JPS61125062A - Method and device for attaching pin - Google Patents

Method and device for attaching pin

Info

Publication number
JPS61125062A
JPS61125062A JP24599784A JP24599784A JPS61125062A JP S61125062 A JPS61125062 A JP S61125062A JP 24599784 A JP24599784 A JP 24599784A JP 24599784 A JP24599784 A JP 24599784A JP S61125062 A JPS61125062 A JP S61125062A
Authority
JP
Japan
Prior art keywords
wire material
clamper
capillary
held
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24599784A
Inventor
Ken Okuya
Masayuki Shirai
Takeo Yamada
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24599784A priority Critical patent/JPS61125062A/en
Publication of JPS61125062A publication Critical patent/JPS61125062A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/113Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134Stud bumping, i.e. using a wire-bonding apparatus
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00013Fully indexed content

Abstract

PURPOSE:To omit a soldering material, to make it possible to narrow an interval between pins and to implement super-high degree of integration, by using a mechanism similar to a ball bonding wire bonder, and attaching the pins. CONSTITUTION:Under the state a first clamper 4 is closed, a wire material 2 is held, lowered and inserted through a capillary 7. A second clamper 6 is closed and the wire material 2 is held. At the same time, the first clamper 4 is opened and the lifted up. Then, the wire material 2 is cut at the upper position of the second clamper 6. Meanwhile, the tip part of the wire material 2 under the capillary 7 is fused by the discharge of an electric torch, and a ball 2 is formed. Thereafter, the wire material 2 is held by the second clamper 6 together with the capillary 7 as a unitary body and lowered to a specified position on a package substrate 10. The ball 12 is compressed by the tip part of the capillary 7. Ultrasonic wave vibration is applied to the wire material 2 as a pin, and the wire material 2 is bonded to the specified position on the package substrate.
JP24599784A 1984-11-22 1984-11-22 Method and device for attaching pin Pending JPS61125062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24599784A JPS61125062A (en) 1984-11-22 1984-11-22 Method and device for attaching pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24599784A JPS61125062A (en) 1984-11-22 1984-11-22 Method and device for attaching pin

Publications (1)

Publication Number Publication Date
JPS61125062A true JPS61125062A (en) 1986-06-12

Family

ID=17141928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24599784A Pending JPS61125062A (en) 1984-11-22 1984-11-22 Method and device for attaching pin

Country Status (1)

Country Link
JP (1) JPS61125062A (en)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US8907466B2 (en) 2010-07-19 2014-12-09 Tessera, Inc. Stackable molded microelectronic packages
US8927337B2 (en) 2004-11-03 2015-01-06 Tessera, Inc. Stacked packaging improvements
US8957527B2 (en) 2010-11-15 2015-02-17 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9530749B2 (en) 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out

Cited By (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927337B2 (en) 2004-11-03 2015-01-06 Tessera, Inc. Stacked packaging improvements
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8907466B2 (en) 2010-07-19 2014-12-09 Tessera, Inc. Stackable molded microelectronic packages
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US10128216B2 (en) 2010-07-19 2018-11-13 Tessera, Inc. Stackable molded microelectronic packages
US8957527B2 (en) 2010-11-15 2015-02-17 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US10062661B2 (en) 2011-05-03 2018-08-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US9041227B2 (en) 2011-10-17 2015-05-26 Invensas Corporation Package-on-package assembly with wire bond vias
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US10170412B2 (en) 2012-05-22 2019-01-01 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9917073B2 (en) 2012-07-31 2018-03-13 Invensas Corporation Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9095074B2 (en) 2012-12-20 2015-07-28 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9615456B2 (en) 2012-12-20 2017-04-04 Invensas Corporation Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9633979B2 (en) 2013-07-15 2017-04-25 Invensas Corporation Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9893033B2 (en) 2013-11-12 2018-02-13 Invensas Corporation Off substrate kinking of bond wire
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9837330B2 (en) 2014-01-17 2017-12-05 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9812433B2 (en) 2014-03-31 2017-11-07 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9356006B2 (en) 2014-03-31 2016-05-31 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US10032647B2 (en) 2014-05-29 2018-07-24 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9947641B2 (en) 2014-05-30 2018-04-17 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9530749B2 (en) 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10115678B2 (en) 2015-10-12 2018-10-30 Invensas Corporation Wire bond wires for interference shielding
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding

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