JPS61125062A - Method and device for attaching pin - Google Patents

Abstract

PURPOSE:To omit a soldering material, to make it possible to narrow an interval between pins and to implement super-high degree of integration, by using a mechanism similar to a ball bonding wire bonder, and attaching the pins. CONSTITUTION:Under the state a first clamper 4 is closed, a wire material 2 is held, lowered and inserted through a capillary 7. A second clamper 6 is closed and the wire material 2 is held. At the same time, the first clamper 4 is opened and the lifted up. Then, the wire material 2 is cut at the upper position of the second clamper 6. Meanwhile, the tip part of the wire material 2 under the capillary 7 is fused by the discharge of an electric torch, and a ball 2 is formed. Thereafter, the wire material 2 is held by the second clamper 6 together with the capillary 7 as a unitary body and lowered to a specified position on a package substrate 10. The ball 12 is compressed by the tip part of the capillary 7. Ultrasonic wave vibration is applied to the wire material 2 as a pin, and the wire material 2 is bonded to the specified position on the package substrate.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a technology for attaching pins to a board, especially in high
The present invention relates to a technology that is widely used and effective for external electrical protection for integrated semiconductor devices.

[Background Art] Due to the trend toward miniaturization of electronic devices, semiconductor devices are also required to be highly integrated, and so-called pin grid array type semiconductor devices are known as devices that meet this demand.

The pin-grip 1' lay-type flat body device has a structure in which pins are attached in a matrix on the back side of a ceramic or plastic package, and it is suitable for high integration because it can secure a large number of external electrodes. It is considered as one of the suitable puff cages.

Incidentally, the electrical connection of the pin-glycide array type semiconductor device with the outside is made by pins attached to the back surface of the substrate, and the pins are fixed to the substrate using a brazing material such as silver. Therefore, in order to fix the pin to the target 11, it is necessary to heap a heap of brazing filler metal around the pin. That is, a certain amount of space is required around each pin on the back surface of the board.

However, as the ultra-high integration of semiconductor devices progresses in the future, this will make it difficult to reduce the pin pitch, resulting in a shortage of electrodes, which will eventually make it difficult to increase the integration of semiconductor devices. The inventor has clarified that this may be the cause.

゛ Also, the super high price of semiconductor devices! ! As devices become more integrated, pins will also become smaller, and as pins become smaller, technology that allows pins to be attached to package substrates in positive and electrical positions will become indispensable. This was also revealed by the present inventor at the same time.

An example of a detailed description of the pin lift array type semiconductor device is ``Very LSI Device Handbook JP22B-P229'' published by Science Forum Co., Ltd. on November 28, 1980.

[Object of the Invention] An object of the present invention is to provide a technique that can efficiently attach pins for external electrodes of a highly integrated semiconductor device with high density and precision.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A summary of typical inventions disclosed in this application is as follows.

Of course, when attaching pins for external electrodes to the package substrate, by attaching the pins using a mechanism similar to the wire bonder for pole bonding, no brazing material is required when attaching the pins, thereby narrowing the pin spacing. This makes it possible to achieve ultra-high integration of semiconductor devices.

In addition, when joining wire rods, pin attachment using ultrasonic waves,
Alternatively, thermal stress on the pins and the substrate can be prevented by attaching the pins using both thermocompression bonding and ultrasonic waves.

[Embodiment IJ Fig. 1 is a schematic partial view showing a pin attachment device according to an embodiment of the present invention.

2nd 1 is a sectional view illustrating a method of attaching an external electrode pin according to an embodiment of the present invention in a step-by-step manner.

To attach the pin, the device 1 uses a pin made of gold (AU) as shown in the 11th strip/a spool wrapped with cotton material 2 (
The cotton material 2 unwound from the spool 3 is forced through a capillary 7 through a first clamper 4, a cutter 5, and a second clamper 6. This capillary 7 is mounted on a bonding head 13 via a bonding arm 8 having an ultrasonic horn, and this bonding head can be moved in the XY directions by an XY table 14. The capillary 7 is configured to move relative to the upper surface of the joining table 9 in the vertical and horizontal directions via the arm 8 and the head. The package substrate 10 of the semiconductor device is mounted on the top surface of the bonding table 9 with the pin attached with the surface facing up.
It is placed. Additionally, an electric torch 11 is placed above the joining table 9.
Although not shown, the spool 3, the first clamper 4, the cutter 5, and the second clamper 6 are provided so as to maintain a predetermined distance from the tip of the capillary 7 during discharge.
, electric torches 11 are each connected to a bonding head 13 and driven.

Next, the pin attachment method according to this embodiment will be sequentially explained.

First, as shown in FIG. 2 (81 to +bl), the first crannosa 4 is lowered while holding the wire 2 in a closed state, and the loose cotton material 2 is inserted into the capillary 7.

Next, as shown in FIG. 2, 1cI, the second crank nozzle 6 closes and holds the wire 2, and the first crank 4 opens and rises.

Next, as shown in FIG. 2 1cI, the cotton material 2 is cut by the cutter 5 at a position above the second clamper 6.

On the other hand, at the tip of the wire 2 below the capillary 7, the wire 2 is melted by discharge from the electric torch 11, and a ball I2 is formed.

Thereafter, the second clamper 6 holds the wire rod 2 integrally with the capillary 7 in the closed state, and the puff cage 5 temporarily ts.
It descends to a predetermined position above o. Then, while pressing the ball I2 at the tip of the capillary 7 and applying ultrasonic vibration, the wire 2 serving as a pin is fitted into a predetermined position on the package substrate IO (FIG. 2, 1cI).

Thereafter, the second clamper 6 is opened and raised together with the capillary +77 (FIG. 2, 1cI) - one step of the process of attaching the external ttti pin to the semiconductor device package W&l O is completed.

In this way, according to this embodiment, since no brazing material is used, the spacing between each pin can be narrowed, making it possible to attach pins to the package substrate at a high density in response to higher integration of semiconductor devices. .

In addition, using the 411IFR, which is similar to the ball bonding type wire bonder used for wire bonding,
By bonding the pins using the capillary 7, it is possible to attach the pins with the same high precision as a pole bonding type wire bonder in determining the position and cutting the pins.

[Effect] (1), n similar to wire bonder for ball bonding
By cutting the pin material to a predetermined length using the side, and crimping the tip of the pin material to the pin mounting part on the board,
Pin attachment is now possible without using brazing filler metal, and pins can be attached to the package substrate at high density.

+2+, from iii fl+, the high price of semiconductor devices! Jl
It becomes possible to keep the number of external electrodes required in response to the increase in integration, and it is possible to further promote higher integration of semiconductor devices.

(3) Similar to wire bonder for pole bonding!
! ! By using +11, even thin pins can be made with the same high precision as a wire bonder for pole bonding.
In addition, efficient pin attachment can be performed.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it should be noted that various changes can be made without departing from the gist of the invention. Not even.

For example, in the embodiment, a wire bonder for pole bonding and an Iff (hereinafter n structure) using a capillary were described, but the invention is not limited to this, and a wedge similar to a wedge that is a wire connection tool for ultrasonic wire bonding was described. The pin may be fixed by ultrasonic vibration.

In this case, it is preferable to use a wedge that allows wire bonding in a substantially vertical direction.

Further, the wire rod serving as the pin is not limited to gold as explained in the embodiment, but may be made of copper, aluminum, or the like.

[Brief explanation of the drawing]

Fig. 1 is a schematic partial partial view of 1a showing a device for pin attachment, which is an embodiment of the present invention, and Fig. 2 (181 to [)) is a method for attaching external electrode pins, which is an embodiment of the present invention. FIG. 1... External electrode pin attachment device, 2... Wire rod, 3...
...Spool, 4...First clamper, 5...Cutter, 6...I clamper, 7...Capillary, 8...
...Bonding arm, 9...Joining table, 1G...
Package board, 11... Electric torch, 12... Ball, 13... Bonding head, 14... XY
tape (and l) (b)
((n) Figure 2 (t) (e) (child)

Claims (1)

[Claims] 1. A method for attaching external electrode pins to a substrate, which includes a step of cutting a long pin wire inserted through a wire connection tool into a predetermined length, and a step of cutting the cut pin into a predetermined length. A pin attachment method comprising the step of fixing the tip of a wire to a pin attachment portion on a board using a wire connection tool. 2. The pin attachment method according to claim 1, wherein after melting the tip of the pin wire to form a ball, crimping is performed by applying ultrasonic vibration while applying pressure. 3. A wire connecting tool, a bonding arm with the wire connecting tool attached to the tip, a drive body that moves the bonding arm up and down, and a drive body that is connected to the bonding arm and applies ultrasonic vibration to the wire connecting tool through the bonding arm. An ultrasonic vibration source that can be applied, two sets of clampers that can timely clamp a pin wire that can be inserted into a wire connection tool, a cutter that has a cutting part for the pin wire between the two clampers, and a wire. A pin attaching device comprising: a wire supply section that supplies a long pin wire to a connecting tool; and an XY table capable of moving the bonding arm, clamper, cutter, and wire supply section in XY directions. 4. The pin attachment device according to claim 3, wherein the pin wire material is a wire whose main component is gold (Au).