JPH038583B2 - - Google Patents
Info
- Publication number
- JPH038583B2 JPH038583B2 JP57211606A JP21160682A JPH038583B2 JP H038583 B2 JPH038583 B2 JP H038583B2 JP 57211606 A JP57211606 A JP 57211606A JP 21160682 A JP21160682 A JP 21160682A JP H038583 B2 JPH038583 B2 JP H038583B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- semiconductor
- electrode outlet
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W74/137—
-
- H10W72/923—
-
- H10W72/934—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
- Non-Volatile Memory (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57211606A JPS59100559A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57211606A JPS59100559A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59100559A JPS59100559A (ja) | 1984-06-09 |
| JPH038583B2 true JPH038583B2 (enExample) | 1991-02-06 |
Family
ID=16608544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57211606A Granted JPS59100559A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59100559A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0370178A (ja) * | 1989-08-09 | 1991-03-26 | Seiko Instr Inc | 半導体装置 |
| JP5165190B2 (ja) * | 2005-06-15 | 2013-03-21 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
| JP2017112225A (ja) * | 2015-12-16 | 2017-06-22 | シャープ株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57180138A (en) * | 1981-04-30 | 1982-11-06 | Nec Corp | Semiconductor device |
| JPS57202749A (en) * | 1981-06-08 | 1982-12-11 | Toshiba Corp | Semiconductor device |
| JPS58219741A (ja) * | 1982-06-15 | 1983-12-21 | Nippon Gakki Seizo Kk | 半導体装置 |
-
1982
- 1982-11-30 JP JP57211606A patent/JPS59100559A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59100559A (ja) | 1984-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4472730A (en) | Semiconductor device having an improved moisture resistance | |
| US5017985A (en) | Input protection arrangement for VLSI integrated circuit devices | |
| US4625227A (en) | Resin molded type semiconductor device having a conductor film | |
| US5539257A (en) | Resin molded type semiconductor device having a conductor film | |
| EP0684643B1 (en) | Method of manufacturing semiconductor devices in an active layer on an support substrate | |
| JPH10112459A (ja) | 有機物層のカプセル化のための無機物シール、及びそれを形成する方法 | |
| US4005455A (en) | Corrosive resistant semiconductor interconnect pad | |
| EP0122631B1 (en) | Electronic device having a multi-layer wiring structure | |
| JPH01140757A (ja) | 半導体入力保護装置 | |
| US5552639A (en) | Resin molded type semiconductor device having a conductor film | |
| JPH038583B2 (enExample) | ||
| GB2134709A (en) | Semiconductor device and fabrication method thereof | |
| US20030209756A1 (en) | Semiconductor memory reducing current consumption and narrow channel effect and method of manufacturing the same | |
| JPS6359257B2 (enExample) | ||
| JPH0646662B2 (ja) | 半導体装置 | |
| KR940012583A (ko) | 반도체 집적회로 장치 및 그 제조방법 | |
| JPS62224037A (ja) | 半導体装置 | |
| JPH1065157A (ja) | 半導体装置 | |
| JPS62219541A (ja) | 半導体装置 | |
| KR960013633B1 (ko) | 반도체 집적회로의 쉴딩 방법 | |
| KR100575861B1 (ko) | 반도체 소자의 정전기 방지 구조 | |
| JPH05152508A (ja) | 半導体装置 | |
| JPH067583B2 (ja) | 半導体装置の製法 | |
| JPH04145658A (ja) | 半導体集積回路 | |
| JP2002094008A (ja) | 半導体装置とその製造方法 |