JPH039618B2 - - Google Patents
Info
- Publication number
- JPH039618B2 JPH039618B2 JP60018360A JP1836085A JPH039618B2 JP H039618 B2 JPH039618 B2 JP H039618B2 JP 60018360 A JP60018360 A JP 60018360A JP 1836085 A JP1836085 A JP 1836085A JP H039618 B2 JPH039618 B2 JP H039618B2
- Authority
- JP
- Japan
- Prior art keywords
- stitch
- side conductor
- bonding
- wire bonding
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 26
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、混成集積回路（ハイブリツド回
路）用ワイヤボンデイング装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding device for a hybrid integrated circuit (hybrid circuit).
第４図は一般に使用されている従来のワイヤボ
ンデイング装置のキヤピラリ付近を示す。１はパ
ターン認識用TVカメラ、２はワイヤボンデイン
グアーム、３はキヤピラリ、４はハイブリツド
IC基板、５はICチツプ、６はステツチ側導体で
あり、該導体部分はカマボコ状になつている。ま
た、７はワイヤボンデイングすべき試料を送るた
めの送り台である。そして上記１，２，３により
ワイヤボンデイングを行なうボンデイング手段２
０を構成している。
FIG. 4 shows the vicinity of the capillary of a conventional wire bonding device that is commonly used. 1 is a TV camera for pattern recognition, 2 is a wire bonding arm, 3 is a capillary, and 4 is a hybrid
In the IC board, 5 is an IC chip, 6 is a stitch side conductor, and the conductor portion is in a semicylindrical shape. Further, 7 is a feed table for sending a sample to be wire bonded. Bonding means 2 performs wire bonding according to 1, 2, and 3 above.
It constitutes 0.
従来の装置は以上のように構成されているの
で、混成集積回路のステツチ側導体のようにカマ
ボコ状になつていて平坦でない部分にボンデイン
グする場合、ステツチはがれ等によりボンデイン
グの密着性が著しく低下するという問題点があつ
た。
Conventional devices are constructed as described above, so when bonding to a part that is uneven and uneven, such as the stitched conductor of a hybrid integrated circuit, the adhesion of the bonding is significantly reduced due to stitches peeling off, etc. There was a problem.
この発明は上記のような問題点を解消するため
になされたもので、混成集積回路のボンデイング
において、高いボンデイング強度が得られる混成
集積回路用ワイヤボンデイング装置を得ることを
目的とする。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wire bonding device for hybrid integrated circuits that can provide high bonding strength in bonding hybrid integrated circuits.
この発明に係る混成集積回路用ワイヤボンデイ
ング装置は、ワイヤボンデイング前に、ステツチ
側導体にプレス又はプレスと超音波印加とを行な
うステツチ側導体平坦化手段を設けたものであ
る。
The wire bonding apparatus for a hybrid integrated circuit according to the present invention is provided with stitch-side conductor flattening means for pressing or pressing and applying ultrasonic waves to the stitch-side conductor before wire bonding.
この発明においては、ワイヤボンデイング前に
ステツチ側導体にプレス又はプレスと超音波印加
を行なうから、カマボコ状になつているステツチ
側導体の表面を平坦にでき、その結果ボンデイン
グの密着性を向上できる。
In this invention, since the stitch-side conductor is pressed or pressed and ultrasonic waves are applied to the stitch-side conductor before wire bonding, the surface of the stitch-side conductor, which has a semicylindrical shape, can be made flat, and as a result, the adhesion of the bonding can be improved.
以下、この発明の一実施例を第１図を用いて説
明する。第１図において、第４図と同一符号は同
一部分を示し、８はワイヤボンデイングアーム２
の横に設けられたプレス用アーム、９はこのプレ
ス用アーム８の先端に取り付けられた、中央に長
方形の貫通孔９ｂを有するプレスヘツドである。
このプレスヘツド９には試料のステツチ側導体６
のパターンと略同一形状の、即ち、平面が中央に
長方形の貫通孔９ｃを有する長方形の枠形状の凸
部９ａが設けられ、その材料としては超音波を伝
搬しやすい材料を使用している。そして上記貫通
孔９ｂはプレス時にICチツプ５がその中に入る
ことができるためのものである。そして上記プレ
スアーム８とプレスヘツド９とによりステツチ側
導体６にプレスと超音波印加を行なうステツチ側
導体平坦化手段３０を構成しており、この平坦化
手段３０は、ボンデイング手段２０に対し試料送
り台７の上流に設けられている。
An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same symbols as in FIG. 4 indicate the same parts, and 8 is the wire bonding arm 2.
A press arm 9 provided next to the press arm 8 is a press head that is attached to the tip of the press arm 8 and has a rectangular through hole 9b in the center.
This press head 9 has a conductor 6 on the stitch side of the sample.
A rectangular frame-shaped convex portion 9a having substantially the same shape as the pattern, that is, a rectangular frame-shaped convex portion 9a having a rectangular through hole 9c in the center is provided, and is made of a material that easily transmits ultrasonic waves. The through hole 9b is provided so that the IC chip 5 can enter therein during pressing. The press arm 8 and the press head 9 constitute a stitch-side conductor flattening means 30 for pressing and applying ultrasonic waves to the stitch-side conductor 6. It is provided upstream of 7.
次に動作について説明する。 Next, the operation will be explained.
本装置においては、ワイヤボンデイング前に試
料に対してプレスヘツド９を第１図のように、即
ちその凸部９ａがステツチ側導体６と当接するよ
うに押しあて、プレスの超音波をかける。これに
より第３図ｃに示すように、プレス前には凸状に
なつていたステツチ側導体６は、プレスにより第
３図ｂに示すように、平坦となる。そして、その
後、試料送り台７によりステツチ側導体平坦化手
段３０の下からボンデイング手段２０の下に送ら
れて来た試料に対し、ボンデイング手段２０によ
りワイヤボンデイングを行なうと、密着性良く、
即ちステツチはがれを生じることなく、ワイヤボ
ンデイングを行なうことができる。その結果、本
装置ではステツチ側導体平坦化手段３０を付加す
るという簡単な装置の改造のみでバラツキのない
高いボンデイング強度を得ることができる。 In this apparatus, before wire bonding, the press head 9 is pressed against the sample as shown in FIG. 1, that is, so that its convex portion 9a is in contact with the stitch-side conductor 6, and press ultrasonic waves are applied. As a result, the stitch-side conductor 6, which had a convex shape before pressing as shown in FIG. 3c, becomes flat after pressing as shown in FIG. 3b. Then, when wire bonding is performed by the bonding means 20 on the sample sent from below the stitch-side conductor flattening means 30 to below the bonding means 20 by the sample feeding table 7, the adhesion is good.
That is, wire bonding can be performed without stitch peeling. As a result, with this device, high bonding strength without variation can be obtained by simply modifying the device by adding the stitch-side conductor flattening means 30.
なお上記実施例では、ステツチ側導体平坦化手
段３０はステツチ側導体６に対しプレスと超音波
印加を行なう場合を説明したが、これはプレスの
みを行なうものであつても良い。 In the above embodiment, the stitch-side conductor flattening means 30 presses and applies ultrasonic waves to the stitch-side conductor 6, but it may also be a device that only presses.
以上のように、この発明によれば、従来のワイ
ヤボンデイング装置に、ステツチ側導体にプレス
あるいはプレスと超音波印加を行なうステツチ側
導体平坦化手段を付け加えることにより、ワイヤ
ボンデイング強度のバラツキを抑えて密着性の良
いボンデイングを行うことができ、しかもこれを
簡単な装置の改造のみでもつて行なうことができ
る効果がある。
As described above, according to the present invention, variations in wire bonding strength can be suppressed by adding a stitch-side conductor flattening means that presses or presses and applies ultrasonic waves to the stitch-side conductor to the conventional wire bonding apparatus. Bonding with good adhesion can be achieved, and this can be achieved with only simple modification of the equipment.
第１図は本発明の一実施例による混成集積回路
用ワイヤボンデイング装置を示す斜視図、第２図
は該装置のプレスヘツド部の動作時の拡大側面
図、第３図はプレスによりステツチ側導体の形状
を平坦にする様子を示す図、第４図は従来のワイ
ヤボンデイング装置を示す斜視図である。
図において、１はTVカメラ、２はワイヤボン
デイングアーム、３はキヤピラリ、４はセラミツ
ク基板、５はICチツプ、６はステツチ側導体、
２０はボンデイング手段、８はプレス用アーム、
９はプレスヘツド、３０はステツチ側導体平坦化
手段である。
FIG. 1 is a perspective view showing a wire bonding device for hybrid integrated circuits according to an embodiment of the present invention, FIG. 2 is an enlarged side view of the press head portion of the device in operation, and FIG. FIG. 4 is a perspective view showing a conventional wire bonding apparatus. In the figure, 1 is a TV camera, 2 is a wire bonding arm, 3 is a capillary, 4 is a ceramic substrate, 5 is an IC chip, 6 is a stitch side conductor,
20 is a bonding means, 8 is a press arm,
9 is a press head, and 30 is a stitch side conductor flattening means.
Claims (1)
の装置において、ICチツプとワイヤボンデイン
グすべきステツチ側導体に対しプレス又はプレス
と超音波印加を行なうステツチ側導体平坦化手段
と、上記ステツチ側導体と上記ICチツプとをワ
イヤボンデイングするボンデイング手段とを備え
たことを特徴とする混成集積回路用ワイヤボンデ
イング装置。 ２ 上記ステツチ側導体平坦化手段は、上記ボン
デイング手段に対し試料送り台の上流に設けら
れ、かつ該平坦化手段はプレス用アームと、該プ
レス用アームの先端に取付けられ上記ステツチ側
導体のパターンと略同一形状の凸部を有するプレ
スヘツドとからなることを特徴とする特許請求の
範囲第１項記載の混成集積回路用ワイヤボンデイ
ング装置。[Scope of Claims] 1. An apparatus for wire-bonding a hybrid integrated circuit, comprising: a stitch-side conductor flattening means for pressing or pressing and applying ultrasonic waves to a stitch-side conductor to be wire-bonded to an IC chip; A wire bonding device for a hybrid integrated circuit, comprising bonding means for wire bonding a side conductor and the IC chip. 2. The stitch side conductor flattening means is provided upstream of the sample feed stage with respect to the bonding means, and the flattening means is attached to a press arm and a tip of the press arm and is attached to a press arm and a pattern of the stitch side conductor. 2. The wire bonding apparatus for a hybrid integrated circuit according to claim 1, further comprising a press head having a convex portion having substantially the same shape as the press head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60018360A JPS61177735A (en) | 1985-01-31 | 1985-01-31 | Wire bonder for hybrid ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60018360A JPS61177735A (en) | 1985-01-31 | 1985-01-31 | Wire bonder for hybrid ic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177735A JPS61177735A (en) | 1986-08-09 |
| JPH039618B2 true JPH039618B2 (en) | 1991-02-08 |
Family
ID=11969524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60018360A Granted JPS61177735A (en) | 1985-01-31 | 1985-01-31 | Wire bonder for hybrid ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177735A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007251065A (en) * | 2006-03-17 | 2007-09-27 | Mitsubishi Electric Corp | Ceramic wiring board, and its manufacturing method |
-
1985
- 1985-01-31 JP JP60018360A patent/JPS61177735A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177735A (en) | 1986-08-09 |
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