JPH06283577A - Bonding method of tab inner lead - Google Patents

Abstract

PURPOSE:To reduce the mounting cost in the case of bonding of the electrode of a semiconductor element and the inner lead of a TAB tape, and realize narrow pitch connection and high reliability bonding. CONSTITUTION:A bonding tool 11 whose tip part is smaller than electrode 12 of a semiconductor element and which has roundness at the tip is pressed against an inner lead 13 with load F, and a recess 16 is formed on the inner lead 13. At the same time, ultrasonic frequency vibration 18 is applied while a protrusion 19 is formed on the electrode side surface of the inner lead 13, and it is thermocompression-bonded to the electrode 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining an inner lead of a tape carrier for TAB (Tape Automated Bonding) used for mounting a semiconductor element and an electrode of the semiconductor element.

[0002]

2. Description of the Related Art Generally, when joining an inner lead and an electrode of a semiconductor element, either the electrode portion 12 of the semiconductor element 15 or the tip portion of the inner lead 13 of the tape carrier as shown in FIG. After forming the bumps 22 on one side, the inner leads 1 are formed on the electrodes 12 via the bumps 22.
3 were joined. Here, as shown in FIG. 10, the bonding tool 21 used for bonding has a tip portion that is larger than the width of the inner lead 13 and has a size equal to or larger than the opening portion of the electrode 12, and has a tip shape. Figure 11
As shown in (a) and (b), the tip end face having a flat end surface is generally used. Here, FIG. 11 (a) shows a conventional bonding tool 21a having a flat tip portion, and FIG. 11 (b) shows a conventional bonding tool 21b having a flat tip end surface and a cross-shaped minute convex portion. Show.

As a method of forming bumps on the electrode portion of a semiconductor element, for example, "ISHM'88 Proceedings" (1988) 117.
As described on pages 124 to 124, a method of forming projections which directly become bumps on the electrode portion by plating, or "Showa 60"
"Transfer bump method, in which bumps are transferred to electrode parts after bumps are formed on a glass substrate as described in" Proceedings of the Annual Conference of the Institute of Electronics and Communication Engineers Semiconductor and Materials Division, Lecture No. 2 "(November 1985). There is.

Further, as shown in FIG. 12, there is a method in which the inner lead 13 is directly connected to the electrode 12 of the semiconductor element by a thermocompression bonding method using ultrasonic waves similarly to the wire bonding method without forming bumps. Hereinafter, a method of directly bonding the inner leads to the electrodes of the semiconductor element without using bumps is called a direct bonding method. As such a direct bonding method, Japanese Patent Application Laid-Open No. 2-1191
No. 53 is known. In the conventional direct bonding method described in this publication, a bonding tool whose tip portion is larger than the width of the inner lead is used, and ultrasonic vibration is applied in the longitudinal direction of the inner lead to perform bonding. In addition, as shown in FIG.
The second opening was formed to be large enough so that the tip of the inner lead 13 could be directly contacted.

[0005]

As described above, the conventional T
In the AB inner lead joining method, it is necessary to form bumps on either the semiconductor element or the inner lead. Generally, complicated steps such as lithography are required to form bumps, and expensive equipment is required. Further, it is difficult to achieve bump formation with a yield of 100%, and there is a problem that an expensive semiconductor element or an expensive TAB tape is damaged in the bump forming process. Due to these causes, the conventional TAB inner lead joining method that requires a bump forming step has a problem of high mounting cost. Further, in the conventional method of connecting the inner leads to the electrodes of the semiconductor element through the bumps, it is difficult to make the bumps finer, and thus it is difficult to make a narrow pitch connection such as an electrode pitch of 50 to 60 μm. was there.

On the other hand, in the conventional direct bonding method, as shown in FIG.
Is a passivation film 1 whose periphery is convex with respect to the electrode surface.
Since it was surrounded by 4, it was difficult to directly contact the inner lead 13 with the electrode 12. In order to directly contact the inner lead 13 with the electrode, as shown in FIG.
As shown in, the electrode opening needs to be formed sufficiently larger than the size of the contact portion at the tip of the inner lead. In this case, the pitch between the electrodes increases, which makes it difficult to connect in a narrow pitch, and the size of the semiconductor element increases.
There is a problem that the number of semiconductor elements that can be formed per wafer is reduced and the price of the semiconductor elements themselves is increased.

Even if the inner lead can be brought into contact with the electrode surface, the conventional direct bonding method has a problem that the electrode surface is apt to be damaged by cracks or the like at the time of bonding. The cause of this is considered as follows. Figure 9
(A) is a front view showing the conventional direct bonding method. The inner lead 13 is generally composed of a Cu foil as a base material and Au or Sn is flash-plated on the Cu foil. Cu is a commonly used bump material A
Since it is harder and less likely to be deformed than u, the edge portion 20 of the inner lead 13 and the electrode 12 can be applied by applying a bonding load.
Excessive normal stress is generated near the contact area with. When the ultrasonic vibration 18 is applied under such a contact state, as shown in FIG.
As shown in (b), an excessive shear stress τ was generated in the vicinity of the edge portion 20 of the inner lead 13, and the electrode surface 12 was easily damaged by cracks or the like. In order to prevent damage such as cracks, it is necessary to reduce the bonding load or ultrasonic energy, and the joint strength is reduced. As described above, in the conventional direct bonding, it is difficult to perform high-strength bonding without causing damage such as cracks on the electrode surface. Further, in the conventional direct bonding method, since ultrasonic vibration is applied in the longitudinal direction of the inner lead, it is possible to bond to a semiconductor element having electrodes formed on two opposite sides. There has been a problem that it is difficult to join semiconductor elements having electrodes formed on all four sides.

An object of the present invention is to solve the conventional problems as described above, to provide a low cost TAB inner lead joining method that does not require a bump forming step, and to provide a TAB inner lead that enables narrow pitch connection. A highly reliable TA that can be joined with sufficient strength by providing a joining method and without damaging the electrode surface of the semiconductor element with cracks or the like.
To provide a B inner lead bonding method, and to provide a TAB inner lead bonding method capable of connecting to a semiconductor device having electrodes formed on all four sides of the semiconductor device without forming bumps. It is in.

[0009]

The present invention relates to a method for connecting electrodes of a semiconductor element and inner leads of a TAB tape by a single bonding method, wherein a bonding tool having a tip portion smaller than an electrode opening portion of the semiconductor element is used. It is characterized in that ultrasonic energy is applied to the bonding tool while pressing the inner lead to form a recess in the inner lead and forming a protrusion on the surface of the inner lead on the electrode side.

The bonding tool may have a rounded tip. Further, the recess may be smaller than the width of the inner lead. The size of the electrode opening of the semiconductor element in the width direction of the inner lead may be smaller than the width of the inner lead.

[0011]

In the method of joining the TAB inner leads of the present invention, after the inner leads 13 and the electrodes 12 of the semiconductor element 15 are aligned, the bonding tool 11 is pressed against the inner leads 13 as shown in FIG. Here, FIGS. 1A and 1B are a front view and a side view, respectively, showing a method of joining the inner leads. Since the tip of the bonding tool 11 is smaller than the size of the opening of the electrode 12 of the semiconductor element 15, the inner lead 13
A concave recess 16 is formed by transferring the tip shape of the bonding tool 11, and at the same time, a minute convex portion 19 can be formed on the bottom surface of the inner lead 13. As described above, according to the present invention, since the minute protrusions 19 serving as contact points with the electrode surface 12 are formed on the bottom surface of the inner lead during bonding,
The inner leads can be directly contacted with the electrodes 12 without using bumps.

In general, the electrode of the semiconductor element is an Al electrode, and a natural oxide film exists on the surface layer of the electrode. Therefore, it is necessary to destroy the natural oxide film in order to perform inner lead bonding. Here, the minimum shear stress required to destroy the natural oxide film on the electrode surface is defined as τ min, and the electrode surface 1
Let τmax be the shear stress that causes cracks in 2
In order to perform bonding without causing damage such as cracks on the electrode surface 12, it is necessary to apply a load and ultrasonic vibration to the bonding tool 11 so that the maximum shear stress of the bonding portion 17 becomes τ max or less. In order to prevent damage such as cracks generated on the electrode surface and to perform bonding with sufficient strength, it is necessary to form a region where a shear stress of τmin or more acts as large as possible. For this purpose, it is important to form a uniform shear stress distribution in the joint portion 17.

In the present invention, as shown in FIGS. 1 (a) and 1 (b), ultrasonic vibration is applied while forming the recess 16 to break the oxide film existing on the surface layer of the electrode 12 and perform the bonding. Convex part 1
As compared with the conventional direct bonding method in which no convex portion is formed, since the bonding is performed through the inner lead 9, the inner lead 13 is connected to the electrode 12 without causing damage such as cracks on the electrode surface. Can be bonded with sufficient strength. Further, as shown in FIG. 1B, the inner lead 13 contacts the passivation film 14 around the electrode, but since the bonding tool 11 having a tip portion smaller than the electrode 12 is used, the passivation film 1
The joining can be performed without generating an excessive stress that damages the No. 4. Here, the bonding tool 11 is in close contact with the recess 16 and can efficiently transmit ultrasonic energy to the bonding surface. Although not shown in the drawing, the semiconductor element 15 is heated to a temperature necessary for forming an alloy layer by a heating device. In the method of applying ultrasonic vibration while forming the recess 16 to bond the inner lead to the electrode as in the present invention, the ultrasonic vibration is applied after the bonding tool is pressed against the inner lead to form the recess in the inner lead. Compared with the method of applying and joining, productivity can be improved by shortening the bonding time,
It was experimentally confirmed that the bonding can be performed with high strength.

In the method of joining the TAB inner leads of the present invention, as compared with the case of using the bonding tool 11e having a flat tip as shown in FIG.
It has been experimentally confirmed that the bonding tools 11a to 11d having rounded tip portions as shown in FIGS. The reason for this is not clear, but it is considered that the use of a bonding tool having a rounded tip has better uniformity of stress distribution on the joint surface than the case of using a bonding tool 11e having a flat tip. To be

The inner lead 1 as shown in FIG.
Bonding tool 11 having a tip smaller than the width of 3
In comparison with the case of using the bonding tool 11 having a tip smaller than the opening of the electrode 12 and larger than the width of the inner lead 13 as shown in FIG.
It was experimentally confirmed that the bonding can be performed with a large strength. The reason for this is not clear, but when using a bonding tool having a tip smaller than the width of the inner lead 13, the tip smaller than the opening of the electrode 12 and larger than the width of the inner lead 13. This is considered to be because the stress distribution on the joint surface is more uniform than in the case where a bonding tool having

When the inner leads whose longitudinal direction is perpendicular to the ultrasonic vibration direction are joined, the joining strength can be increased by forming the opening of the electrode of the semiconductor element smaller than the inner lead width. Was confirmed experimentally. FIG. 1 and FIG. 3 show a bonding method when an electrode 12 having an opening larger than the width of the inner lead 13 and an electrode 12 having an opening smaller than the width of the inner lead 13 are used. When the electrode 12 having the opening larger than the width of the inner lead 13 is used and the ultrasonic vibration 18 is applied to the inner lead 13, the inner lead 13 is twisted and deformed as shown in FIG. The part 20 is the electrode surface 1
It becomes easy to contact with 2. Therefore, concentrated stress is generated in the vicinity of the edge portion 20 of the side surface of the inner lead, and cracks are easily generated on the electrode surface 12. In order to prevent the occurrence of cracks, it is necessary to reduce the output of the bonding load F or the ultrasonic vibration 18. In this case, the bonding strength is slightly reduced as compared with the case where the opening of the electrode 12 is smaller than the inner lead 13, but it is experimentally shown that bonding can be performed with higher strength than the conventional direct bonding method because the convex portion 19 is formed. Confirmed to. On the other hand, when the electrode surface 12 is formed to be smaller than the width of the inner lead 13, as shown in FIG.
Does not contact the electrode 12, and only the convex portion 19 having a minute roundness formed on the back surface of the inner lead contacts the electrode 12, so that excessive stress concentration can be prevented from occurring and damage such as cracks may occur on the electrode surface. It is possible to join with sufficient strength without causing

[0017]

Embodiments of the present invention will be described in detail below with reference to the drawings. First, the first embodiment will be described. 1 (a) and 1 (b) are a front view and a side view including a partial cross-sectional view showing a method for joining inner leads, respectively.
(A)-(e) shows the side view of the bonding tool for TAB inner lead joining used by the Example of this invention. As the TAB tape, a Cu lead having an inner lead width of 80 μm, an inner lead pitch of 180 μm, and an inner lead thickness of 35 μm was plated with Au of 0.6 μm. The semiconductor element used had electrodes formed on all four sides, and the openings of the electrodes were formed to be larger than the width of the inner leads. In the first embodiment,
As the bonding tool 11, as shown in FIG. 2A, a tool having a conical tip and a roundness smaller than the width of the inner lead 13 at the tip was used.

After the electrodes 12 of the semiconductor element 15 and the inner leads 13 are aligned with each other, a load F = is applied to the bonding tool 11 as shown in FIGS. 1 (a) and 1 (b).
100 gf was applied. The bonding tool 11a was pressed against the inner lead 13, and ultrasonic vibration 18 was applied to the bonding tool while forming the recess 16 to bond the inner lead 13 and the electrode 12. When joining,
Although not shown in the drawing, the semiconductor element 15 was heated and held at 280 ° C. by a heating device.

After repeating the above operation for all the inner leads 13, the bonding strength was measured and the presence or absence of cracks on the electrode surface 12 was observed. as a result,
The average pull strength of the connecting portion in which the direction of ultrasonic vibration 18 acts parallel to the longitudinal direction of the inner lead 13 is 60 gf or more, and the direction of ultrasonic vibration 18 acts in the direction perpendicular to the longitudinal direction of the inner lead 13. The average pull strength of the part was 50 gf or more, and it was possible to join with a practically sufficient strength. Moreover, it was confirmed that no cracks were generated on the electrode surface 12. Here, the application timing of the ultrasonic vibration 18 may be any time during the formation of the depression 16, and for example, the ultrasonic vibration is applied at the same time when the bonding tool 11a is pressed against the inner lead 13, or 5 msec or 10 msec after the pressing. The application of 18 may be started.

In the second embodiment, as shown in FIG. 3, a semiconductor element in which the opening of the electrode 12 is formed smaller than the width of the inner lead is used for joining. The other joining conditions were the same as in the first embodiment, and joining was performed. As a result, the average pull strength is 60 gf or more regardless of the direction of the ultrasonic vibration 18,
It was possible to join with sufficient strength. Moreover, it was confirmed that no cracks were generated on the electrode surface 12.

In the third embodiment, as shown in FIG. 4, a bonding tool 11 having a tip smaller than the opening of the electrode 12 and having a tip roundness larger than the width of the inner lead 13 is used, and another bonding is performed. Bonding was performed under the same conditions as in the first embodiment. As a result, the average pull strength of the connection portion in which the direction of the ultrasonic vibration 18 acted in parallel to the longitudinal direction of the inner lead 13 was 55 gf or more, and the direction of the ultrasonic vibration 18 was perpendicular to the longitudinal direction of the inner lead 13. The average pull strength of the acted connection part was 45 gf or more, and it was confirmed that the connection was possible with practically sufficient strength. Moreover, it was confirmed that no cracks were generated on the electrode surface 12.

In the first, second, and third embodiments described above, the conical bonding tool 11a having a rounded tip as shown in FIG. 2A is used.
A pyramidal bonding tool 11b having a rounded tip as shown in FIG. 2B and a rod-shaped bonding tool 11c having a rounded tip as shown in FIG. 2), even when the bonding tool with a cross protrusion 11d having a rounded tip and a cross-shaped minute convex portion is used, the tip edge portion as shown in FIG. Even when a bonding tool having a roundness is used, as long as the bonding tool has a rounded tip and the tip is smaller than the opening of the electrode, the same as in the first to third embodiments. It was confirmed that the inner lead and the electrode can be joined with sufficient strength, and that the electrode surface can be joined with high reliability without damage such as cracks.

In the fourth embodiment, bonding is performed using a bonding tool 11e having a tip smaller than the opening of the electrode 12 and a flat tip as shown in FIG. 2 (f).
The other joining conditions were the same as in the first embodiment. A side view showing the joined state is shown in FIG. As a result of joining as shown in FIG. 5, the average pull strength of the connecting portion in which the direction of the ultrasonic vibration 18 acts parallel to the longitudinal direction of the inner lead 13 is 50.
It is more than gf, and the average pull strength of the connecting part where the direction of the ultrasonic vibration 18 acts in the direction perpendicular to the longitudinal direction of the inner lead 13 is more than 40 gf, and it is confirmed that both can be joined with practically sufficient strength. did. Moreover, it was confirmed that no cracks were generated on the electrode surface 12.

In the fifth embodiment, as shown in FIG. 6, the inner lead 13 whose width is larger than the opening of the electrode 12 is used for the joining. The other joining conditions were the same as in the fourth embodiment. As a result, the average pull strength of the connecting portion in which the direction of the ultrasonic vibration 18 acted in parallel with the longitudinal direction of the inner lead 13 was 50 gf or more, and the direction of the ultrasonic vibration 18 was perpendicular to the longitudinal direction of the inner lead 13. The average pull strength of the acted connection part was 45 gf or more, and it was confirmed that they could be joined with practically sufficient strength. Moreover, it was confirmed that no cracks were generated on the electrode surface 12.

In the sixth embodiment, the inner lead width is 2
A narrow pitch connection was performed using a TAB tape in which a Cu lead of 0 μm, an inner lead pitch of 50 μm, and an inner lead thickness of 20 μm was plated with Au of 0.6 μm. The semiconductor element has electrodes formed on all four sides,
The openings of the electrodes used had a width larger than the width of the inner leads. The bonding tool 11 is shown in FIG.
As shown in (a), a tip having a conical shape and a roundness smaller than the width of the inner lead 13 at the tip was used. Electrode 12 and inner lead 13 of semiconductor element 15
After performing the alignment with, the load F = 50 gf was applied to the bonding tool 11 as shown in FIG. 1A, and the bonding tool 11 a was pressed against the inner lead 13. As shown in FIG. 1B, the bonding tool 11
Contact the inner lead 13 and at the same time ultrasonic vibration 1
8 was applied to the bonding tool to bond the inner lead 13 and the electrode 12. At the time of joining, although not shown in the drawing, the semiconductor element 15 is heated to 280 by a heating device.
It was heated and kept at ℃.

After repeating the above operation for all the inner leads 13, the bonding strength was measured and the presence or absence of cracks on the electrode surface 12 was observed. as a result,
The average pull strength of the connecting portion in which the direction of the ultrasonic vibration 18 acts parallel to the longitudinal direction of the inner lead 13 is 15 gf or more, and the direction of the ultrasonic vibration 18 acts in the direction perpendicular to the longitudinal direction of the inner lead 13. The average pull strength of the part was 12 gf or more, and it was possible to join with a practically sufficient strength. Moreover, it was confirmed that no cracks were generated on the electrode surface 12.

[0027]

As described above, the TAB inner lead bonding method of the present invention does not require a bump forming step, so that the mounting cost can be remarkably reduced as compared with the conventional method, and a narrow pitch connection can be realized. There is an effect. TAB of the present invention
The inner lead joining method has an effect that the inner leads can be connected to the semiconductor element having electrodes formed on all four sides of the semiconductor element without forming bumps. In addition, the joining method of the TAB inner lead of the present invention has an effect that the electrode of the semiconductor element and the inner lead can be joined with high reliability without causing damage such as cracks on the electrode surface of the semiconductor element. .

[Brief description of drawings]

1 (a) and 1 (b) are respectively a front view and a side view showing a joining method of a TAB inner lead according to the present invention.

2A to 2F respectively show a conical bonding tool, a pyramid-shaped bonding tool, a rod-shaped bonding tool, and a conical-shaped bonding tool whose tip is smaller than the inner lead width and whose tip is rounded. FIG. 6 is a side view of a bonding tool having a cross-shaped protrusion at a tip, a bonding tool having a rounded tip edge portion, and a bonding tool having a tip portion smaller than an inner lead width and a tip portion flat.

FIG. 3 is a front view showing a method of joining TAB inner leads according to a second embodiment of the present invention.

FIG. 4 is a front view showing a method of joining TAB inner leads according to a third embodiment of the present invention.

FIG. 5 is a front view showing a method of joining TAB inner leads according to a fourth embodiment of the present invention.

FIG. 6 is a front view showing a method of joining TAB inner leads according to a fifth embodiment of the present invention.

FIG. 7 is used for explaining the operation of the fourth invention,
It is a side view which shows the joining method of a TAB inner lead.

FIGS. 8A and 8B are side views showing a first problem and a second problem of the conventional direct bonding method, respectively.

9A and 9B are respectively a front view showing a problem of the conventional direct bonding method and a shear stress distribution diagram of a joint portion by the conventional direct bonding method.

FIG. 10 is a front view showing a conventional method for joining TAB inner leads using bumps.

11A and 11B are a side view and a front view of a conventional bonding tool, respectively.

FIG. 12 is a schematic view showing a conventional direct bonding method.

[Explanation of symbols]

 11a, b, c, d, e Bonding tool 12 Electrode 13 Inner lead 14 Passivation film 15 Semiconductor element 16 Recess 17 Joint part 18 Ultrasonic vibration 19 Convex part 20 Edge 21a, b Conventional bonding tool 22 Bump

Claims (4)

[Claims] 1. A method of connecting an electrode of a semiconductor element and an inner lead of a TAB tape by a single bonding method, wherein a bonding tool having a tip portion smaller than an electrode opening of the semiconductor element is pressed against the inner lead, A method of joining a TAB inner lead, characterized in that a dent is formed in the lead, and ultrasonic energy is applied to the bonding tool while forming a protrusion on the surface of the inner lead on the electrode side. 2. The method of joining TAB inner leads according to claim 1, wherein the bonding tool has a rounded tip. 3. The T according to claim 1, wherein the recess is smaller than the width of the inner lead.
AB Inner lead joining method. 4. The size of the electrode opening of the semiconductor element in the width direction of the inner lead is smaller than the width of the inner lead.
Alternatively, the method of joining the TAB inner leads described in 3 above.