JPH06216505A - Method for connecting terminal to printed board - Google Patents
Method for connecting terminal to printed boardInfo
- Publication number
- JPH06216505A JPH06216505A JP5004586A JP458693A JPH06216505A JP H06216505 A JPH06216505 A JP H06216505A JP 5004586 A JP5004586 A JP 5004586A JP 458693 A JP458693 A JP 458693A JP H06216505 A JPH06216505 A JP H06216505A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- ultrasonic vibration
- conductor circuit
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置のパッケー
ジなどに用いられるプリント配線板への端子の接続方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting terminals to a printed wiring board used for a semiconductor device package or the like.
【０００２】[0002]
【従来の技術】プリント配線板に形成される金属の導体
回路に金属で形成される外部接続用の端子を接続するに
あたっては、半田や銀ろうなどのろう材を用いてろう付
けすることによっておこなうのが一般的である。しかし
このようにろう付けすることによって接続をおこなう
と、溶融させたろう材の高熱がプリント配線板に作用し
てプリント配線板に劣化が発生するおそれがある等の問
題がある。2. Description of the Related Art External terminals made of metal are connected to a metal conductor circuit formed on a printed wiring board by brazing using a brazing material such as solder or silver solder. Is common. However, when the connection is made by brazing as described above, there is a problem that the high heat of the melted brazing material acts on the printed wiring board and the printed wiring board may be deteriorated.
【０００３】そこで、本出願人によって超音波振動を与
えることによる金属拡散接合でプリント配線板１の導体
回路２に外部接続用の端子３を接続するようにした技術
が特願平３−５００４３号や特願平３−５００４４号な
どで提供されている。すなわち、図４に示すように、プ
リント配線板１の導体回路２の表面に端子３の先端部を
重ねて密着させ、超音波伝導子の伝達ツール（加圧子）
９を用いて端子３を導体回路２に加圧しながら超音波振
動を与えることによって、導体回路２と端子３とを金属
拡散接合させて接続するようにしたものである。Therefore, a technique in which the present applicant connects the terminal 3 for external connection to the conductor circuit 2 of the printed wiring board 1 by metal diffusion bonding by applying ultrasonic vibration is disclosed in Japanese Patent Application No. 3-50043. And Japanese Patent Application No. 3-50044. That is, as shown in FIG. 4, the tip of the terminal 3 is overlapped and brought into close contact with the surface of the conductor circuit 2 of the printed wiring board 1, and the ultrasonic conductor transmission tool (pressurizer) is used.
By applying ultrasonic vibration while pressurizing the terminal 3 to the conductor circuit 2 by using 9, the conductor circuit 2 and the terminal 3 are connected by metal diffusion bonding.
【０００４】[0004]
【発明が解決しようとする課題】しかし図４のように超
音波伝導子の伝達ツール９を用いて超音波振動を与える
場合、超音波振動は端子３の全体に伝播し、特に端子３
の基部の方向に伝播して、金属拡散接合をおこなう接合
部以外の部位に超音波振動のエネルギーが消費されるも
のであった。従って端子３を金属拡散接合するにあたっ
て大きな超音波振動のエネルギーが必要になるという問
題があった。また、伝達ツール９で端子３を加圧するに
あたって、加圧力が端子３の接合部３ａ以外にも分散さ
れてしまうおそれがあり、大きな加圧力を伝達ツール９
に与えて端子３の接合をおこなう必要があるという問題
があった。このために、大きな超音波振動エネルギーと
加圧力を与えることができる設備を設けることが必要に
なるものであった。However, when ultrasonic vibration is applied by using the ultrasonic conductor transmission tool 9 as shown in FIG. 4, the ultrasonic vibration propagates to the entire terminal 3, particularly the terminal 3.
The energy of the ultrasonic vibration was propagated in the direction of the base portion of and the energy of ultrasonic vibration was consumed in the portion other than the joint portion where the metal diffusion bonding was performed. Therefore, there has been a problem that a large amount of ultrasonic vibration energy is required for metal diffusion bonding the terminal 3. Further, when the transmission tool 9 pressurizes the terminal 3, the pressing force may be dispersed to areas other than the joint portion 3 a of the terminal 3, and a large pressing force is applied.
However, there is a problem in that it is necessary to bond the terminals 3 by applying them to the terminal. For this reason, it has been necessary to provide equipment capable of applying a large amount of ultrasonic vibration energy and pressure.
【０００５】本発明は上記の点に鑑みてなされたもので
あり、小さな超音波振動のエネルギーで、また小さな加
圧力で、端子の接合をおこなうことができるプリント配
線板への端子の接続法を提供することを目的とするもの
である。The present invention has been made in view of the above points, and provides a method for connecting terminals to a printed wiring board, which allows terminals to be joined with a small amount of ultrasonic vibration energy and a small pressure. It is intended to be provided.
【０００６】[0006]
【課題を解決するための手段】本発明に係るプリント配
線板への端子の接続方法は、プリント配線板１の導体回
路２の表面に端子３の先部を密着させて加圧しつつ超音
波振動を与えることによって、端子３を導体回路２に金
属拡散接合させるにあたって、接合部３ａの近傍におい
てその基部寄りの表面に凹部４を凹設した端子３を用い
ることを特徴とするものである。According to the method of connecting terminals to a printed wiring board according to the present invention, the tip of the terminal 3 is brought into close contact with the surface of the conductor circuit 2 of the printed wiring board 1 while applying ultrasonic vibration. When the terminal 3 is metal-diffusion bonded to the conductor circuit 2 by applying the above, the terminal 3 having the concave portion 4 on the surface near the base in the vicinity of the bonding portion 3a is used.
【０００７】[0007]
【作用】端子３の接合部３ａの近傍においてその基部寄
りの表面に凹部４を凹設してあるために、端子３に与え
た超音波振動は凹部４によって減衰されて端子３の接合
部３ａから基部へと伝播することを防ぐことができ、接
合部３ａ以外の部位に超音波振動のエネルギーが消費さ
れることを低減することができる。Since the concave portion 4 is provided on the surface of the terminal 3 near the joint portion 3a near the base, ultrasonic vibration applied to the terminal 3 is attenuated by the concave portion 4 and the joint portion 3a of the terminal 3 is damped. Can be prevented from propagating to the base portion, and the energy of ultrasonic vibrations can be reduced from being consumed by portions other than the joint portion 3a.
【０００８】[0008]
【実施例】以下本発明を実施例によって詳述する。プリ
ント配線板１としては、ガラス布基材エポキシ樹脂積層
板やガラス布基材ポリイミド樹脂積層板、ガラス布基材
フッ素樹脂積層板、ガラス布基材ポリフェニレンオキサ
イド樹脂積層板などの樹脂積層板で絶縁基板１ａを作成
すると共に、その表面に導体回路２を、銅箔やアルミニ
ウム箔などの金属箔をサブトラクティブ法で加工して設
けたり、アディティブ法でメッキして設けたりして形成
されるプラスチック基板のものや、あるいはセラミック
板で絶縁基板１ａを作成すると共にその表面に金属導体
ペースト等で導体回路２を設けたセラミック基板のもの
など、任意のものを使用することができる。EXAMPLES The present invention will be described in detail below with reference to examples. The printed wiring board 1 is insulated with a resin laminate plate such as a glass cloth substrate epoxy resin laminate plate, a glass cloth substrate polyimide resin laminate plate, a glass cloth substrate fluorine resin laminate plate, or a glass cloth substrate polyphenylene oxide resin laminate plate. A plastic substrate formed by forming the substrate 1a and providing the conductor circuit 2 on its surface by processing a metal foil such as a copper foil or an aluminum foil by a subtractive method or by plating by an additive method. It is possible to use any one, such as a ceramic substrate having an insulating substrate 1a made of a ceramic plate and a conductor circuit 2 provided on the surface thereof with a metal conductor paste or the like.
【０００９】また、外部接続用の端子３としては、例え
ば銅や銅合金、４２アロイ、鉄、鉄合金、アルミニウム
などで作成されたリードフレームや、短冊状リード、端
子ピンなどを用いることができる。この端子３の先端部
の接合部３ａの近傍にはその基部寄りの部分に凹部４が
設けてある。凹部４は接合部３ａから２ｍｍ以内の範囲
の近傍に設けるのが好ましく、深さは０．０５ｍｍ程度
が好ましい。図２（ａ）の実施例では端子３の上面の両
側縁に端子３の長手方向と平行に凹部４を設けるように
してあり、図２（ｂ）の実施例では端子３の下面の両側
縁に端子３の長手方向と平行に凹部４を設けるようにし
てある。また図２（ｃ）の実施例では凹部４は端子３の
上面に設けるようにしてあり、図２（ｄ）の実施例では
凹部４を丸穴として形成して端子３の上面及び側面に設
けるようにしてある。さらに図２（ｅ）の実施例では、
凹部４を断面Ｖ字形の溝状に形成して端子３の上面に設
けるようにしてある。このように凹部４の形成箇所、個
数、断面形状等は特に制限されるものではなく、用途等
に応じて設定することができるものである。また凹部４
を形成するにあたっては、パンチング加工、絞り加工、
刻印等の機械加工や、エッチング等の化学加工など任意
の方法でおこなうことができる。As the terminal 3 for external connection, for example, a lead frame made of copper, copper alloy, 42 alloy, iron, iron alloy, aluminum or the like, strip lead, terminal pin, etc. can be used. . A recess 4 is provided near the base of the joint 3a at the tip of the terminal 3. The recess 4 is preferably provided in the vicinity of a range within 2 mm from the joint 3a, and the depth thereof is preferably about 0.05 mm. In the embodiment of FIG. 2 (a), recesses 4 are provided on both side edges of the upper surface of the terminal 3 in parallel with the longitudinal direction of the terminal 3, and in the embodiment of FIG. 2 (b) both side edges of the lower surface of the terminal 3 are provided. The concave portion 4 is provided parallel to the longitudinal direction of the terminal 3. In the embodiment of FIG. 2C, the recess 4 is provided on the upper surface of the terminal 3, and in the embodiment of FIG. 2D, the recess 4 is formed as a round hole and provided on the upper surface and the side surface of the terminal 3. Is done. Further, in the embodiment of FIG. 2 (e),
The recess 4 is formed in the shape of a groove having a V-shaped cross section and is provided on the upper surface of the terminal 3. As described above, the formation location, the number, the cross-sectional shape and the like of the concave portion 4 are not particularly limited and can be set according to the application and the like. In addition, the concave portion 4
When forming, punching, drawing,
It can be performed by any method such as mechanical processing such as engraving or chemical processing such as etching.
【００１０】そして、図１に示すように、プリント配線
板１の導体回路２の表面に端子３の先端部の接合部３ａ
を密着させ、接合部３ａにおいて端子３の上面に超音波
伝導子の振動伝達ツール９を圧接させることによって、
端子３を導体回路２に加圧しつつ超音波を印加して端子
３と導体回路２の接触面に超音波振動を作用させると共
に必要に応じて加熱し、導体回路２の金属と端子３の金
属をその密着部分において金属拡散現象に基づく結合を
おこなわせ、導体回路２に端子３を接合一体化して接続
することができるものである。Then, as shown in FIG. 1, the joint portion 3a at the tip of the terminal 3 is attached to the surface of the conductor circuit 2 of the printed wiring board 1.
And the vibration transmission tool 9 of the ultrasonic conductor is pressed against the upper surface of the terminal 3 at the joint 3a,
The metal of the conductor circuit 2 and the metal of the terminal 3 are applied by applying ultrasonic waves to the conductor circuit 2 while pressing the terminal 3 to apply ultrasonic vibration to the contact surface between the terminal 3 and the conductor circuit 2 and heating it as necessary. The terminal 3 can be joined and integrated to the conductor circuit 2 to be connected to the conductor circuit 2 by connecting the conductor circuit 2 based on the metal diffusion phenomenon.
【００１１】このように加圧しつつ超音波振動を与える
ことによって導体回路２に端子３を金属拡散接合させる
にあたって、端子３には接合部３ａよりも基部寄りの位
置において凹部４が設けてあるために、接合部３ａに与
えられた超音波振動は端子３に沿ってその基部側へ伝播
する際に凹部４によって減衰され、凹部４よりも基部側
へ伝播することを防ぐことができるものであり、従って
金属拡散接合をおこなう接合部３ａ以外の部位に超音波
振動のエネルギーが余分に消費されることを低減するこ
とができ、大きな超音波振動エネルギーを必要とするこ
となく端子３の接合をおこなうことができるものであ
る。また、凹部４によって振動伝達ツール９による加圧
力が分散することを防いで接合部３ａに集中させること
ができ、大きな加圧力を必要とすることなく端子３の接
合をおこなうことができるものである。When the terminal 3 is metal-diffusion bonded to the conductor circuit 2 by applying ultrasonic vibration while applying pressure, the terminal 3 is provided with a recess 4 at a position closer to the base than the bonding portion 3a. The ultrasonic vibration applied to the joint 3a is attenuated by the recess 4 when propagating to the base side along the terminal 3 and can be prevented from propagating to the base side rather than the recess 4. Therefore, it is possible to reduce the excessive consumption of ultrasonic vibration energy to the portion other than the joint portion 3a where the metal diffusion bonding is performed, and the terminal 3 is joined without requiring a large ultrasonic vibration energy. Is something that can be done. Further, the concave portion 4 can prevent the pressure applied by the vibration transmission tool 9 from being dispersed, and can concentrate the pressure on the joint 3a, so that the terminal 3 can be joined without requiring a large pressure. .
【００１２】上記のようにして導体回路２に端子３を接
合した後に、プリント配線板１にＩＣ等の半導体チップ
１０を搭載して半導体チップ１０の電極とプリント配線
板１の導体回路２とを金線等のワイヤーボンディング１
１で接続し、半導体チップ１０を覆うように封止樹脂１
２で被覆することによって、端子１が外部出力端子とな
りプリント配線板１がパッケージ基板となったＱＦＰ等
の半導体装置を作成することができるものである。図３
（ａ）は端子１を外側に折り曲げて半導体装置を作成し
たもの、図３（ｂ）は端子１を内側に折り曲げて半導体
装置を作成したもの、図３（ｃ）はプリント配線板１の
一方の端部から突出させるように端子３を取り付けて縦
型に半導体装置を作成したもの、図３（ｄ）は端子３を
倒Ｌ型に折曲して半導体装置を作成したものである。After the terminals 3 are joined to the conductor circuit 2 as described above, the semiconductor chip 10 such as an IC is mounted on the printed wiring board 1 to connect the electrodes of the semiconductor chip 10 and the conductor circuit 2 of the printed wiring board 1. Wire bonding of gold wire 1
1 and the sealing resin 1 so as to cover the semiconductor chip 10.
By coating with 2, the semiconductor device such as QFP in which the terminal 1 serves as an external output terminal and the printed wiring board 1 serves as a package substrate can be manufactured. Figure 3
3A shows a semiconductor device made by bending the terminal 1 outward, FIG. 3B shows a semiconductor device made by bending the terminal 1 inward, and FIG. 3C shows one side of the printed wiring board 1. A vertical semiconductor device is manufactured by attaching the terminal 3 so as to project from the end of the semiconductor device, and FIG. 3D shows a semiconductor device manufactured by bending the terminal 3 into an inverted L shape.
【００１３】[0013]
【発明の効果】上記のように本発明は、プリント配線板
の導体回路の表面に端子の先部を密着させて加圧しつつ
超音波振動を与えることによって、端子を導体回路に金
属拡散接合させるにあたって、接合部の近傍においてそ
の基部寄りの表面に凹部を凹設した端子を用いるように
したので、端子に与えた超音波振動は凹部によって減衰
されて端子の接合部から基部側へと伝播することを防ぐ
ことができ、接合部以外に部位に超音波振動のエネルギ
ーが消費されることを低減することができるものであっ
て、小さな超音波振動のエネルギーで端子の接合をおこ
なうことができるものであり、しかも凹部によって加圧
力が分散することを防いで接合部に集中させることがで
き、大きな加圧力を必要とすることなく端子の接合をお
こなうことができるものである。As described above, according to the present invention, the terminals of the terminals are metal-diffusion bonded to the conductor circuits by applying ultrasonic vibration while pressing the tips of the terminals to the surface of the conductor circuits of the printed wiring board. At this time, in the vicinity of the joint, a terminal having a recess on the surface near the base was used, so the ultrasonic vibration applied to the terminal is attenuated by the recess and propagates from the joint of the terminal to the base side. Which can reduce the consumption of ultrasonic vibration energy to parts other than the joint portion, and can join terminals with a small amount of ultrasonic vibration energy. In addition, it is possible to prevent the pressing force from being dispersed by the concave portion and concentrate the pressing force on the joint portion, so that the terminals can be joined without requiring a large pressing force. It is intended.
【図１】本発明の一実施例の概略図である。FIG. 1 is a schematic view of an embodiment of the present invention.
【図２】同上の端子を示すものであり、（ａ），
（ｂ），（ｃ），（ｄ），（ｅ）はそれぞれ一部の拡大
した斜視図である。FIG. 2 shows the above-mentioned terminal,
(B), (c), (d), (e) is a partially expanded perspective view, respectively.
【図３】端子を接合したプリント配線板をパッケージ基
板とする半導体装置を示すものであり、（ａ），
（ｂ），（ｃ），（ｄ）はそれぞれ概略断面図である。FIG. 3 is a diagram showing a semiconductor device in which a printed wiring board having terminals joined thereto is used as a package substrate,
(B), (c), (d) is a schematic sectional drawing, respectively.
【図４】従来例の概略図である。FIG. 4 is a schematic view of a conventional example.
１ プリント配線板 ２ 導体回路 ３ 端子 ４ 凹部 1 printed wiring board 2 conductor circuit 3 terminal 4 recess
Claims (1)
の先部を密着させて加圧しつつ超音波振動を与えること
によって、端子を導体回路に金属拡散接合させるにあた
って、接合部の近傍においてその基部寄りの表面に凹部
を凹設した端子を用いることを特徴とするプリント配線
板への端子の接続方法。1. A metal diffusion bonding of a terminal to a conductor circuit by applying ultrasonic vibration while pressing the tip of the terminal closely to the surface of the conductor circuit of the printed wiring board and applying pressure to the conductor circuit in the vicinity of the bonding portion. A method of connecting a terminal to a printed wiring board, characterized in that a terminal having a concave portion provided on the surface near the base is used.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5004586A JP2777036B2 (en) | 1993-01-14 | 1993-01-14 | How to connect terminals to printed wiring boards |
| US08/063,059 US5403785A (en) | 1991-03-03 | 1993-05-19 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5004586A JP2777036B2 (en) | 1993-01-14 | 1993-01-14 | How to connect terminals to printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06216505A true JPH06216505A (en) | 1994-08-05 |
| JP2777036B2 JP2777036B2 (en) | 1998-07-16 |
Family
ID=11588147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5004586A Expired - Lifetime JP2777036B2 (en) | 1991-03-03 | 1993-01-14 | How to connect terminals to printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2777036B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0732744A3 (en) * | 1995-03-17 | 1997-08-27 | Seiko Epson Corp | Resin sealing type semiconductor device and method of making the same |
| JP2002164461A (en) * | 2000-11-24 | 2002-06-07 | Kyocera Corp | Ceramic circuit board |
| US6822420B2 (en) | 2000-03-14 | 2004-11-23 | Matsushita Electric Industrial Co., Ltd. | Battery power source device including rechargeable battery and circuit board joined thereto |
| JP2008141058A (en) * | 2006-12-04 | 2008-06-19 | Hitachi Ltd | Electronic device |
| WO2011046036A1 (en) * | 2009-10-14 | 2011-04-21 | 株式会社小糸製作所 | Circuit device and production method therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03494A (en) * | 1989-05-30 | 1991-01-07 | Koito Mfg Co Ltd | Ultrasonic welding method and ultrasonic horn as well as ultrasonical weldment |
| JPH0338033A (en) * | 1989-07-05 | 1991-02-19 | Sony Corp | Low temperature etching system |
-
1993
- 1993-01-14 JP JP5004586A patent/JP2777036B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03494A (en) * | 1989-05-30 | 1991-01-07 | Koito Mfg Co Ltd | Ultrasonic welding method and ultrasonic horn as well as ultrasonical weldment |
| JPH0338033A (en) * | 1989-07-05 | 1991-02-19 | Sony Corp | Low temperature etching system |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0732744A3 (en) * | 1995-03-17 | 1997-08-27 | Seiko Epson Corp | Resin sealing type semiconductor device and method of making the same |
| US5777380A (en) * | 1995-03-17 | 1998-07-07 | Seiko Epson Corporation | Resin sealing type semiconductor device having thin portions formed on the leads |
| US6822420B2 (en) | 2000-03-14 | 2004-11-23 | Matsushita Electric Industrial Co., Ltd. | Battery power source device including rechargeable battery and circuit board joined thereto |
| JP2002164461A (en) * | 2000-11-24 | 2002-06-07 | Kyocera Corp | Ceramic circuit board |
| JP2008141058A (en) * | 2006-12-04 | 2008-06-19 | Hitachi Ltd | Electronic device |
| JP4537370B2 (en) * | 2006-12-04 | 2010-09-01 | 日立オートモティブシステムズ株式会社 | Electronic equipment |
| WO2011046036A1 (en) * | 2009-10-14 | 2011-04-21 | 株式会社小糸製作所 | Circuit device and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2777036B2 (en) | 1998-07-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980414 |