JPH0397815A - Insert material for joining - Google Patents
Insert material for joiningInfo
- Publication number
- JPH0397815A JPH0397815A JP23409989A JP23409989A JPH0397815A JP H0397815 A JPH0397815 A JP H0397815A JP 23409989 A JP23409989 A JP 23409989A JP 23409989 A JP23409989 A JP 23409989A JP H0397815 A JPH0397815 A JP H0397815A
- Authority
- JP
- Japan
- Prior art keywords
- insert material
- joining
- copper
- contg
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 25
- 238000005304 joining Methods 0.000 title abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract 3
- 239000004332 silver Substances 0.000 claims abstract 3
- 239000012535 impurity Substances 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 7
- 239000007790 solid phase Substances 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000005674 electromagnetic induction Effects 0.000 abstract description 2
- 239000011261 inert gas Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、固相接合用インサート材に関し、特に旧を含
有する銅合金の接合に際して優れた接合性能を発揮する
ものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an insert material for solid-phase bonding, and particularly exhibits excellent bonding performance when bonding copper alloys containing aluminum.
〈従来の技術〉
固相接合は、それぞれ異なる性質を有する材料の組み合
わせによる複合機能製品製造手段として広く利用されて
いる。その中で、接合が困難な物同士の接合にあっては
インサート材を使用することで困難を克服することが試
みられている。ＡＩを含有する銅合金と鋼材との接合に
於いては、鋼側の接合部近傍にＡＩに冨んだ拡散層が形
成されて接合を困難にする。この拡散層の形戒を制御し
て最も高い接合強度を得る方法としてインサート材とし
て純銅を用いる事が知られている。<Prior Art> Solid phase bonding is widely used as a means for manufacturing multifunctional products by combining materials each having different properties. Among these, attempts have been made to overcome the difficulties by using insert materials when joining objects that are difficult to join together. When joining a copper alloy containing AI to a steel material, an AI-rich diffusion layer is formed near the joint on the steel side, making joining difficult. It is known to control the shape of this diffusion layer to obtain the highest bonding strength by using pure copper as the insert material.
なお、固相接合とは別の接合技術として比較的低い温度
のろう付も行われているが、得られる′接合強度は固相
接合に比べてはるかに低い。Note that brazing at a relatively low temperature is also used as a joining technique other than solid-state joining, but the resulting joining strength is much lower than that of solid-state joining.
く発明が解決しようとする課題〉
本発明は上記純銅を用いた場合に於いてみられる欠点即
ち、その場合の接合部材は、インサート材境界部で破断
するという欠点を解消し、より接合強度が大なるインサ
ート材を提供することを目的とするものである。Problems to be Solved by the Invention The present invention solves the drawback of using pure copper as described above, that is, the joining member breaks at the boundary between the insert materials, and improves the joining strength. The purpose is to provide a large insert material.
く課題を解決する為の手段〉
上記本発明の目的は、Ａｇｌ．０〜７．０重量％、残部
は実質的にＣｕより成るインサート材を用いることによ
り達或できる。ここで＾ｇを１．０〜７．０重量％用い
る理由は、後述する実施例からも明らかな如く、ＡｇＯ
量が１．０重量％未満では十分な接合強度が得られず、
一方ＡｇＯ量が７．０３１ｔ％を越えると純銅を用いた
場合よりも低い接合強度しか得られないからである。Means for Solving the Problems> The object of the present invention is to achieve Agl. This can be achieved by using an insert material of 0 to 7.0% by weight, the remainder consisting essentially of Cu. The reason for using 1.0 to 7.0% by weight of ^g here is that AgO
If the amount is less than 1.0% by weight, sufficient bonding strength cannot be obtained,
On the other hand, if the amount of AgO exceeds 7.031 t%, only a lower bonding strength can be obtained than when pure copper is used.
く作用〉
本発明では、第１図に示す様に、容器１内に、接合しよ
うとする試料２，２′間にインサート材３を挟んで、試
料２，２′同士が密着する程度の圧力をかけ、電ｖｌ３
導コイル４等により、接合圧力や組み合わせる試料にも
よるが、７７０″Ｃ以上の温度に加熱して接合する。In the present invention, as shown in FIG. 1, an insert material 3 is sandwiched between the samples 2 and 2' to be bonded in a container 1, and pressure is applied to the extent that the samples 2 and 2' are brought into close contact with each other. Apply electricity vl3
Although it depends on the bonding pressure and the samples to be combined, the conductive coil 4 and the like are heated to a temperature of 770''C or more to bond.
接合雰囲気は真空あるいは不活性ガス雰囲気が好ましく
、加熱方法は第１図に示した電磁誘導方式以外に直接通
電や電気炉等の輻射加熱でもよい。The bonding atmosphere is preferably a vacuum or an inert gas atmosphere, and the heating method may be direct energization or radiation heating using an electric furnace, in addition to the electromagnetic induction method shown in FIG.
第１図中５は熱電対を示す。5 in FIG. 1 indicates a thermocouple.
〈実施例〉 以下本発明の実施例を比較例と共に示す。<Example> Examples of the present invention will be shown below along with comparative examples.
夫路拠上
この実施例１は、ＡＩ青銅とＳＯＳ３０４オーステナイ
ト系ステンレス鋼を各種インサート材で接合したもので
ある。In Example 1, AI bronze and SOS304 austenitic stainless steel are bonded using various insert materials.
即ち、それぞれ１２凪φのＡＩ青銅とＳＵＳ３０４オー
ステナイト系ステンレス鋼間に、下記第１表に示す組成
で厚さ１００ｔｌｍの各種インサート材を挟み、７１０
”Ｃ〜９６０゜Ｃの温度範囲で第ｌ図に示す装置を用い
て接合し２た。That is, various insert materials with a thickness of 100 tlm with the composition shown in Table 1 below are sandwiched between AI bronze and SUS304 austenitic stainless steel, each having a diameter of 12 dia.
Bonding was carried out using the apparatus shown in FIG.
第１表
上記第１表中Ｎαｌ．２，７．８は比較例であり、その
中でｉ々α８は市販のろう材である。Table 1 Nαl. in Table 1 above. Nos. 2 and 7.8 are comparative examples, and among them, i2α8 is a commercially available brazing material.
この実施例１による接合強度を第２図に示す。The bonding strength according to Example 1 is shown in FIG.
この第２図から判る如く、接合強度はインサート材中の
ＡｇＯ量が０．６７重量％では純銅の場合よりも低いが
、ｌ，５５重量％では純銅のそれを大きく上回り、Ａｇ
３．３５重量％のＮａ４が最も接合強度が大となってい
る。その後インサート材中のＡｇＯ量が増加するに従っ
て少しずつ接合強度が低下しＡｇ７．６１重量％では純
銅のそれまりもや一低下している。As can be seen from Fig. 2, the bonding strength is lower than that of pure copper when the amount of AgO in the insert material is 0.67% by weight, but it greatly exceeds that of pure copper when the amount of AgO in the insert material is 55% by weight.
3.35% by weight of Na4 has the highest bonding strength. Thereafter, as the amount of AgO in the insert material increases, the bonding strength gradually decreases, and at 7.61% by weight of Ag, it is even lower than that of pure copper.
夫魂−鮭−２−
この実施例２は、接合すべき組み合わせと用いた装置は
実施例１と同しで、第１表中のｋｌ，４．６のインサー
ト材の厚さを変えて接合したものであり、その結果を第
３図に示す。In this Example 2, the combination to be joined and the equipment used were the same as in Example 1, but the thickness of the insert material of kl, 4.6 in Table 1 was changed. The results are shown in Figure 3.
この第３図に示す結果からＡｇ３．３５重量％の場合は
、インサート材の厚さの異なる全範囲で純銅よりも優れ
た接合強度を有し２ていることが判る。又第２図に示す
結果では純銅よりもや覧劣っていたＡｇ７．６１重量％
の場合もインサート材の厚さによっては純銅を使用した
場合よりも接合強度が増加することもあることが判る。From the results shown in FIG. 3, it can be seen that in the case of 3.35% by weight of Ag, the bonding strength was superior to that of pure copper over the entire range of different thicknesses of the insert material. Also, the results shown in Figure 2 show that Ag7.61% by weight was slightly inferior in appearance to pure copper.
It can also be seen that, depending on the thickness of the insert material, the bonding strength can be increased compared to when pure copper is used.
〈発明の効果〉
以上述べて来た如く、本発明によればＡ１を含む銅合金
と幻との固相接合に於いて、従来最も接合強度が高いと
されていた純銅のそれよりも優れた接合強度が得られ、
ＡｇＯ量も少なく経済性にも冨むものである。<Effects of the Invention> As described above, according to the present invention, in solid-phase bonding between a copper alloy containing A1 and a wire, the bonding strength is superior to that of pure copper, which was conventionally considered to have the highest bonding strength. Bonding strength is obtained,
It also has a small amount of AgO and is highly economical.
第１図は本発明インサート材を用いる接合装置の一例を
示す概要図、第２図は本発明実施例１の結果を示すグラ
フ、第３図は本発明実施例２の桔果を示すグラフ。
図 中 Ｉ ：容 器
２． ２’ ：試料
３：インサート千オ
４：電磁講導コイル
５：熱電対FIG. 1 is a schematic diagram showing an example of a joining device using the insert material of the present invention, FIG. 2 is a graph showing the results of Example 1 of the present invention, and FIG. 3 is a graph showing the results of Example 2 of the present invention. I in the diagram: Container 2. 2': Sample 3: Insert 4: Electromagnetic conductor coil 5: Thermocouple
Claims (1)
物から成ることを特徴とする接合用インサート材。1. A bonding insert material characterized by comprising 1.0 to 7.0% by weight of silver, with the remainder consisting of copper and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23409989A JPH0397815A (en) | 1989-09-08 | 1989-09-08 | Insert material for joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23409989A JPH0397815A (en) | 1989-09-08 | 1989-09-08 | Insert material for joining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0397815A true JPH0397815A (en) | 1991-04-23 |
| JPH0525932B2 JPH0525932B2 (en) | 1993-04-14 |
Family
ID=16965609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23409989A Granted JPH0397815A (en) | 1989-09-08 | 1989-09-08 | Insert material for joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397815A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107552945A (en) * | 2017-09-20 | 2018-01-09 | 西安理工大学 | A kind of connection method of complicated shape aluminium bronze and stainless steel |
| CN107738030A (en) * | 2017-09-20 | 2018-02-27 | 西安理工大学 | A kind of law temperature joining method of aluminium bronze and stainless steel |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014156433A1 (en) * | 2013-03-25 | 2014-10-02 | シャープ株式会社 | Metal-air cell |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128557A (en) * | 1974-09-04 | 1976-03-10 | Honda Motor Co Ltd | ARUMINIUMUKEIKEIGOKINBUZAITOHAGANETONOKOSHITSUISHUKINZOKUBUZAI NO SET SUGOHOHO |
| JPS5231824A (en) * | 1975-09-05 | 1977-03-10 | Eisai Co Ltd | Boring of membranous material comprising agar and other substances |
| JPS53102840A (en) * | 1977-02-21 | 1978-09-07 | Mitsubishi Heavy Ind Ltd | Preliminarily treating method for diffusion welding of stainless steel, aluminum or aluminum alloy |
| JPS59110485A (en) * | 1982-12-15 | 1984-06-26 | Sumitomo Metal Mining Co Ltd | Production of molybdenum composite plate |
-
1989
- 1989-09-08 JP JP23409989A patent/JPH0397815A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128557A (en) * | 1974-09-04 | 1976-03-10 | Honda Motor Co Ltd | ARUMINIUMUKEIKEIGOKINBUZAITOHAGANETONOKOSHITSUISHUKINZOKUBUZAI NO SET SUGOHOHO |
| JPS5231824A (en) * | 1975-09-05 | 1977-03-10 | Eisai Co Ltd | Boring of membranous material comprising agar and other substances |
| JPS53102840A (en) * | 1977-02-21 | 1978-09-07 | Mitsubishi Heavy Ind Ltd | Preliminarily treating method for diffusion welding of stainless steel, aluminum or aluminum alloy |
| JPS59110485A (en) * | 1982-12-15 | 1984-06-26 | Sumitomo Metal Mining Co Ltd | Production of molybdenum composite plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107552945A (en) * | 2017-09-20 | 2018-01-09 | 西安理工大学 | A kind of connection method of complicated shape aluminium bronze and stainless steel |
| CN107738030A (en) * | 2017-09-20 | 2018-02-27 | 西安理工大学 | A kind of law temperature joining method of aluminium bronze and stainless steel |
| CN107738030B (en) * | 2017-09-20 | 2019-03-26 | 西安理工大学 | A kind of law temperature joining method of aluminium bronze and stainless steel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525932B2 (en) | 1993-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6722002B1 (en) | Method of producing Ti brazing strips or foils | |
| JP6753869B2 (en) | How to make composites | |
| JPH0217509B2 (en) | ||
| CN107695559A (en) | A kind of silver-based composite soldering foil and preparation method thereof | |
| MXPA02008153A (en) | Method for making a joint between copper and stainless steel. | |
| JPH0397815A (en) | Insert material for joining | |
| JP3197835B2 (en) | Composite joint of beryllium, copper alloy and stainless steel and composite joint method | |
| JP2001259885A (en) | Solder alloy and metallized plastic film capacitor end face electrode | |
| JPH03115178A (en) | Method for joining aluminum or aluminum ceramics by diffusion | |
| JPS58181806A (en) | Manufacture of silver copper base two layer sintering contact point | |
| JP2002294440A (en) | Sputtering target and manufacturing method | |
| JPH02217372A (en) | Method for jointing silicon nitride and metal | |
| US3079676A (en) | Composite article with tungsten and copper parts | |
| JPS6042283A (en) | Method of bonding oxide ceramics and active metal | |
| JPS62199288A (en) | Brazing filler metal | |
| 于治水 et al. | Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer | |
| JPS63169348A (en) | Amorphous alloy foil for jointing ceramics | |
| JPH0543071Y2 (en) | ||
| JPS6030543A (en) | Manufacture of composite metallic wire | |
| JPH0543070Y2 (en) | ||
| JPH08318381A (en) | Joining method of metal material | |
| JPH05177363A (en) | Production of copper clad steel products | |
| JPH03291164A (en) | Brazing method for superelastic alloy | |
| JPH0148222B2 (en) | ||
| JP2003191080A (en) | Method of joining different kinds of metals |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090414 Year of fee payment: 16 |
|
| LAPS | Cancellation because of no payment of annual fees |