JPH02132926U - - Google Patents
Info
- Publication number
- JPH02132926U JPH02132926U JP3479190U JP3479190U JPH02132926U JP H02132926 U JPH02132926 U JP H02132926U JP 3479190 U JP3479190 U JP 3479190U JP 3479190 U JP3479190 U JP 3479190U JP H02132926 U JPH02132926 U JP H02132926U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- groove
- soldered
- synthetic resin
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図はこの考案の第１の実施例を示した部分
断面図、第２図は従来のリードレス型の電子部品
を示す部分断面図である。第３図はこの考案の第
１の実施例による端子板を示す斜視図、第４図は
この考案の第２の実施例を示す部分断面図である
。 １……電子部品（電解コンデンサ）、２，１
３……素子、３……外装ケース、４……電極箔、
５……電解紙、６，１５……リード線、７……端
子板、８……透孔、９……溝部、１０……封口部
材、１１，１６……端子部、１２……半田層、１
４……外装部材。
FIG. 1 is a partial sectional view showing a first embodiment of this invention, and FIG. 2 is a partial sectional view showing a conventional leadless type electronic component. FIG. 3 is a perspective view showing a terminal plate according to a first embodiment of this invention, and FIG. 4 is a partial sectional view showing a second embodiment of this invention. 1...Electronic parts (electrolytic capacitor), 2,1
3...Element, 3...Exterior case, 4...Electrode foil,
5... Electrolytic paper, 6, 15... Lead wire, 7... Terminal plate, 8... Through hole, 9... Groove, 10... Sealing member, 11, 16... Terminal part, 12... Solder layer ,1
4...Exterior member.
Claims (1)
脂からなり、透孔から底面および側面にわたる切
欠状の溝部が形成されているとともに、溝部の外
表面および透孔の内側面に、半田付け可能な金属
からなる端子部が一体に形成されたことを特徴と
する電子部品用端子板。 It is made of a flat plate-shaped heat-resistant synthetic resin with a through hole formed on its surface, and a notched groove extending from the through hole to the bottom and side surfaces is formed, and the outer surface of the groove and the inner surface of the through hole are soldered. 1. A terminal board for electronic components, characterized in that a terminal part made of a suitable metal is integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3479190U JPH0711462Y2 (en) | 1990-03-30 | 1990-03-30 | Terminal board for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3479190U JPH0711462Y2 (en) | 1990-03-30 | 1990-03-30 | Terminal board for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02132926U true JPH02132926U (en) | 1990-11-05 |
| JPH0711462Y2 JPH0711462Y2 (en) | 1995-03-15 |
Family
ID=31539573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3479190U Expired - Lifetime JPH0711462Y2 (en) | 1990-03-30 | 1990-03-30 | Terminal board for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711462Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012138414A (en) * | 2010-12-24 | 2012-07-19 | San Denshi Kogyo Kk | Chip type capacitor and manufacturing method of the same |
-
1990
- 1990-03-30 JP JP3479190U patent/JPH0711462Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012138414A (en) * | 2010-12-24 | 2012-07-19 | San Denshi Kogyo Kk | Chip type capacitor and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0711462Y2 (en) | 1995-03-15 |
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