JPH039618B2 - - Google Patents

Info

Publication number
JPH039618B2
JPH039618B2 JP60018360A JP1836085A JPH039618B2 JP H039618 B2 JPH039618 B2 JP H039618B2 JP 60018360 A JP60018360 A JP 60018360A JP 1836085 A JP1836085 A JP 1836085A JP H039618 B2 JPH039618 B2 JP H039618B2
Authority
JP
Japan
Prior art keywords
stitch
side conductor
bonding
wire bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60018360A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177735A (ja
Inventor
Masakazu Nakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60018360A priority Critical patent/JPS61177735A/ja
Publication of JPS61177735A publication Critical patent/JPS61177735A/ja
Publication of JPH039618B2 publication Critical patent/JPH039618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60018360A 1985-01-31 1985-01-31 混成集積回路用ワイヤボンデイング装置 Granted JPS61177735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60018360A JPS61177735A (ja) 1985-01-31 1985-01-31 混成集積回路用ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60018360A JPS61177735A (ja) 1985-01-31 1985-01-31 混成集積回路用ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61177735A JPS61177735A (ja) 1986-08-09
JPH039618B2 true JPH039618B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-08

Family

ID=11969524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60018360A Granted JPS61177735A (ja) 1985-01-31 1985-01-31 混成集積回路用ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61177735A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251065A (ja) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp セラミック配線基板およびその製造方法

Also Published As

Publication number Publication date
JPS61177735A (ja) 1986-08-09

Similar Documents

Publication Publication Date Title
JPS6353959A (ja) 半導体装置用リ−ドフレ−ム及びその製造方法
JPH0636852A (ja) プリント配線板への端子の接続法
JPH039618B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR940027134A (ko) 반도체집적회로장치의 제조방법
JPS61280626A (ja) ワイヤボンデイング方法
JP2003086621A (ja) 半導体装置およびその製造方法
JP2777035B2 (ja) プリント配線板への端子の接続方法
JPH09223767A (ja) リードフレーム
JP2846095B2 (ja) 半導体装置の製造方法
JPH0451056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6332269B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2000228457A (ja) 半導体装置、その製造方法及びテープキャリア
KR0147156B1 (ko) 필름 온 칩 패키지와 그 제조방법
JP2542675B2 (ja) 半導体装置
JPH10199913A (ja) ワイヤボンディング方法
JPH03241847A (ja) 半導体装置の実装構造
JPS60226155A (ja) フイルムキヤリアの製造方法
JP2001291734A (ja) ワイヤボンディング方法およびワイヤボンディング装置
JP3445687B2 (ja) 半導体チップの実装方法
JPH04146636A (ja) フィルムキャリヤテープのインナーリードボンディング方法
JPS6269524A (ja) 半導体装置の製造方法
JPH04180640A (ja) 半導体素子の配線方法
JPH01215047A (ja) 半導体チップのバンプ形成方法
JPS646041U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2003309353A (ja) 電子回路ユニット