JP3293757B2 - Method of manufacturing lead frame assembly for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a lead frame,
In particular, the present invention relates to a method for manufacturing a lead frame assembly for manufacturing a semiconductor device, which can satisfactorily fix a semiconductor chip or a wire to a protruding support plate or connector.

[0002]

2. Description of the Related Art At present, various lead frames for assembling semiconductor chips are used for manufacturing various semiconductor devices. For example, a semiconductor device manufacturing lead frame is formed in a metal ribbon shape in which a plurality of patterns each having a support plate for fixing a semiconductor chip and a die pad and an external lead electrically connected to the semiconductor chip are formed in a row. It is formed.

When manufacturing a diode device using such a semiconductor device manufacturing lead frame, for example, a semiconductor device manufacturing lead frame (7) shown in FIG. 5 is used. The semiconductor device manufacturing lead frame (7)
Two pairs of connecting strips (3
, 4, 5 and 6) and two pairs of connecting strips (3, 4, 5 and 6) which are arranged parallel to each other at a fixed interval in the longitudinal direction and have a pair of connecting strips (3, 4, 5 and 6). And 6) and a pair of connecting strips (3, 4) of two pairs of connecting strips (3 and 4, 5 and 6).
And an island (8) projecting toward the other pair of connecting strips (5, 6) and having a support plate (8b), and connecting the other pair of two pairs of connecting strips (3 and 4, 5 and 6). Article (5,
6) Terminal pad (9) projecting toward one connecting strip (3, 4) and having a connector portion (9b).
And an inner connecting strip (21) arranged in parallel with the island (8) and the terminal pad (9) and connecting one pair of connecting strips (3, 4) and the other pair of connecting strips (5, 6). )
And One pair of the two pairs of connecting strips (3 and 4, 5 and 6) includes a first connecting strip (3) and a first connecting strip (3).
And a first external lead (1) for connecting the first connecting rod (3) and the second connecting rod (4). . The other pair of two pairs of links (3 and 4, 5 and 6) is a third link (5),
A fourth connecting strip (6) arranged inside the third connecting strip (5), and a second external lead connecting the third connecting strip (5) and the fourth connecting strip (6). (2). The outer connecting line (10) is between the first connecting line (3) and the second connecting line (4) and between the third connecting line (5) and the fourth connecting line (6). It is connected in parallel and alternately with the first external lead (1) and the second external lead (2). The island (8) has a first neck portion (8a) connected to the second connection portion (4) of the pair of connection portions (3, 4), and a tip of the first neck portion (8a). And a support plate (8b) formed at the portion and to which the semiconductor element is fixed. The terminal pad (9) has a second neck (9a) connected to the fourth connecting strip (6) of the other pair of connecting strips (5, 6), and a tip of the second neck (9a). And a connector part (9b) formed in the part and connected to the thin lead wire (12). The support plate (8b) is formed wider than the first neck (8a), and the connector (9b) is formed wider than the second neck (9a). The island (8) and the terminal pad (9) are arranged on the same straight line.

Accordingly, the first external lead (1) and the connecting portion (10) are connected to each other in parallel and alternately between the pair of the first connecting strip (3) and the second connecting strip (4). Similarly, the second external lead (2) and the outer connecting strip (10) are connected in parallel and alternately with each other between a pair of the third connecting strip (5) and the fourth connecting strip (6). You. An outer connecting line (10) is provided between the second connecting line (4) inside the first connecting line (3) and the fourth connecting line (6) inside the third connecting line (5). ), The inner connecting strip (21) is connected on substantially the same straight line. Further, an island (8) is formed so as to protrude inside the inner connecting strip (4) on substantially the same straight line as the first external lead (1). Further, a terminal pad (bonding pad portion) (9) is formed so as to protrude on the same straight line as the second external lead (2) and inside the inner connecting strip (6).

[0005] By a known die bonding method, a semiconductor element (11) such as a diode chip is mounted on a support plate (8).
b) between the electrode (upper surface electrode) (not shown) formed on the upper surface of the support plate (8b) and the connector portion (9b) by a thin lead wire (12). Connected. Although FIG. 5 shows two pairs of islands (8) and terminal pads (9) juxtaposed, the islands (8) and terminal pads (9) are connected to the actual semiconductor device manufacturing lead frame (7). Article (3-6)
The semiconductor device manufacturing lead frame (7) is formed to be elongated by a metal ribbon.

When the semiconductor element (11) is adhered to the support plate (8b), the semiconductor element (11) is suction-held by a suction holder (collet) of a die bonder (automatic semiconductor element fixing machine), and the support plate (8b) is held. The semiconductor element (11) is pressed against the solder on the support plate (8b) while applying vibration to the suction holder in a virtual plane parallel to the semiconductor element (11).
Are rubbed against the support plate (8b) and fixed, and die bonding is performed. Thereafter, while applying mechanical vibration to the capillary in a virtual plane parallel to the support plate (8b) together with the tip of the wire derived from the capillary of the wire bonder (automatic wire connection machine), the tip of the wire is connected to the semiconductor element ( The tip of the wire is connected by pressing against the upper electrode of 11). Next, while the wire is drawn out from the capillary, the capillary is largely drawn and moved onto the connector (9b), and the wire is again subjected to mechanical vibration in a virtual plane parallel to the connector (9b). Part (9b), and the other end of the wire is connected to the connector part (9b).
Connect to b). The wire connected between the upper surface electrode of the semiconductor element (11) and the connector (9b) becomes a thin lead wire (12). As described above, the upper electrode of the semiconductor element (11) and the connector section (9b) are connected to each other through the thin lead wires (12) by a known wire bonding method.
There are various connection methods for actual wire bonding,
For example, a thermosonic bonding method (ultrasonic combined thermo-compression wire bonding) in which ultrasonic vibration or mechanical vibration is applied to the capillary and the bonding pad portion (9) is heated may be used.

A semiconductor device manufacturing lead frame (7) to which a semiconductor element (11) is fixed and to which a lead wire (12) is connected is mounted on a support plate (7) by a well-known transfer molding method as shown by a broken line in FIG. 8b) and the like, and a resin sealing body (13) covering the same is formed.
6) And the connecting portion 10 is cut and removed, and an individualized semiconductor device is completed.

[0008]

When the support plate (8b) vibrates simultaneously with the vibration of the collet during die bonding, the semiconductor element (11) is moved to the support plate (8).
Therefore, the semiconductor element (11) cannot be fixed to the support plate (8b) with sufficient mechanical strength. Similarly, when the support plate (8b) or the bonding pad (9) vibrates with the vibration of the capillary during wire bonding, the friction that rubs the wire against the upper surface electrode on the semiconductor element (11) and the bonding pad (9). Insufficient quantities make it possible to connect the ends of the wires to the semiconductor element (11) and the bonding pads (9) with sufficient mechanical strength. An object of the present invention is to provide a method for manufacturing a lead frame assembly for manufacturing a semiconductor device, which can fix a semiconductor element or a wire to a lead frame for manufacturing a semiconductor device with sufficient mechanical strength.

[0009]

According to the present invention, there is provided a method of manufacturing a lead frame assembly for manufacturing a semiconductor device, comprising two pairs of connecting strips (3, 4, 5, 5) arranged in parallel with each other.
And 6) and two pairs of connecting strips (3, 4, 5 and 6) which are arranged parallel to each other at a fixed interval in the length direction of the connecting strips (3 and 4, 5 and 6). A plurality of outer connecting strips (10) connected to each other, and one pair of connecting strips (3, 4) of the two pairs of connecting strips (3, 4, 5 and 6) to the other connecting strip (5, 6). And a support plate (8
b) and an island (8) having two pairs of connecting strips (3 and 4, 5 and 6) projecting from the other pair of connecting strips (5, 6) toward one connecting strip (3, 4). And a terminal pad (9) having a connector part (9b), a first auxiliary connecting part (15) connecting the connector part (9b) and the inner connecting part (21), and an inner connecting part with the support plate (8b). Article (2
(1) preparing a semiconductor device manufacturing lead frame (14) having a second auxiliary connecting strip (16) for connecting the lead frame (14) to the base (17); A step of clamping the first auxiliary connecting line (15) or the second auxiliary connecting line (16) between the fixing jig (18) and the pedestal (17), and supporting the support plate (8b) or the connector portion (9b). ) Includes a step of performing die bonding or wire bonding.

A first auxiliary connecting line (15) or a second auxiliary connecting line (1) is provided between the fixing jig (18) and the pedestal (17).
Since the die bonding or the wire bonding is performed while holding 6), the vibration of the connector portion (9b) and the support plate (8b) can be sufficiently suppressed during the die bonding or the wire bonding.

Therefore, the semiconductor element (11) and the support plate (8)
b) is well fixed by a brazing material (solder),
Also, the wires (12) are connected well. That is, the supporting plate (8b) is provided at a predetermined position with sufficient mechanical strength.
The semiconductor element (11) can be fixed to the connector part (9b) at a predetermined position with sufficient mechanical strength.
Can be connected to a wire (12).

In the embodiment of the present invention, the support plate (8b)
And the inner connecting strips (21) on both sides of the connector section (9b) are connected to the support plate (8b) and the connector section (9b) respectively so as to be parallel to the two pairs of connecting strips (3 and 4, 5 and 6). Preparing a lead frame (14) for manufacturing a semiconductor device having a first auxiliary connecting line (15) and a second auxiliary connecting line (16) arranged in the semiconductor device.

When vibration is applied to the lead frame (14), the vibration is particularly likely to increase at the tip of the island (8) and the terminal pad (9).
And a first auxiliary link (15) and a second auxiliary link (1) connected to both sides of the terminal pad (9), respectively.
Since 6) is fixed by the fixing jig (18), the island (8) and the terminal pad (9) can be fixed securely and firmly.

The first connecting strip (3) of one pair of connecting strips (3, 4) of the two pairs of connecting strips (3 and 4, 5 and 6)
A first external lead (1) for connecting the first external lead (1) and a second connecting rod (4) arranged inside the first connecting rod (3), and two pairs of connecting rods (3 and 4, 5 and 6) ) Of the other pair of connecting strips (5, 6), and the fourth connecting strip (6) arranged inside the third connecting strip (5). A second external lead (2), between the first connecting line (3) and the second connecting line (4), and between the third connecting line (5) and the fourth connecting line (6); Preparing a lead frame (14) in which outer connecting strips (10) connecting the first and second outer leads (1) and (2) are arranged in parallel and alternately. .

The method includes a step of sealing a part of the semiconductor element and the island (8) and the terminal pad (9) of the lead frame assembly on which the die bonding or the wire bonding has been performed by the resin sealing body (13).

Before or after the sealing with the resin sealing body (13), the first auxiliary connecting line (15) or the second auxiliary connecting line (1)
6) is cut.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a lead frame assembly for manufacturing a semiconductor device according to the present invention will be described below with reference to FIGS. 1 to 4, the same portions as those shown in FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted.
As shown in FIG. 1, in the lead frame (14) for manufacturing a semiconductor device according to the present invention, the support plate (8b) and the inner connecting strip (21) are connected by the first auxiliary connecting strip (15). The second embodiment differs from the conventional semiconductor device manufacturing lead frame shown in FIG. 5 in that the connector portion (9b) and the inner connection portion (21) are connected by the second auxiliary connection portion (16). The first auxiliary connecting line (15) and the second auxiliary connecting line (16) are arranged in parallel to the two pairs of connecting lines (3 and 4, 5 and 6) and respectively have a connector part (9b) and a supporting part. Plate (8b), connector part (9b) and support plate (8
b) are connected to the inner connecting strips (21) on both sides. Between adjacent support plates (8b) and adjacent connector portions (9b)
, The inner connecting line (21) connects the second connecting line (4) and the fourth connecting line (6), and the support plate (8b) is connected to the first connecting line (4).
Inner connecting strips (2)
1), and the connector part (9b) is connected to the adjacent inner connecting strip (21) by the second auxiliary connecting strip (16).

When a lead frame assembly for manufacturing a semiconductor device according to the present invention is manufactured from the lead frame (14) for manufacturing a semiconductor device shown in FIG. 1, two pairs of connecting strips are arranged facing each other and in parallel. 3 and 4, 5 and 6);
A plurality of pairs of connecting strips (3, 4, 5 and 6) which are arranged in parallel to each other at a fixed interval in the length direction of the connecting strips (3 and 4, 5 and 6) and connect the pair of connecting strips (3, 4, 5 and 6) to each other. Outer connecting line (10) and two pairs of connecting lines (3 and 4, 5 and 6)
From one pair of connecting lines (3, 4) to the other connecting line (5,
Island (8) projecting towards 6) and having a support plate (8b), and two pairs of connecting strips (3 and 4, 5 and 6)
From the other pair of connecting lines (5, 6) to one connecting line (3,
A terminal pad (9) projecting toward 4) and having a connector part (9b), and a first auxiliary connecting part (15) connecting the connector part (9b) and the inner connecting part (21).
A lead frame (14) for manufacturing a semiconductor device having a support plate (8b) and a second auxiliary connecting line (16) for connecting the inner connecting line (21) is prepared. At this time, the support plate (8b) and the connector portion (9b) are arranged in parallel with the two pairs of connecting strips (3, 4, 5, and 6), and
A first auxiliary connecting line (15) and a second auxiliary connecting line (16) for connecting the support plate (8b) and the inner connecting lines (21) on both sides of the connector portion (9b) are provided. In addition, a first external lead () is provided between the first connecting line (3) and the second connecting line (4) and between the third connecting line (5) and the fourth connecting line (6). The outer connecting strips (10) are connected in parallel and alternately with the first external lead (2) and the second external lead (2).

As shown in FIG. 2, a semiconductor device manufacturing lead frame (14) is placed on a pedestal (17), and a fixing jig (18) is pressed against a first auxiliary connecting strip (15). The first auxiliary connecting strip (15) is sandwiched between the pedestal (17) and the fixing jig (18), and the support plate (8b) is attached to the pedestal (17).
Closely fix to the main surface of. For this reason, the first auxiliary connecting strip (15) has a width that can be sandwiched between the fixing jig (18) and the pedestal (17). Next, the semiconductor device (11)
Is sucked and held by a collet (20), and while applying ultrasonic vibration to the collet (20) in a virtual plane parallel to the support plate (8b), the semiconductor element ( 11) is rubbed to perform die bonding. FIG.
As shown in (1), since the first auxiliary connecting strip (15) is pressed by the fixing jig (18), the support plate (8b) is fixed in close contact with the pedestal (17), and the collet (20) is fixed. By fixing the support plate (8b) during vibration, the vibration of the support plate (8b) can be sufficiently suppressed. When vibration is applied to the semiconductor device manufacturing lead frame (14), the vibration may increase particularly at the tip of the island (8) and the terminal pad (9). ), The first auxiliary connecting line (15) and the second auxiliary connecting line (16), which are respectively connected to both sides, are fixed by the fixing jig (18), so that the island (8) and the terminal pad (9) are fixed. Can be securely and firmly fixed. Thereby, the solder (22) can be formed to a desired thickness, and the semiconductor element (11) can be fixed to the support plate (8b) at a predetermined position with sufficient mechanical strength, and the reliability is good. Die bonding is possible.

When the wire (12) is wire-bonded to the semiconductor device manufacturing lead frame (14) of FIG. 2, the semiconductor device manufacturing lead frame (14) is mounted on the pedestal as shown in FIGS. (17), the first auxiliary connecting strip (15) is pressed by the fixing jig (18), and the first auxiliary connecting strip (15) is fixed to the fixing jig (18) and the pedestal (17). ), And the support plate (8b) is fixed to the pedestal (17) in close contact therewith. Next, the capillary (1
The wire (12) is unreeled from 9), and one end of the wire (12) is connected to the semiconductor element (11) while applying ultrasonic vibration to the capillary (19) in a virtual plane parallel to the support plate (8b).
To the upper surface electrode (not shown). Also at this time, since the first auxiliary connecting strip (15) is pressed by the fixing jig (18), the support plate (8b) is fixed in close contact with the pedestal (17) and the capillary (19) vibrates. At this time, the support plate (8b) is fixed, and the vibration of the support plate (8b) can be sufficiently suppressed. Therefore, the end of the wire (12) is connected to the upper surface electrode of the semiconductor element (11) with sufficient mechanical strength.

Thereafter, as shown in FIG. 4, the second auxiliary connecting strip (16) is pressed by the fixing jig (18), and the second auxiliary connecting strip (16) is fixed to the fixing jig (18). Pedestal (1
7) and the terminal pad (9) is closely attached to the pedestal (17) and fixed. Subsequently, the capillary (19) is moved above the terminal pad (9) while feeding out the wire (12), and while applying ultrasonic vibration to the capillary (19) in a virtual plane parallel to the connector (9b). The other end of the wire (12) is pressed and connected to the terminal pad (9).

The connector portion (9) of the terminal pad (9)
Since the second auxiliary connecting strips (16) connected to both sides of (b) are fixed to the pedestal (17) in close contact with the fixing jig (18), the connector section (9b) through the capillary (19).
, Vibration of the connector portion (9b) is sufficiently suppressed by the second auxiliary connecting strips (16) on both sides,
The other end of the wire (12) can be securely and firmly fixed to a predetermined position of the connector (9b). For this reason,
The wires (12) can be satisfactorily rubbed and connected to the electrodes and the terminal pads (9) on the semiconductor element (11), and highly reliable and good wire bonding can be performed.

Thereafter, after forming the resin sealing body (13), the first auxiliary connecting strip (15) and the second auxiliary connecting strip (16) derived from the resin sealing body (13) are connected to the first auxiliary connecting strip (16). Connecting line (3) to fourth connecting line (6) and outer connecting line (10)
And cut and removed together with the inner connecting strip (21).

According to the embodiment of the present invention, the following operation and effect can be obtained. [1] The first auxiliary connecting line (15) or the second auxiliary connecting line (16) is sandwiched between the fixing jig (18) and the pedestal (17) to perform die bonding and wire bonding. Therefore, the support plate (8b) or the connector portion (9b) is securely fixed at the time of wire bonding and wire bonding, and the semiconductor element (11) and the wire (12) are securely connected to the support plate (8b) and the connector portion (9b). Can be fixed. [2] Since the support plate (8b) or the connector (9b) does not move due to vibration during die bonding and wire bonding, die bonding and wire bonding can be performed at predetermined positions. [3] The deformation of the support plate (8b) and the connector (9b) after die bonding and wire bonding is small. [4] Die bonding or wire bonding can be performed by forming the solder (22) and the wire (12) to a desired thickness. [5] Since the auxiliary connecting strips (15, 16) are pressed to suppress the vibration of the support plate (8b) and the connector portion (9b), the support plate (8b) and the connector portion (9b) are formed with a large area. It is not necessary, and the size of the support plate (8b) and the connector (9b) can be reduced. [6] A highly reliable semiconductor device can be manufactured.

The embodiment of the present invention is not limited to the above example, but can be modified. For example, a step of sealing a part of the semiconductor element and the island (8) and the terminal pad (9) of the lead frame assembly which has been subjected to die bonding or wire bonding with a sealing resin, and sealing with the sealing resin. Instead of cutting the first auxiliary connecting line (15) or the second auxiliary connecting line (16) after the first auxiliary connecting line (15) or the second auxiliary connecting line (15) or the second auxiliary connecting line (15) before sealing with the sealing resin. May be cut with the auxiliary connecting strip (16).

[0026]

According to the present invention, the first auxiliary connecting member or the second auxiliary connecting member is held between the fixing jig and the pedestal to perform die bonding or wire bonding. The connector portion protruding from the connecting strip and the support plate protruding from the other connecting strip do not vibrate (move), and the connector section and the support plate can be subjected to die bonding or wire bonding with sufficient mechanical strength. Therefore, a highly reliable semiconductor device can be manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame for manufacturing a semiconductor device according to the present invention.

2 is a sectional view showing a state in which die bonding is performed on the lead frame for manufacturing a semiconductor device in FIG. 1;

FIG. 3 is a sectional view showing a state where wire bonding is performed on a semiconductor element fixed to the lead frame for manufacturing a semiconductor device of FIG. 1;

FIG. 4 is a sectional view showing a state in which wire bonding is performed on the lead frame for manufacturing a semiconductor device of FIG. 1;

FIG. 5 is a plan view of a conventional lead frame for manufacturing a semiconductor device.

[Explanation of symbols]

(1) First external lead, (2) Second external lead, (3) First connecting strip, (4) Second
(5) ··· Third connection, (6) · · · Fourth connection, (8) · Island, (8a) · · ·
1st neck part, (8b) ... support plate, (9) ...
Terminal pad, (9a) second neck part,
(9b) ··· Connector part, (10) ··· Connecting part,
(11) · · · semiconductor element, (12) · · · wire,
(13) ··· Resin sealing body (14) ··· Lead frame for semiconductor device manufacturing (15) ··· First auxiliary connecting member, (16) ··· Second auxiliary connecting member, (17) ·・
Pedestal, (18) ··· Fixing jig, (19) ·· Capillary, (20) ·· Collet,

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/48 H01L 23/50

Claims (4)

(57) [Claims] 1. Two pairs of connecting strips facing each other and in parallel with each other, and the two pairs of connecting strips arranged in parallel with each other at a fixed interval in the longitudinal direction of the two pairs of connecting strips. A plurality of outer connecting strips connecting each pair of connecting strips constituting the strip to each other, and an island having a support plate protruding from one pair of connecting strips of the two pairs of connecting strips toward the other connecting strip, A terminal pad protruding from the other pair of connecting strips of the two pairs of connecting strips toward one connecting strip and having a connector part, a first auxiliary connecting strip connecting the support plate and the inner connecting strip, Preparing a semiconductor device manufacturing lead frame having a second auxiliary connecting line connecting the connector portion and the inner connecting line; and arranging the lead frame on a pedestal and performing the first auxiliary connecting operation. Article or second auxiliary connection And a step of performing die bonding or wire bonding to the support plate or the connector portion. A lead frame assembly for manufacturing a semiconductor device, comprising: Production method. 2. The first connecting member, which connects the inner connecting strips on both sides of the support plate and the connector section to the support plate and the connector section, respectively, and is arranged in parallel with the two pairs of connecting strips. 2. The method for manufacturing a lead frame assembly for manufacturing a semiconductor device according to claim 1, further comprising the step of preparing the lead frame having the auxiliary connecting line and the second auxiliary connecting line. 3. A first connecting member for connecting a first connecting member of one pair of connecting members of the two pairs of connecting members and a second connecting member disposed inside the first connecting member. A second external connecting the external lead, a third connecting member included in the other pair of connecting members of the two pairs of connecting members, and a fourth connecting member disposed inside the third connecting member; A lead, and connecting the outer connecting member connecting between the first connecting member and the second connecting member and between the third connecting member and the fourth connecting member with the first external member. 2. The method of manufacturing a lead frame assembly for manufacturing a semiconductor device according to claim 1, further comprising a step of preparing the lead frames arranged in parallel and alternately with a lead and a second external lead. 4. A step of sealing a part of the semiconductor element and the island and the terminal pad of the lead frame assembly which has been subjected to die bonding or wire bonding with a resin sealing body, and sealing with the resin sealing body. Cutting the first auxiliary connection line or the second auxiliary connection line before or after stopping. 4. The method of manufacturing a lead frame assembly for manufacturing a semiconductor device according to claim 1, further comprising: