JP2003309353A - Electronic circuit unit - Google Patents
Electronic circuit unitInfo
- Publication number
- JP2003309353A JP2003309353A JP2002114036A JP2002114036A JP2003309353A JP 2003309353 A JP2003309353 A JP 2003309353A JP 2002114036 A JP2002114036 A JP 2002114036A JP 2002114036 A JP2002114036 A JP 2002114036A JP 2003309353 A JP2003309353 A JP 2003309353A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- component
- electronic circuit
- circuit unit
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は携帯電話機に使用さ
れる送受信ユニット等に適用して好適な電子回路ユニッ
トに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit unit suitable for application to a transmission / reception unit used in a mobile phone.
【０００２】[0002]
【従来の技術】従来の電子回路ユニットの図面を説明す
ると、図４は従来の電子回路ユニットに係る要部の平面
図、図５は従来の電子回路ユニットに係る要部断面図で
ある。2. Description of the Related Art A drawing of a conventional electronic circuit unit will be described. FIG. 4 is a plan view of an essential part of the conventional electronic circuit unit, and FIG. 5 is a sectional view of an essential part of the conventional electronic circuit unit.
【０００３】次に、従来の電子回路ユニットの構成を図
４，図５に基づいて説明すると、プリント基板等からな
る回路基板５１の表面には、種々の形状をなした配線パ
ターン５２が形成されている。Next, the structure of a conventional electronic circuit unit will be described with reference to FIGS. 4 and 5. Wiring patterns 52 having various shapes are formed on the surface of a circuit board 51 made of a printed circuit board or the like. ing.
【０００４】半導体からなるＩＣ部品５３は、直方体状
の絶縁材からなる本体部５４と、この本体部５４の下面
に設けられた電極部５５とを有する。そして、このＩＣ
部品５３は、回路基板５１上に搭載された構成となって
いると共に、回路基板５１上には、チップ型コンデンサ
やチップ型抵抗等のその他の電気部品（図示せず）が搭
載された構成となっている。The IC component 53 made of a semiconductor has a main body 54 made of a rectangular parallelepiped insulating material, and an electrode portion 55 provided on the lower surface of the main body 54. And this IC
The component 53 is configured to be mounted on the circuit board 51, and other electrical components (not shown) such as a chip capacitor and a chip resistor are mounted on the circuit board 51. Has become.
【０００５】即ち、ＩＣ部品５３は、本体部５４が回路
基板５１上に載置されて、電極部５５が配線パターン５
２上に半田付けされて接続、固定されている。また、Ｉ
Ｃ部品５３の本体部５４の全周には、接着剤（アンダー
フィル剤）５６が塗布されて、この接着剤５６によっ
て、ＩＣ部品５３が回路基板５１に保持された構成とな
っている。That is, in the IC component 53, the main body 54 is placed on the circuit board 51, and the electrode portion 55 is the wiring pattern 5.
2 is soldered on, connected and fixed. Also, I
An adhesive (underfill agent) 56 is applied to the entire circumference of the main body 54 of the C component 53, and the IC component 53 is held on the circuit board 51 by this adhesive 56.
【０００６】そして、ＩＣ部品５３の回路基板５１への
半田付けと接着は、先ず、配線パターン５２上にクリー
ム半田を塗布した上に、電極部５５を位置させた状態で
リフロー半田を行って、ＩＣ部品５３を回路基板５１に
半田付けする。In order to solder and bond the IC component 53 to the circuit board 51, first, reflow soldering is performed with cream solder applied on the wiring pattern 52 and with the electrode portion 55 positioned. The IC component 53 is soldered to the circuit board 51.
【０００７】次に、接着剤５６を本体部５４の外周部に
塗布した状態で、乾燥機に通して、接着剤５６を乾燥す
るようになっていて、リフロー半田と乾燥の２工程によ
って製造されるようになっている。Next, the adhesive 56 is applied to the outer peripheral portion of the main body 54, and is passed through a dryer to dry the adhesive 56, which is manufactured by two steps of reflow soldering and drying. It has become so.
【０００８】[0008]
【発明が解決しようとする課題】従来の電子回路ユニッ
トは、ＩＣ部品５３の外周部に接着剤５６を塗布するた
め、接着剤５６が露出して見栄えが悪く、商品価値を損
ねるという問題がある。また、外周部に塗布された接着
剤５６は、その塗布量のバラツキが大きく、乾燥時に、
量の多い側に本体部５４が横方向に引っ張られて、電極
部５５の接続用半田にクラックが発生して、信頼性に欠
けるという問題がある。また、ＩＣ部品５３の組立にリ
フロー半田と乾燥の２工程が必要で、生産性が悪いとい
う問題がある。In the conventional electronic circuit unit, since the adhesive 56 is applied to the outer peripheral portion of the IC component 53, the adhesive 56 is exposed and the appearance is unsatisfactory and the commercial value is impaired. . Further, the adhesive 56 applied to the outer peripheral portion has a large variation in the applied amount, and when dried,
There is a problem in that the main body portion 54 is pulled laterally toward the side with a large amount, cracks occur in the connecting solder of the electrode portion 55, and the reliability is poor. Further, the assembly of the IC component 53 requires two steps of reflow soldering and drying, which causes a problem of poor productivity.
【０００９】そこで、本発明は生産性が良好で、信頼性
が高く、見栄えの良い電子回路ユニットを提供すること
を目的とする。Therefore, an object of the present invention is to provide an electronic circuit unit having good productivity, high reliability and good appearance.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、配線パターンを有する回路基
板と、この回路基板上に搭載され、電極部を設けた本体
部を有するＩＣ部品とを備え、前記ＩＣ部品は、電極部
が前記配線パターンに半田付けされると共に、前記ＩＣ
部品の前記本体部と前記回路基板との間には、絶縁層を
設けて、前記本体部と前記回路基板との間に隙間部を形
成し、この隙間部には接着剤を設けて、前記ＩＣ部品を
前記回路基板に接着した構成とした。As a first means for solving the above problems, an IC component having a circuit board having a wiring pattern and a main body portion provided on the circuit board and provided with an electrode portion is provided. And the electrode part is soldered to the wiring pattern, and
An insulating layer is provided between the main body of the component and the circuit board to form a gap between the main body and the circuit board, and an adhesive is provided in the gap, An IC component was bonded to the circuit board.
【００１１】また、第２の解決手段として、前記絶縁層
が前記回路基板上に形成された構成とした。また、第３
の解決手段として、前記絶縁層は、複数個が島状に形成
された構成とした。また、第４の解決手段として、前記
絶縁層がシルク印刷によって形成された構成とした。As a second solving means, the insulating layer is formed on the circuit board. Also, the third
As a means for solving the above problem, a plurality of insulating layers are formed in an island shape. Further, as a fourth solving means, the insulating layer is formed by silk printing.
【００１２】[0012]
【発明の実施の形態】本発明の電子回路ユニットの図面
を説明すると、図１は本発明の電子回路ユニットに係る
要部の平面図、図２は図１の２−２線における断面図、
図３は本発明の電子回路ユニットに係る回路基板の要部
の平面図である。BEST MODE FOR CARRYING OUT THE INVENTION Referring to the drawings of an electronic circuit unit of the present invention, FIG. 1 is a plan view of an essential part of the electronic circuit unit of the present invention, FIG. 2 is a sectional view taken along line 2-2 of FIG.
FIG. 3 is a plan view of a main portion of a circuit board according to the electronic circuit unit of the present invention.
【００１３】次に、本発明の電子回路ユニットの構成を
図１〜図３に基づいて説明すると、プリント基板等から
なる回路基板１の表面には、種々の形状をなした配線パ
ターン２が形成されている。Next, the structure of the electronic circuit unit of the present invention will be described with reference to FIGS. 1 to 3. Wiring patterns 2 having various shapes are formed on the surface of a circuit board 1 made of a printed circuit board or the like. Has been done.
【００１４】また、回路基板１の表面には、特に図３に
示すように、互いに間隔を置いて独立した状態からなる
島状の絶縁層３が形成されている。そして、この絶縁層
３は、回路基板１の表面に設けられたシルク印刷の一部
で形成されると共に、この絶縁層３の厚さは、０．０５
ｍｍ以上で形成されて、配線パターン２の厚さよりも厚
く形成されている。Further, as shown in FIG. 3, an island-shaped insulating layer 3 is formed on the surface of the circuit board 1 so as to be spaced apart from each other and independent of each other. The insulating layer 3 is formed by a part of silk printing provided on the surface of the circuit board 1, and the thickness of the insulating layer 3 is 0.05.
The wiring pattern 2 is formed to have a thickness of at least mm, and is formed to be thicker than the wiring pattern 2.
【００１５】半導体からなるＩＣ部品４は、直方体状の
絶縁材からなる本体部５と、この本体部５の下面に設け
られた電極部６とを有する。このＩＣ部品４は、回路基
板１上に搭載された構成となっていると共に、回路基板
１上には、チップ型コンデンサやチップ型抵抗等のその
他の電気部品（図示せず）が搭載された構成となってい
る。The IC component 4 made of a semiconductor has a body portion 5 made of a rectangular parallelepiped insulating material, and an electrode portion 6 provided on the lower surface of the body portion 5. The IC component 4 is configured to be mounted on the circuit board 1, and other electric components (not shown) such as a chip type capacitor and a chip type resistor are mounted on the circuit board 1. It is composed.
【００１６】そして、ＩＣ部品４が搭載された際、本体
部５の下面は絶縁層３の上面に載置されて、本体部５の
下面と回路基板１の表面の間には、隙間部Ｓが形成さ
れ、この隙間部Ｓには、接着剤（アンダーフィル剤）７
が設けられて、この接着剤７によって、ＩＣ部品４が回
路基板１に保持された構成となっている。When the IC component 4 is mounted, the lower surface of the main body 5 is placed on the upper surface of the insulating layer 3, and a gap S is formed between the lower surface of the main body 5 and the surface of the circuit board 1. Is formed, and in this gap S, an adhesive (underfill agent) 7
Is provided and the IC component 4 is held on the circuit board 1 by the adhesive 7.
【００１７】即ち、絶縁層３は、本体部５の下面と対向
する位置に形成されており、本体部５の下面に位置した
状態で、絶縁層によって形成された隙間部Ｓに設けられ
た接着剤７によって、ＩＣ部品４が取り付けられた構成
となっている。That is, the insulating layer 3 is formed at a position facing the lower surface of the main body portion 5, and in the state of being located on the lower surface of the main body portion 5, the adhesive provided in the gap S formed by the insulating layer. The IC component 4 is attached by the agent 7.
【００１８】また、このＩＣ部品４の回路基板１への取
付は、先ず、絶縁層３が存在しない箇所の回路基板１の
表面に接着剤７を塗布すると共に、配線パターン２上に
クリーム半田を塗布する。To attach the IC component 4 to the circuit board 1, first, the adhesive 7 is applied to the surface of the circuit board 1 where the insulating layer 3 does not exist, and cream solder is applied onto the wiring pattern 2. Apply.
【００１９】次に、電極部６をクリーム半田上に位置す
ると共に、本体部５の下面を絶縁層３上に載置して、接
着剤７を本体部６の下面に接触させる。この状態で、リ
フロー半田装置に通すと、電極部６が配線パターン２に
半田８付けされると共に、接着剤７が乾燥して、本体部
６の下面が回路基板１に接着された状態となって、１工
程でＩＣ部品４の組み込みが完了する。Next, the electrode portion 6 is positioned on the cream solder, the lower surface of the main body portion 5 is placed on the insulating layer 3, and the adhesive 7 is brought into contact with the lower surface of the main body portion 6. In this state, when it is passed through the reflow soldering device, the electrode portion 6 is soldered 8 to the wiring pattern 2, the adhesive 7 is dried, and the lower surface of the main body portion 6 is bonded to the circuit board 1. Then, the assembling of the IC component 4 is completed in one step.
【００２０】なお、上記実施例では、回路基板上に絶縁
層を設けたもので説明したが、ＩＣ部品の本体部の下面
に絶縁層を設けても良い。In the above embodiment, the insulating layer is provided on the circuit board, but the insulating layer may be provided on the lower surface of the main body of the IC component.
【００２１】[0021]
【発明の効果】本発明の電子回路ユニットは、配線パタ
ーンを有する回路基板と、この回路基板上に搭載され、
電極部を設けた本体部を有するＩＣ部品とを備え、ＩＣ
部品は、電極部が配線パターンに半田付けされると共
に、ＩＣ部品の本体部と回路基板との間には、絶縁層を
設けて、本体部と回路基板との間に隙間部を形成し、こ
の隙間部には接着剤を設けて、ＩＣ部品を回路基板に接
着したため、接着剤はＩＣ部品の下面から露出すること
が極めて少なく、従来に比して、見栄えが良く、商品価
値を高めることができる。また、接着剤がＩＣ部品の下
面に設けられたため、その塗布量のバラツキが少なく、
且つ、従来のような横方向の引っ張り力が無く、上下方
向の引っ張り力となって、電極部の接続用半田にクラッ
クが発生せず、信頼性のあるものが得られる。また、Ｉ
Ｃ部品の組み込みが１工程で完了し、生産性の良好なも
のが得られる。The electronic circuit unit of the present invention has a circuit board having a wiring pattern and is mounted on the circuit board.
And an IC component having a body portion provided with an electrode portion,
In the component, the electrode part is soldered to the wiring pattern, an insulating layer is provided between the main body of the IC component and the circuit board, and a gap is formed between the main body and the circuit board. Since an adhesive is provided in this gap and the IC component is bonded to the circuit board, the adhesive is rarely exposed from the lower surface of the IC component, which makes it look better than before and enhances the commercial value. You can In addition, since the adhesive is provided on the lower surface of the IC component, there is little variation in the applied amount,
In addition, there is no horizontal pulling force as in the prior art, and vertical pulling force does not occur, so that cracks do not occur in the connecting solder of the electrode portion, and a reliable one can be obtained. Also, I
Assembling of C parts is completed in one step, and a product with good productivity can be obtained.
【００２２】また、絶縁層が回路基板上に形成されたた
め、その製造が簡単で、生産性が良く、安価なものが得
られる。Further, since the insulating layer is formed on the circuit board, it is easy to manufacture, has good productivity, and is inexpensive.
【００２３】また、絶縁層は、複数個が島状に形成され
たため、接着剤を設けるための隙間部がＩＣ部品の形状
に合わせて任意に形成できて、ＩＣ部品の接着の確実な
ものが得られる。Further, since the plurality of insulating layers are formed in an island shape, the gap for providing the adhesive can be arbitrarily formed according to the shape of the IC component, so that the IC components can be reliably bonded. can get.
【００２４】また、絶縁層がシルク印刷によって形成さ
れたため、回路基板の形成時において、特別な材料を使
用せずに絶縁層を形成できて、安価なものが得られる。Further, since the insulating layer is formed by silk printing, the insulating layer can be formed without using a special material at the time of forming the circuit board, and an inexpensive one can be obtained.
【図１】本発明の電子回路ユニットに係る要部の平面
図。FIG. 1 is a plan view of a main part of an electronic circuit unit according to the present invention.
【図２】図１の２−２線における断面図。FIG. 2 is a sectional view taken along line 2-2 of FIG.
【図３】本発明の電子回路ユニットに係る回路基板の要
部の平面図。FIG. 3 is a plan view of a main part of a circuit board according to an electronic circuit unit of the present invention.
【図４】従来の電子回路ユニットに係る要部の平面図。FIG. 4 is a plan view of a main part of a conventional electronic circuit unit.
【図５】従来の電子回路ユニットに係る要部断面図。FIG. 5 is a cross-sectional view of a main part of a conventional electronic circuit unit.
１ 回路基板 ２ 配線パターン ３ 絶縁層 ４ ＩＣ部品 ５ 本体部 ６ 電極部 ７ 接着剤 ８ 半田 1 circuit board 2 wiring pattern 3 insulating layers 4 IC parts 5 Main body 6 electrode part 7 adhesive 8 solder
Claims (4)
回路基板上に搭載され、電極部を設けた本体部を有する
ＩＣ部品とを備え、前記ＩＣ部品は、電極部が前記配線
パターンに半田付けされると共に、前記ＩＣ部品の前記
本体部と前記回路基板との間には、絶縁層を設けて、前
記本体部と前記回路基板との間に隙間部を形成し、この
隙間部には接着剤を設けて、前記ＩＣ部品を前記回路基
板に接着したことを特徴とする電子回路ユニット。1. A circuit board having a wiring pattern, and an IC component mounted on the circuit board and having a body portion provided with an electrode portion, wherein the electrode portion of the IC component is soldered to the wiring pattern. In addition, an insulating layer is provided between the main body of the IC component and the circuit board to form a gap between the main body and the circuit board, and the gap is bonded to the gap. An electronic circuit unit, wherein an agent is provided and the IC component is adhered to the circuit board.
たことを特徴とする請求項１記載の電子回路ユニット。2. The electronic circuit unit according to claim 1, wherein the insulating layer is formed on the circuit board.
たことを特徴とする請求項１、又は２記載の電子回路ユ
ニット。3. The electronic circuit unit according to claim 1, wherein a plurality of the insulating layers are formed in an island shape.
れたことを特徴とする請求項１から３の何れかに記載の
電子回路ユニット。4. The electronic circuit unit according to claim 1, wherein the insulating layer is formed by silk printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002114036A JP2003309353A (en) | 2002-04-16 | 2002-04-16 | Electronic circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002114036A JP2003309353A (en) | 2002-04-16 | 2002-04-16 | Electronic circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003309353A true JP2003309353A (en) | 2003-10-31 |
Family
ID=29395995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002114036A Withdrawn JP2003309353A (en) | 2002-04-16 | 2002-04-16 | Electronic circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003309353A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016021451A (en) * | 2014-07-14 | 2016-02-04 | 日立オートモティブシステムズ株式会社 | Electronic module |
-
2002
- 2002-04-16 JP JP2002114036A patent/JP2003309353A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016021451A (en) * | 2014-07-14 | 2016-02-04 | 日立オートモティブシステムズ株式会社 | Electronic module |
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