JPS61177735A - Wire bonder for hybrid ic - Google Patents

Wire bonder for hybrid ic

Info

Publication number
JPS61177735A
JPS61177735A JP60018360A JP1836085A JPS61177735A JP S61177735 A JPS61177735 A JP S61177735A JP 60018360 A JP60018360 A JP 60018360A JP 1836085 A JP1836085 A JP 1836085A JP S61177735 A JPS61177735 A JP S61177735A
Authority
JP
Japan
Prior art keywords
stitch
side conductor
bonding
wire bonding
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60018360A
Other languages
Japanese (ja)
Other versions
JPH039618B2 (en
Inventor
Masakazu Nakabayashi
正和 中林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60018360A priority Critical patent/JPS61177735A/en
Publication of JPS61177735A publication Critical patent/JPS61177735A/en
Publication of JPH039618B2 publication Critical patent/JPH039618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To accomplish well-adhesive bonding by inhibiting the variability of wire bonding strength by adding a stitch side conductor flattening means which presses or presses and supersonically impresses the stitch side conductor. CONSTITUTION:Before wire bonding, a press head 9 is pressed on the sample so that its projection 9a may abut against the stitch side conductor 6, and pressing and supersonic waves are applied. This manner flattens the conductor 6 which has been in projection form before pressing by pressing. Thereafter, a sample fed downward a bonding means 20 from below a stitch side conductor flattening means 30 by a sample feed table 7 is subjected to wire bonding by the bonding means 20, wire bonding can be accomplished with good adhesive property, i.e. without stitch stripping.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、混成集積回路（ハイブリッド回路）用ワイ
ヤボンディング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding device for a hybrid integrated circuit (hybrid circuit).

〔従来の技術〕[Conventional technology]

第４図は一般に使用されている従来のワイヤボンディン
グ装置のキャピラリ付近を示す、１はパターン認識用Ｔ
Ｖカメラ、２はワイヤボンディングアーム、３はキャピ
ラリ、４はハイブリッドＩＣ基板、５はＩＣチップ、６
はステッチ側導体であり、該導体部分はカマボコ状にな
っている。また、７はワイヤボンディングすべき試料を
送るための送り台である。そして上記１．２．３により
ワイヤボンディングを行なうボンディング手段２０を構
成している。Figure 4 shows the vicinity of the capillary of a conventional wire bonding device that is commonly used. 1 is a T for pattern recognition.
V camera, 2 is a wire bonding arm, 3 is a capillary, 4 is a hybrid IC board, 5 is an IC chip, 6
is a stitch-side conductor, and the conductor portion has a semicylindrical shape. Further, 7 is a feed base for sending a sample to be wire bonded. The above 1.2.3 constitutes a bonding means 20 for performing wire bonding.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の装置は以上のように構成されているので、混成集
積回路のステッチ側導体のようにカマボコという問題点
があった。Since the conventional device is constructed as described above, there is a problem in that the conductor on the stitch side of the hybrid integrated circuit is rounded.

この発明は上記のような問題点を解消するためになされ
たもので、混成集積回路のボンディングにおいて、高い
ボンディング強度が得られる混成集積回路用ワイヤボン
ディング装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a wire bonding device for hybrid integrated circuits that can obtain high bonding strength in bonding hybrid integrated circuits.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る混成集積回路用ワイヤボンディング装置
は、ワイヤボンディング前に、ステッチ側導体にプレス
又はプレスと超音波印加とを行なうステッチ側導体平坦
化手段を設けたものである。The wire bonding apparatus for a hybrid integrated circuit according to the present invention is provided with stitch-side conductor flattening means for pressing or pressing and applying ultrasonic waves to the stitch-side conductor before wire bonding.

〔作用〕[Effect]

この発明においては、ワイヤボンディング前にステッチ
側導体にプレス又はプレスと超音波印加を行なうから、
カマボコ状になっているステッチ側導体の表面を平坦に
でき、その結果ボンディングの密着性を向上できる。In this invention, since the stitch side conductor is pressed or pressed and ultrasonic waves are applied before wire bonding,
The surface of the stitch-side conductor, which has a semicircular shape, can be made flat, and as a result, the adhesion of bonding can be improved.

〔実施例〕〔Example〕

以下、この発明の一実施例を第１図を用いて説明する。 An embodiment of the present invention will be described below with reference to FIG.

第１図において、第４図と同一符号は同一部分を示し、
８はワイヤボンディングアーム２ドである。このプレス
ヘッド９には試料のステラの凸部９ａが設けられ、その
材料としては超音波を伝搬しやすい材料を使用している
。そして上記貫通孔９ｂはプレス時にＩＣチップ５がそ
の中に入ることができるためのものである。そして上記
プレスアーム８とプレスへラド９とによりステッチ側導
体６にプレスと超音波印加を行なうステッチ側導体平坦
化手段３０を構成しており、この平坦化手段３０は、ボ
ンディング手段２０に対し試料送り台７の上流に設けら
れている。In FIG. 1, the same symbols as in FIG. 4 indicate the same parts,
8 is a wire bonding arm 2d. The press head 9 is provided with a convex portion 9a of the sample steller, and a material that easily transmits ultrasonic waves is used as the material thereof. The through hole 9b is provided so that the IC chip 5 can enter therein during pressing. The press arm 8 and the press head 9 constitute a stitch side conductor flattening means 30 for pressing and applying ultrasonic waves to the stitch side conductor 6. It is provided upstream of the feed table 7.

次に動作について説明する。Next, the operation will be explained.

本装置においては、ワイヤボンディング前に試料に対し
てプレスヘッド９を第１図のように、即ちその凸部９ａ
がステッチ側導体６と当接するように押しあて、プレス
と超音波をかける。これにより第３図（ｅｌに示すよう
に、プレス前には凸状になっていたステッチ側導体６は
、プレスにより第３回出）に示すように、平坦となる。In this apparatus, before wire bonding, the press head 9 is pressed against the sample as shown in FIG.
is pressed so that it is in contact with the stitch side conductor 6, and press and ultrasonic waves are applied. As a result, the stitch side conductor 6, which had a convex shape before pressing as shown in FIG. 3 (el), becomes flat as shown in the third press.

そして、その後、試料送り台７によりステッチ側導体平
坦化手段３０の下からボンディング手段２ｏの下に送ら
イヤボンディングを行なうことができる。その結果、本
装置ではステッチ側導体平坦化手段３０を付加するとい
う簡単な装置の改造のみでバラツキのない高いボンディ
ング強度を得ることができる。Thereafter, the specimen can be sent from below the stitch-side conductor flattening means 30 to below the bonding means 2o using the sample feeding stage 7 to perform ear bonding. As a result, with this device, high bonding strength without variation can be obtained by simply modifying the device by adding the stitch-side conductor flattening means 30.

なお上記実施例では、ステッチ側導体平坦化手段３０は
ステッチ側導体６に対しプレスと超音波印加を行なう場
合を説明したが、これはプレスのみを行なうものであっ
ても良い。In the above embodiment, a case has been described in which the stitch-side conductor flattening means 30 presses and applies ultrasonic waves to the stitch-side conductor 6, but it may also perform only pressing.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、従来のワイヤボンデ
ィング装置に、ステッチ側導体にプレスあるいはプレス
と超音波印加を行なうステッチ側導体平坦化手段を付は
加えることにより、ワイヤボンディング強度のバラツキ
を抑えて密着性の良いボンディングを行うことができ、
しかもこれを簡単な装置の改造のみでもって行なうこと
ができる効果がある。As described above, according to the present invention, variations in wire bonding strength can be reduced by adding or adding to the conventional wire bonding apparatus a stitch side conductor flattening means that presses or presses and applies ultrasonic waves to the stitch side conductor. Bonding with good adhesion can be achieved by suppressing
Moreover, this can be accomplished by simply modifying the device.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例による混成集積回路用ワイヤ
ボンディング装置を示す斜視図、第２図は該装置のプレ
スヘッド部の動作時の拡大側面図、第３図はプレスによ
りステッチ側導体の形状を平坦にする様子を示す図、第
４図は従来のワイヤボンディング装置を示す斜視図であ
る。 図において、１はＴＶカメラ、２はワイヤボンディング
アーム、３はキャピラリ、４はセラミック基板、５はＩ
Ｃチップ、６はステッチ側導体、２０はボンディング手
段、８はプレス用アーム、９はプレスヘッド、３０はス
テッチ側導体平坦化手段である。FIG. 1 is a perspective view showing a wire bonding device for hybrid integrated circuits according to an embodiment of the present invention, FIG. 2 is an enlarged side view of the press head portion of the device in operation, and FIG. 3 is a stitch side conductor formed by pressing. FIG. 4 is a perspective view showing a conventional wire bonding apparatus. In the figure, 1 is a TV camera, 2 is a wire bonding arm, 3 is a capillary, 4 is a ceramic substrate, and 5 is an I
C chip, 6 is a stitch side conductor, 20 is a bonding means, 8 is a press arm, 9 is a press head, and 30 is a stitch side conductor flattening means.

Claims (2)

【特許請求の範囲】[Claims] （１）混成集積回路をワイヤボンディングするための装
置において、ＩＣチップとワイヤボンディングすべきス
テッチ側導体に対しプレス又はプレスと超音波印加を行
なうステッチ側導体平坦化手段と、上記ステッチ側導体
と上記ＩＣチップとをワイヤボンディングするボンディ
ング手段とを備えたことを特徴とする混成集積回路用ワ
イヤボンディング装置。(1) In an apparatus for wire-bonding a hybrid integrated circuit, a stitch-side conductor flattening means for pressing or pressing and applying ultrasonic waves to a stitch-side conductor to be wire-bonded to an IC chip; A wire bonding device for a hybrid integrated circuit, comprising a bonding means for wire bonding an IC chip. （２）上記ステッチ側導体平坦化手段は、上記ボンディ
ング手段に対し試料送り台の上流に設けられ、かつ該平
坦化手段はプレス用アームと、該プレス用アームの先端
に取付けられ上記ステッチ側導体のパターンと略同一形
状の凸部を有するプレスヘッドとからなることを特徴と
する特許請求の範囲第１項記載の混成集積回路用ワイヤ
ボンディング装置。(2) The stitch side conductor flattening means is provided upstream of the sample feed stage with respect to the bonding means, and the flattening means is attached to a press arm and the tip of the press arm and is attached to the stitch side conductor. 2. The wire bonding apparatus for a hybrid integrated circuit according to claim 1, further comprising a press head having a convex portion having substantially the same shape as the pattern.
JP60018360A 1985-01-31 1985-01-31 Wire bonder for hybrid ic Granted JPS61177735A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60018360A JPS61177735A (en) 1985-01-31 1985-01-31 Wire bonder for hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60018360A JPS61177735A (en) 1985-01-31 1985-01-31 Wire bonder for hybrid ic

Publications (2)

Publication Number Publication Date
JPS61177735A true JPS61177735A (en) 1986-08-09
JPH039618B2 JPH039618B2 (en) 1991-02-08

Family

ID=11969524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60018360A Granted JPS61177735A (en) 1985-01-31 1985-01-31 Wire bonder for hybrid ic

Country Status (1)

Country Link
JP (1) JPS61177735A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251065A (en) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp Ceramic wiring board, and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251065A (en) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp Ceramic wiring board, and its manufacturing method

Also Published As

Publication number Publication date
JPH039618B2 (en) 1991-02-08

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