JPH0385623U - - Google Patents
Info
- Publication number
- JPH0385623U JPH0385623U JP14745289U JP14745289U JPH0385623U JP H0385623 U JPH0385623 U JP H0385623U JP 14745289 U JP14745289 U JP 14745289U JP 14745289 U JP14745289 U JP 14745289U JP H0385623 U JPH0385623 U JP H0385623U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- face
- electronic component
- view
- mounted electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Conductive Materials (AREA)
Description
第１図乃至第５図は本考案を適用した積層セラ
ミツクチツプコンデンサの一実施例を示す図であ
り、第１図は斜視図、第２図は平面図、第３図は
側面図、第４図は第２図のＡ−Ａ線断面図、第５
図は第２図のＡ−Ａ線における外部電極部周辺の
拡大断面図である。第６図は第１図乃至第５図の
積層セラミツクチツプコンデンサを基板に実装し
た状態を示す外部電極部周辺の拡大断面図であり
、第２図のＡ−Ａ線断面図に相当する。第７図は
従来の積層セラミツクチツプコンデンサを示す斜
視図、第８図は第７図の積層セラミツクチツプコ
ンデンサを基板に実装した状態を示す外部電極部
周辺の拡大断面図であり、第７図のＢ−Ｂ線断面
図に相当する。
１……内部電極、２……積層セラミツクコンデ
ンサ焼成体（誘電体）、３……外部電極、４……
基板、５……半田、６……耐熱性ゴム部材、７…
…耐熱性フツ素ゴム、８……メツキ層。
1 to 5 are views showing one embodiment of a multilayer ceramic chip capacitor to which the present invention is applied, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a side view, and FIG. The figure is a cross-sectional view taken along the line A-A in Figure 2.
The figure is an enlarged cross-sectional view of the vicinity of the external electrode portion taken along the line A-A in FIG. 2. FIG. 6 is an enlarged cross-sectional view of the vicinity of the external electrode portion showing the laminated ceramic chip capacitor of FIGS. 1 to 5 mounted on a substrate, and corresponds to the cross-sectional view taken along the line A--A of FIG. 2. FIG. 7 is a perspective view showing a conventional multilayer ceramic chip capacitor, and FIG. 8 is an enlarged cross-sectional view of the area around the external electrode section showing the state in which the multilayer ceramic chip capacitor shown in FIG. 7 is mounted on a board. This corresponds to a sectional view taken along line B-B. 1... Internal electrode, 2... Multilayer ceramic capacitor fired body (dielectric), 3... External electrode, 4...
Substrate, 5...Solder, 6...Heat-resistant rubber member, 7...
...Heat-resistant fluorocarbon rubber, 8... Plating layer.
Claims (1)
実装される表面実装電子部品において、 前記端面電極の外側に、この端面電極を覆う形
状で、且つ内外の表面全体に半田付け可能なメツ
キ層を有する耐熱性ゴム部材を設け、この耐熱性
ゴム部材と端面電極とを半田付けにより固着する
ことを特徴とする表面実装電子部品。[Claims for Utility Model Registration] In a surface-mounted electronic component that has an electrode on the end face of the element and is mounted on a substrate by soldering, a surface-mounted electronic component that has an electrode on the outside of the end face, that covers the end face electrode, and that has an inner and outer part. A surface-mounted electronic component characterized in that a heat-resistant rubber member having a solderable plating layer is provided over the entire surface, and the heat-resistant rubber member and an end face electrode are fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14745289U JPH0385623U (en) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14745289U JPH0385623U (en) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385623U true JPH0385623U (en) | 1991-08-29 |
Family
ID=31693962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14745289U Pending JPH0385623U (en) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385623U (en) |
-
1989
- 1989-12-20 JP JP14745289U patent/JPH0385623U/ja active Pending