JP2012039018A - Electronic apparatus and method of manufacturing the same - Google Patents

Electronic apparatus and method of manufacturing the same Download PDF

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JP2012039018A
JP2012039018A JP2010179929A JP2010179929A JP2012039018A JP 2012039018 A JP2012039018 A JP 2012039018A JP 2010179929 A JP2010179929 A JP 2010179929A JP 2010179929 A JP2010179929 A JP 2010179929A JP 2012039018 A JP2012039018 A JP 2012039018A
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lead
wiring pattern
lead frame
electronic device
main body
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JP5433526B2 (en
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Isamu Yoshida
勇 吉田
Koji Sasaki
康二 佐々木
Michiaki Hiyoshi
道明 日吉
Seiichi Hayakawa
誠一 早川
Takehide Yokozuka
剛秀 横塚
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Hitachi Ltd
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

PROBLEM TO BE SOLVED: To provide, in an ultrasonic bonding between a metal of a wiring pattern and a metal of a lead, a technology for allowing excellent bonding with minimizing an not-bonded section.SOLUTION: One surface of a portion of a lead to be bonded to a wiring pattern is curved convexly prior to an ultrasonic bonding. In a state that the convex surface is directed toward the wiring pattern, a supersonic wave application means is pressed against a reverse surface of the convex surface to apply supersonic waves, and the ultrasonic bonding is thus performed between the lead and the wiring pattern with minimizing an not-bonded section.

Description

本発明は、絶縁基板上に複数個の半導体素子を搭載し、配線パターンに超音波接合によりリードフレームを接続する電子機器（特にパワーモジュール）とその製造方法に関するものである。   The present invention relates to an electronic device (particularly a power module) in which a plurality of semiconductor elements are mounted on an insulating substrate, and a lead frame is connected to a wiring pattern by ultrasonic bonding, and a method for manufacturing the same.

従来のパワーモジュールは、セラミックなどからなる絶縁基板に銅などからなる配線パターンを形成し、複数個の半導体素子が搭載されモジュール内に収納する構造となっている。このようなパワーモジュールにおいては、各半導体素子の電極と配線パターンや配線パターン間、配線パターンと外部接続用リードなどの接続にワイヤボンディングが用いられており、大電流を流すため複数本のワイヤを並列にボンディングする方法を用いていた。   A conventional power module has a structure in which a wiring pattern made of copper or the like is formed on an insulating substrate made of ceramic or the like, and a plurality of semiconductor elements are mounted and housed in the module. In such a power module, wire bonding is used for connection between the electrodes of each semiconductor element and the wiring pattern or between the wiring patterns, between the wiring pattern and the external connection leads, etc. The method of bonding in parallel was used.

近年、パワーモジュールの小型化の要求から接続占有面積をワイヤボンディング時の面積より小さく出来る板状のリードを用いる方法が考案された。板状のリードの接続方法としては超音波を用いる方法がある。   In recent years, a method using a plate-like lead capable of making the connection occupation area smaller than the area at the time of wire bonding has been devised due to the demand for miniaturization of the power module. As a method for connecting the plate-like leads, there is a method using ultrasonic waves.

図８、９を用いて説明する。図８は、配線パターン１とリード２の接合界面の接合状態の遷移を示す。状態１は、基板３上にリード２が設置されホーン（図示せず）に設置されたツール４の先端がある接合準備状態である。そして、リード２の上面からツール４で押圧しながら所定の周波数で水平方向に超音波振動させる。押圧と超音波振動により金属表面にあった汚れや酸化膜を除去し接合される。ツール４の先端には、ホーンの振動をリード２に滑りを起こすことなく伝えるために、複数の角錐状の突起部５が形成されている。この突起部５がリード２に食い込むとこによりリード２に滑りなく振動を伝えることが出来る。状態２は、接合が開始間もない状態のイメージ図である。接合が開始されたので未接合部７は、少し減少を始めている。状態３は、接合終了時の状態を表している。リード２はツールの押圧と振動により変形し、未接合部７はまばらに存在している。図９はリードの引張り強度試験後の配線パターン１上に残ったリード２の圧痕１９を示す。未接合部７は圧痕１９の中央部に存在していることがわかる。このように未接合部が残ってしまう原因として、酸化膜の厚さや表面の汚れ、ミクロ的に見た表面の凹凸などが考えられる。   This will be described with reference to FIGS. FIG. 8 shows the transition of the bonding state of the bonding interface between the wiring pattern 1 and the lead 2. State 1 is a state where the lead 2 is installed on the substrate 3 and the tip of the tool 4 installed on a horn (not shown) is present in a bonding preparation state. Then, the ultrasonic vibration is performed in the horizontal direction at a predetermined frequency while pressing with the tool 4 from the upper surface of the lead 2. Dirt and oxide film on the metal surface are removed and bonded by pressing and ultrasonic vibration. A plurality of pyramidal projections 5 are formed at the tip of the tool 4 in order to transmit the vibration of the horn to the lead 2 without causing any slip. When the protrusion 5 bites into the lead 2, vibration can be transmitted to the lead 2 without slipping. State 2 is an image diagram of a state in which joining has just started. Since the joining is started, the unjoined portion 7 starts to decrease slightly. State 3 represents a state at the end of joining. The lead 2 is deformed by the pressing and vibration of the tool, and the unjoined portions 7 are sparsely present. FIG. 9 shows the indentation 19 of the lead 2 remaining on the wiring pattern 1 after the lead tensile strength test. It can be seen that the unjoined portion 7 exists in the center of the indentation 19. The reason why the unjoined portion remains in this way is considered to be the thickness of the oxide film, surface contamination, surface unevenness as seen microscopically, and the like.

このような未接合部が存在すると接合強度が低下し信頼性も低下するなど製品品質のバラツキを大きくすることになる。未接合部を低減し良好な接合をする方法として、柔らかい（ビッカース硬度８０以下）リードを用いて変形しやすくさせる方法がある。(特許文献１参照)また、リードの接合面に酸化膜厚以上の高さを持つ突起を設けることにより酸化膜を積極的に破壊する方法がある。(特許文献２参照)   If such an unjoined portion exists, the product quality varies greatly, for example, the joint strength is lowered and the reliability is also lowered. As a method for reducing unjoined portions and achieving good bonding, there is a method for making deformation easy using a soft (Vickers hardness of 80 or less) lead. There is also a method of actively destroying the oxide film by providing a protrusion having a height higher than the oxide film thickness on the bonding surface of the lead. (See Patent Document 2)

特許第３５２４３６０号Japanese Patent No. 3524360 特開２００５−２５９８８０号JP-A-2005-259880

しかし、特許文献１の方法では、ＪＩＳ規格で規定されている硬度には幅があり（例えば、無酸素銅１／４Ｈのビッカース硬度（参考値）：５５〜１００）、同じ名称の材質を購入しても硬度に約２倍の差があり安定した品質を確保するのが困難である。   However, in the method of Patent Document 1, there is a range in the hardness specified in the JIS standard (for example, Vickers hardness (reference value) of oxygen-free copper 1 / 4H (reference value): 55 to 100), and a material having the same name is purchased. Even so, there is a difference of about twice in hardness, and it is difficult to ensure stable quality.

また、特許文献２の方法では、リードの接合面に酸化膜厚以上の突起（加工性を考慮して５０μm程度）を複数設けるにはいろいろな方法があるがコストがかかるという問題があった。   Further, the method of Patent Document 2 has various problems in providing a plurality of protrusions (approximately 50 μm in consideration of processability) having a thickness greater than that of the oxide film on the joint surface of the lead, but there is a problem that costs are increased.

本発明の目的は、上記記載した従来技術の課題を解消し、配線パターンとリードの金属同士を接続させる超音波接合時に良好な接合が可能な技術を提供することにある。   An object of the present invention is to solve the above-described problems of the prior art and to provide a technique capable of good bonding at the time of ultrasonic bonding in which a wiring pattern and a metal of a lead are connected to each other.

本発明は上記目的を達成するために、超音波接合前にリードの配線パターンに接合される接続部の一方の面を凸状に湾曲させ、凸状の面を配線パターンに向けた状態で、凸状の面とは反対の面に超音波印加手段を押圧して超音波を引加し、リードと配線パターンとを超音波接合する。   In order for the present invention to achieve the above object, one surface of a connecting portion to be joined to a lead wiring pattern before ultrasonic bonding is curved in a convex shape, and the convex surface is directed to the wiring pattern. The ultrasonic wave application means is pressed against the surface opposite to the convex surface to apply ultrasonic waves, and the leads and the wiring pattern are ultrasonically bonded.

本発明では、配線とリードを超音波接合により接続する際に未接合部を低減させ良好な接合を行い、接合品質の安定化と生産性の向上を図ることができる。   In the present invention, when the wiring and the lead are connected by ultrasonic bonding, the unbonded portion is reduced and good bonding is performed, so that the bonding quality can be stabilized and the productivity can be improved.

本発明の第一の実施例の接合状態の遷移の接合イメージ図である。It is a junction image figure of transition of a junction state of the 1st example of the present invention. 本発明の第一の実施例に係るパワーモジュールの斜視図である。1 is a perspective view of a power module according to a first embodiment of the present invention. 本発明の第一の実施例に係るパワーモジュールの展開図である。It is an expanded view of the power module which concerns on the 1st Example of this invention. 本発明の第一の実施例のリードの部分拡大図と断面形状である。It is the elements on larger scale and the cross-sectional shape of the lead | read | reed of 1st Example of this invention. 本発明の第一の実施例の引張り強度試験後の基板側の破面である。It is a fracture surface on the substrate side after the tensile strength test of the first embodiment of the present invention. 本発明の第二の実施例のリード形状である。It is a lead shape of the 2nd example of the present invention. 本発明の第三の実施例のリード形状である。It is a lead shape of the 3rd example of the present invention. 従来の接合状態の遷移の接合イメージ図である。It is a joining image figure of the transition of the conventional joining state. 従来の方式で接合した引張り強度試験後の基板側の破面である。It is a fracture surface on the substrate side after a tensile strength test joined by a conventional method.

以下、本発明の実施の形態を説明する。   Embodiments of the present invention will be described below.

図２は本発明の第一の実施例に係るパワーモジュールの斜視図である。ベース８は、筐体の底面を形成しており、放熱性の観点から主に熱伝導性の良いアルミや銅や銅合金などで作られる。ケース９は、筐体の側面を形成しており、形状の複雑さからプラスチックが主流である。ベース８とケース９とは、ねじや接着剤などで固定されている。ベース８上には基板３が搭載され、その上にリード２が配置され、基板３とリード２の接続部は超音波接合により接続されている。ケース９には外部端子（図示せず）と接続する際に使用するねじ穴１０が設けられており、信号リード１１も設置されている。   FIG. 2 is a perspective view of the power module according to the first embodiment of the present invention. The base 8 forms the bottom surface of the housing, and is mainly made of aluminum, copper, copper alloy, or the like having good thermal conductivity from the viewpoint of heat dissipation. The case 9 forms the side surface of the housing, and plastic is the mainstream due to the complexity of the shape. The base 8 and the case 9 are fixed with screws or an adhesive. A substrate 3 is mounted on the base 8, and the leads 2 are disposed thereon, and the connecting portion between the substrate 3 and the leads 2 is connected by ultrasonic bonding. The case 9 is provided with a screw hole 10 used when connecting to an external terminal (not shown), and a signal lead 11 is also provided.

図３は本発明の第一の実施例に係るパワーモジュールの展開図である。リード２はリード２ａ、２ｂ、２ｃの３本から構成されており各リード間には絶縁部材１２ａ、１２ｂが設置されている。絶縁部材１２は、耐圧の観点からリードよりやや大きめに設計されており、材質は不織布やプラスチックなどが用いられる。基板３上には配線パターン１があり、その配線パターン１上には半導体素子１３が複数搭載されている。図中には記載していないが、通常、配線パターン１や半導体素子１３、信号リード１１などの電気的な接続には多数のワイヤが用いられる。ワイヤには、主にアルミ製の直径０．３〜０．５ｍｍのものが使用される。   FIG. 3 is a development view of the power module according to the first embodiment of the present invention. The lead 2 is composed of three leads 2a, 2b and 2c, and insulating members 12a and 12b are provided between the leads. The insulating member 12 is designed to be slightly larger than the lead from the viewpoint of pressure resistance, and the material is a nonwoven fabric or plastic. A wiring pattern 1 is provided on the substrate 3, and a plurality of semiconductor elements 13 are mounted on the wiring pattern 1. Although not shown in the figure, many wires are usually used for electrical connection of the wiring pattern 1, the semiconductor element 13, the signal lead 11, and the like. The wire is mainly made of aluminum and has a diameter of 0.3 to 0.5 mm.

図４は、本発明の第一の実施例のリード２の部分拡大図とＡ−Ａ’ラインでの代表的なリードの断面形状である。リード先端１４は、短辺方向に湾曲している。リード先端１４の断面形状は、平板から切り出す方法や湾曲させる荷重により形状が異なってくる。断面Ａは、主にワイヤカット法により切り出された場合や湾曲させるときの荷重が大きい場合などの形状である。上面と下面のエッジがきちんと形成され、ほぼ平行に上下面が形成され、折り曲げ金型と接触する上面の押圧面１５がほぼ全面に形成されている。一方、断面Ｂは、主に切断型による打抜きにより切り出された平板の切断によりダレた面を下向きにした場合や湾曲させるときの荷重が小さい場合などの形状である。折り曲げ金型と接触する上面の押圧面１５が中央部しかなく、押圧面１５よりも曲率の小さい未押圧面１６が左右に存在している。   FIG. 4 is a partially enlarged view of the lead 2 according to the first embodiment of the present invention and a typical cross-sectional shape of the lead at the A-A ′ line. The lead tip 14 is curved in the short side direction. The cross-sectional shape of the lead tip 14 varies depending on the method of cutting from the flat plate and the load to be bent. The cross-section A has a shape mainly when it is cut out by a wire cutting method or when a load when bending is large. The upper and lower edges are properly formed, the upper and lower surfaces are formed substantially in parallel, and the upper pressing surface 15 that is in contact with the bending mold is formed on the entire surface. On the other hand, the cross-section B has a shape such as a case where a sag surface is made downward by cutting a flat plate cut out mainly by punching with a cutting die or a load when bending is small. The upper pressing surface 15 in contact with the bending mold has only the central portion, and unpressed surfaces 16 having a smaller curvature than the pressing surface 15 exist on the left and right.

図１は本発明の第一の実施例の接合状態の遷移の接合イメージ図である。状態１は、基板３上にリード２が設置されホーン（図示せず）に設置されたツール４の先端がある接合準備状態である。そして、リード２の上面からツール４で押圧しながら所定の周波数で水平方向に超音波振動させる。押圧と超音波振動により金属表面にあった汚れや酸化膜を除去し接合される。ツール４の先端には、ホーンの振動をリード２に滑りを起こすことなく伝えるために、複数の角錐状の突起部５が形成されている。この突起部５がリード２に食い込むとこによりリード２に滑りなく振動を伝えることが出来る。   FIG. 1 is a joining image diagram of joining state transition of the first embodiment of the present invention. State 1 is a state where the lead 2 is installed on the substrate 3 and the tip of the tool 4 installed on a horn (not shown) is present in a bonding preparation state. Then, the ultrasonic vibration is performed in the horizontal direction at a predetermined frequency while pressing with the tool 4 from the upper surface of the lead 2. Dirt and oxide film on the metal surface are removed and bonded by pressing and ultrasonic vibration. A plurality of pyramidal projections 5 are formed at the tip of the tool 4 in order to transmit the vibration of the horn to the lead 2 without causing any slip. When the protrusion 5 bites into the lead 2, vibration can be transmitted to the lead 2 without slipping.

状態２は、接合当初の状態のイメージ図である。接合が開始されリード２の中央部から接合が始まっている。ツール４による押圧が、面積が小さい中央部に集中しているので、リード２と基板と間の押圧力が大きく、未接合部７を少なくして接合することができる。そして接合中は、リードが中央部から徐々に平らに変形していき、接合部６も徐々に中央部より広がって成長する。このときに、リード２の接合前の部分は、曲面から平面に変形するように応力が働いており、その応力に反発する弾性力が働く。その弾性力は、曲面の端、すなわちリードが基板と接している領域の端の部分６ａに大きく作用し、この部分に基板に押し付ける方向に大きな力が働く。この部分６ａは、接合が起こり新たに接合部になろうとしている部分であるため、接合される部分は未接合部が生じにくくなる。そして、弾性力が大きく作用する部分６ａは、接合が進むに従って徐々に外側に移動していき、未接合の原因となる酸化物が外側に押し出されていく。こうして徐々に未接合部が少ない接合部６が形成されていく。また、ツール４は、接合が進むにつれて基板の方向に進んでいく。   State 2 is an image diagram of the initial state of joining. Joining is started and joining is started from the center of the lead 2. Since the pressing by the tool 4 is concentrated on the central portion having a small area, the pressing force between the lead 2 and the substrate is large, and the unbonded portion 7 can be reduced and bonded. During bonding, the lead gradually deforms flat from the central portion, and the bonding portion 6 gradually grows from the central portion and grows. At this time, a stress is applied to the portion of the lead 2 before joining so as to be deformed from a curved surface to a flat surface, and an elastic force repelling the stress is applied. The elastic force is greatly applied to the end 6a of the end of the curved surface, that is, the end of the region where the lead is in contact with the substrate, and a large force acts in this direction in the direction of pressing against the substrate. Since this part 6a is a part that has joined and is about to become a joined part, an unjoined part is less likely to occur in the joined part. Then, the portion 6a where the elastic force acts greatly moves outward as the joining progresses, and the oxide that causes unjoining is pushed outward. In this way, joints 6 with few unjoined parts are gradually formed. Further, the tool 4 advances in the direction of the substrate as the bonding progresses.

図８に示す従来の接合では、リード２ｅの下面全域に接合の全時間にわたってほぼ均等に押圧が加わるため、面積あたりの押圧は小さく、未接合部６ができやすい。   In the conventional bonding shown in FIG. 8, since the pressure is almost uniformly applied to the entire lower surface of the lead 2e over the entire bonding time, the pressing per area is small and the unbonded portion 6 is easily formed.

図１の状態３は、接合終了時の状態を表している。リード２はツールの押圧と振動により、接合前よりも平面に近づくように変形しており、接合部６の両側でありリード２の端には、接合できず基板と空隙を有して対向している端部未接合部７ａが残っている。しかしながら、接合部内に点在する未接合部は、従来より低減した状態で接合が完了しており、従来よりも強固な接合となっている。   A state 3 in FIG. 1 represents a state at the end of joining. The lead 2 is deformed so as to be closer to a plane than before joining by pressing and vibration of the tool, and cannot be joined to both ends of the joining portion 6 and the end of the lead 2 with a substrate and a gap. The unjoined end portion 7a remains. However, the unjoined portions scattered in the joined portion have been joined in a state of being reduced as compared with the prior art, and the joining is stronger than before.

図５は本発明の第一の実施例の接合後のリード上面とリードの引張り強度試験後の基板側の代表的な破面である。上の写真は、接合後のリード上面であり、下の６枚の写真は、基板側の破面であり、接合は３つの接合エネルギーで２回ずつ行った。リード２の上面にはツール先端の突起部の跡が残っている。破面の写真中には点線でリード初期形状の大きさを表している。この破面形状の違いは主に接合エネルギーの違いによる影響で接合がリードの中央部から始まっていることが良くわかる。また、図９に比べて未接合部が低減されていることがわかる。   FIG. 5 is a representative fracture surface on the substrate side after the lead upper surface after bonding and the tensile strength test of the lead in the first embodiment of the present invention. The upper photo is the upper surface of the lead after bonding, the lower six photos are the fracture surfaces on the substrate side, and bonding was performed twice with three bonding energies. On the upper surface of the lead 2, a trace of the protrusion at the tip of the tool remains. In the photograph of the fracture surface, the size of the initial shape of the lead is represented by a dotted line. It can be clearly seen that the difference in the fracture surface shape is mainly due to the difference in bonding energy, and the bonding starts from the center of the lead. Further, it can be seen that the unjoined portion is reduced as compared with FIG.

上記のように構成することにより、リードの中央部より接合が開始され未接合部の低減することができる。また、未接合部を低減できるので接合強度の安定化と温度サイクル信頼性の向上も図ることができる。   By comprising as mentioned above, joining is started from the center part of a lead | read | reed and an unjoined part can be reduced. Moreover, since unjoined parts can be reduced, it is possible to stabilize the joint strength and improve the temperature cycle reliability.

図６は本発明の第二の実施例のリード形状である。リード先端１４は、長手方向に湾曲している点が第一の実施例と異なっており、他は第一の実施例と同様であり、同様の作用効果を奏する。リード先端１４は、幅よりも長さ方向（長手方向）が長い形状をしているが、この方向に湾曲させることにより、第一の実施例に比べて接合初期に配線パターンを接触している面積が小さくできるので、初期荷重を小さくし、より安定した接合が可能である。   FIG. 6 shows the lead shape of the second embodiment of the present invention. The lead tip 14 is different from the first embodiment in that the lead tip 14 is curved in the longitudinal direction, and the other points are the same as those in the first embodiment. The lead tip 14 has a shape that is longer in the length direction (longitudinal direction) than the width. By bending in this direction, the lead pattern 14 is in contact with the wiring pattern at an early stage of bonding compared to the first embodiment. Since the area can be reduced, the initial load can be reduced and more stable joining is possible.

上記のように構成することにより、リードの中央部より接合が開始され未接合部の低減することができる。また、未接合部を低減できるので接合強度の安定化と温度サイクル信頼性の向上も図ることができる。   By comprising as mentioned above, joining is started from the center part of a lead | read | reed and an unjoined part can be reduced. Moreover, since unjoined parts can be reduced, it is possible to stabilize the joint strength and improve the temperature cycle reliability.

図７は本発明の第三の実施例のリード形状である。リード先端１４は、長手方向にＶ字状に屈曲している点が、第二の実施例と異なっており、他は第二の実施例と同様であり、同様の作用効果を奏する。Ｖ字状に屈曲させることにより第二の実施例に比べて接合初期に配線パターンを接触している面積がさらに小さくできるので、初期荷重を小さくし、より安定した接合が可能である。さらにリードの折り曲げ金型を単純化でき、金型コストを低減できる効果もある。   FIG. 7 shows the lead shape of the third embodiment of the present invention. The lead tip 14 is different from the second embodiment in that the lead tip 14 is bent in a V shape in the longitudinal direction, and the other points are the same as those of the second embodiment, and have the same effects. By bending in a V shape, the area where the wiring pattern is in contact at the initial stage of bonding can be further reduced compared to the second embodiment, so that the initial load can be reduced and more stable bonding is possible. Furthermore, it is possible to simplify the lead bending mold and reduce the mold cost.

上記のように構成することにより、リードの中央部より接合が開始され未接合部の低減することができる。また、未接合部を低減できるので接合強度の安定化と温度サイクル信頼性の向上も図ることができる。   By comprising as mentioned above, joining is started from the center part of a lead | read | reed and an unjoined part can be reduced. Moreover, since unjoined parts can be reduced, it is possible to stabilize the joint strength and improve the temperature cycle reliability.

１…配線パターン、２…リード、３…基板、４…ツール、５…突起部、６…接合部、６ａ…接合端 ７ａ…未接合部、７ｂ…端部未接合部、１４…リード先端、１７…ツール跡、１８…リード初期形状。   DESCRIPTION OF SYMBOLS 1 ... Wiring pattern, 2 ... Lead, 3 ... Board | substrate, 4 ... Tool, 5 ... Projection part, 6 ... Joining part, 6a ... Joining end 7a ... Unjoining part, 7b ... End part unjoining part, 14 ... Lead tip, 17 ... Tool trace, 18 ... Initial lead shape.

Claims (12)

基板上に形成した配線パターンと、
前記配線パターン上に搭載した半導体素子と、
金属板から形成され、前記配線パターンに超音波接合により接続された接続部を有するリードフレームを有する電子機器において、
前記リードフレームの接続部は、前記配線パターンに接合される接合領域と、当該接合領域の両側に形成され、前記配線パターンに空隙を有して対向する端部未接合領域とを備えたことを特徴とする電子機器。 A wiring pattern formed on the substrate;
A semiconductor element mounted on the wiring pattern;
In an electronic device having a lead frame formed of a metal plate and having a connection portion connected to the wiring pattern by ultrasonic bonding,
The connecting portion of the lead frame includes a bonding area bonded to the wiring pattern, and an end unbonded area formed on both sides of the bonding area and facing the wiring pattern with a gap. Features electronic equipment. 請求項１において、
前記リードフレームは、リードフレーム本体と、前記リードフレーム本体から突出し、前記配線パターンに接続されている前記接続部を有するリード先端部とを有し、
前記端部未接合領域は、前記リード先端部の幅方向における前記接合領域の両側に形成されていることを特徴とする電子機器。 In claim 1,
The lead frame has a lead frame main body, and a lead tip portion that protrudes from the lead frame main body and has the connection portion connected to the wiring pattern,
2. The electronic device according to claim 1, wherein the end unjoined region is formed on both sides of the joined region in the width direction of the lead tip. 請求項１または請求項２において、
前記リードフレームは、リードフレーム本体と、前記リードフレーム本体から突出し、前記配線パターンに接続されている前記接続部を有するリード先端部とを有し、
前記端部未接合領域は、前記リード先端部の長手方向における前記接合領域の両側に形成されていることを特徴とする電子機器。 In claim 1 or claim 2,
The lead frame has a lead frame main body, and a lead tip portion that protrudes from the lead frame main body and has the connection portion connected to the wiring pattern,
2. The electronic apparatus according to claim 1, wherein the end unjoined area is formed on both sides of the joined area in the longitudinal direction of the lead tip. 請求項１乃至３のいずれかにおいて、
前記電子機器は、
前記配線パターンが形成された基板と、
前記基板及び前記半導体素子を内蔵する筐体と、
当該筐体に設けられ、前記配線パターン、前記リード、または前記半導体素子に電気的に接続される端子とを備えたパワーモジュールであることを特徴とする電子機器。 In any one of Claims 1 thru | or 3,
The electronic device is
A substrate on which the wiring pattern is formed;
A housing containing the substrate and the semiconductor element;
An electronic device comprising a power module provided in the housing and provided with the wiring pattern, the lead, or a terminal electrically connected to the semiconductor element. 配線パターンと、
前記配線パターンに超音波接合されたリードとを備えた電子機器の製造方法において、
前記超音波接合前の前記リードは、前記配線パターンに接合される接続部の一方の面が凸状に湾曲しており、
前記凸状の面を前記配線パターンに向けた状態で、前記凸状の面とは反対の面に超音波印加手段を押圧して超音波を印加し、前記リードと前記配線パターンとを接合することを特徴とする電子機器の製造方法。 A wiring pattern;
In a method of manufacturing an electronic device comprising a lead ultrasonically bonded to the wiring pattern,
The lead before the ultrasonic bonding has one surface of a connecting portion bonded to the wiring pattern curved in a convex shape,
With the convex surface facing the wiring pattern, an ultrasonic wave is applied to the surface opposite to the convex surface to apply ultrasonic waves to bond the lead and the wiring pattern. A method for manufacturing an electronic device. 請求項５において、
前記超音波接合前の前記リードの前記凸状の面とは反対の面は、凹状に湾曲していることを特徴とする電子機器の製造方法。 In claim 5,
A method of manufacturing an electronic device, wherein a surface opposite to the convex surface of the lead before the ultrasonic bonding is curved in a concave shape. 請求項５または請求項６において、
前記リードは、金属板から形成されたものであることを特徴とする電子機器の製造方法。 In claim 5 or claim 6,
The lead is formed of a metal plate, and the manufacturing method of the electronic device characterized by the above-mentioned. 請求項に６おいて、
平坦な前記リードの接続部を曲げ、前記凸状の面及び前記凹状の面を形成する工程とを含むことを特徴とする電子機器の製造方法。 In claim 6,
And bending the flat connecting portion of the lead to form the convex surface and the concave surface. 請求項６において、
金属板から前記リードフレームを打ち抜き切り出しをすることにより、前記凸状の面及び前記凹状の面を形成する工程とを含むことを特徴とする電子機器の製造方法。 In claim 6,
Forming the convex surface and the concave surface by punching and cutting out the lead frame from a metal plate. 請求項６において、
前記凹状の面は、その中心部よりも曲率が小さい端部を有することを特徴とする電子機器の製造方法。 In claim 6,
The method of manufacturing an electronic device, wherein the concave surface has an end portion having a smaller curvature than a central portion thereof. 請求項５乃至１０のいずれかにおいて、
前記リードフレームは、リードフレーム本体と、前記リードフレーム本体から突出し、前記配線パターンに接続されている前記接続部を有するリード先端部とを有し、
前記凸状の湾曲は、前記リード先端部の幅方向に湾曲するように形成されていることを特徴とする電子機器の製造方法。 In any of claims 5 to 10,
The lead frame has a lead frame main body, and a lead tip portion that protrudes from the lead frame main body and has the connection portion connected to the wiring pattern,
The method of manufacturing an electronic device, wherein the convex curve is formed so as to bend in the width direction of the lead tip. 請求項５乃至１０のいずれかにおいて、
前記リードフレームは、リードフレーム本体と、前記リードフレーム本体から突出し、前記配線パターンに接続されている前記接続部を有するリード先端部とを有し、
前記凸状の湾曲は、前記リード先端部の長手方向に湾曲するように形成されていることを特徴とする電子機器の製造方法。 In any of claims 5 to 10,
The lead frame has a lead frame main body, and a lead tip portion that protrudes from the lead frame main body and has the connection portion connected to the wiring pattern,
The method of manufacturing an electronic device, wherein the convex curve is formed so as to curve in a longitudinal direction of the lead tip.
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