-09-20 2018-01-09 西安理工大学 一种复杂形状铝青铜与不锈钢的连接方法
CN107738030A (zh) * 2017-09-20 2018-02-27 西安理工大学 一种铝青铜与不锈钢的低温连接方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014156433A1 (ja) * 2013-03-25 2014-10-02 シャープ株式会社 金属空気電池

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128557A (ja) * 1974-09-04 1976-03-10 Honda Motor Co Ltd Aruminiumukeikeigokinbuzaitohaganetonokoshitsuishukinzokubuzai no setsugohoho
JPS5231824A (en) * 1975-09-05 1977-03-10 Eisai Co Ltd Boring of membranous material comprising agar and other substances
JPS53102840A (en) * 1977-02-21 1978-09-07 Mitsubishi Heavy Ind Ltd Preliminarily treating method for diffusion welding of stainless steel, aluminum or aluminum alloy
JPS59110485A (ja) * 1982-12-15 1984-06-26 Sumitomo Metal Mining Co Ltd モリブデン基複合板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128557A (ja) * 1974-09-04 1976-03-10 Honda Motor Co Ltd Aruminiumukeikeigokinbuzaitohaganetonokoshitsuishukinzokubuzai no setsugohoho
JPS5231824A (en) * 1975-09-05 1977-03-10 Eisai Co Ltd Boring of membranous material comprising agar and other substances
JPS53102840A (en) * 1977-02-21 1978-09-07 Mitsubishi Heavy Ind Ltd Preliminarily treating method for diffusion welding of stainless steel, aluminum or aluminum alloy
JPS59110485A (ja) * 1982-12-15 1984-06-26 Sumitomo Metal Mining Co Ltd モリブデン基複合板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107552945A (zh) * 2017-09-20 2018-01-09 西安理工大学 一种复杂形状铝青铜与不锈钢的连接方法
CN107738030A (zh) * 2017-09-20 2018-02-27 西安理工大学 一种铝青铜与不锈钢的低温连接方法
CN107738030B (zh) * 2017-09-20 2019-03-26 西安理工大学 一种铝青铜与不锈钢的低温连接方法

Also Published As

Publication number Publication date
JPH0525932B2 (enrdf_load_stackoverflow) 1993-04-14

Similar Documents

Publication Publication Date Title
US6722002B1 (en) Method of producing Ti brazing strips or foils
JP6753869B2 (ja) 複合材料を製作するための方法
JPS63220987A (ja) アルミニウム及びアルミナセラミツクスの拡散接合法
CN107695559A (zh) 一种银基复合钎料箔材及其制备方法
MXPA02008153A (es) Metodo para la fabricacion de una union entre cobre y acero inoxidable.
JPH0397815A (ja) 接合用インサート材
JP3197835B2 (ja) ベリリウム、銅合金およびステンレス鋼の複合接合体および複合接合方法
JPH03115178A (ja) アルミニウムまたはアルミナセラミックスの拡散接合法
JP2002294440A (ja) スパッタリング用ターゲットとその製造方法
JP2001259885A (ja) はんだ合金および金属化プラスチックフィルムコンデンサ端面電極
JPS58181806A (ja) 銀・銅基二層焼結接点の製造方法
JPS62199288A (ja) ろう材
JPH02217372A (ja) 窒化ケイ素と金属の接合方法
US3079676A (en) Composite article with tungsten and copper parts
JPS6030543A (ja) 複合金属線の製造方法
JPS63169348A (ja) セラミツク接合用アモルフアス合金箔
JPH0543071Y2 (enrdf_load_stackoverflow)
JPS59110492A (ja) 浸炭同時ろう付用ろう材層体及びその製造方法
JPH03284869A (ja) リードフレーム用クラッド材料
JPH08318381A (ja) 金属材料の接合方法
JPH01172579A (ja) めっき性の良好な鉄及び鉄合金
JPH05177363A (ja) 銅クラッド鋼材の製造方法
JPH03291164A (ja) 超弾性合金のろう付け方法
JPH0148222B2 (enrdf_load_stackoverflow)
JP2003191080A (ja) 異種金属接合方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090414

Year of fee payment: 16

LAPS Cancellation because of no payment of annual fees