JPS61144628U - - Google Patents
Info
- Publication number
- JPS61144628U JPS61144628U JP2900385U JP2900385U JPS61144628U JP S61144628 U JPS61144628 U JP S61144628U JP 2900385 U JP2900385 U JP 2900385U JP 2900385 U JP2900385 U JP 2900385U JP S61144628 U JPS61144628 U JP S61144628U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- recessed
- end faces
- electronic component
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 6
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
第１図は、この考案の一実施例に係るチツプ形
電子部品（突き合せ形コンデンサ）をプリント基
板に半田付けした状態を示す断面図である。第２
図は、この考案の他の実施例に係るチツプ形電子
部品（突き合せ形コンデンサ）を示す断面図であ
る。第３図は、この考案の更に他の実施例に係る
チツプ形電子部品（積層形コンデンサ）を示す断
面図である。第４図は従来の積層形コンデンサを
示す断面図であり、第５図は第３図のＡ部の拡大
断面図であり、第６図は第３図の積層形コンデン
サのチツプ素体を示す断面図である。第７図は、
従来のチツプ形電子部品（突き合せ形コンデンサ
）をプリント基板に半田付けした状態を示す断面
図である。
５１，６１……チツプ素体、５２ａ，５２ｂ，
６２ａ，６２ｂ……電極、５３ａ，５３ｂ，５２
１ａ，５２１ｂ，６２１ａ，６２１ｂ……端面。
FIG. 1 is a sectional view showing a state in which a chip-shaped electronic component (butt-type capacitor) according to an embodiment of the invention is soldered to a printed circuit board. Second
The figure is a sectional view showing a chip-shaped electronic component (butt-type capacitor) according to another embodiment of the invention. FIG. 3 is a sectional view showing a chip-type electronic component (multilayer capacitor) according to still another embodiment of the invention. FIG. 4 is a sectional view showing a conventional multilayer capacitor, FIG. 5 is an enlarged sectional view of section A in FIG. 3, and FIG. 6 is a chip body of the multilayer capacitor shown in FIG. FIG. Figure 7 shows
1 is a cross-sectional view showing a state in which a conventional chip-shaped electronic component (butt-type capacitor) is soldered to a printed circuit board. 51, 61... Chip body, 52a, 52b,
62a, 62b...electrode, 53a, 53b, 52
1a, 521b, 621a, 621b... end surfaces.
Claims (1)
電極の端面が窪んでいることを特徴とするチツプ
形電子部品。 (2) チツプ素体の両端面が窪んでいて、その窪
みに沿つて電極が形成されてその端面が窪んでい
る実用新案登録請求の範囲第１項記載のチツプ形
電子部品。[Claims for Utility Model Registration] (1) A chip-shaped electronic component characterized in that the end faces of electrodes provided at both ends of a chip body are recessed. (2) The chip-shaped electronic component according to claim 1, wherein both end faces of the chip body are recessed, electrodes are formed along the recesses, and the end faces are recessed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2900385U JPS61144628U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2900385U JPS61144628U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144628U true JPS61144628U (en) | 1986-09-06 |
Family
ID=30527415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2900385U Pending JPS61144628U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144628U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007013029A (en) * | 2005-07-04 | 2007-01-18 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method for manufacturing the same |
| JP2015026730A (en) * | 2013-07-26 | 2015-02-05 | 京セラ株式会社 | Chip type electronic component |
| JP2018139248A (en) * | 2017-02-24 | 2018-09-06 | パナソニックＩｐマネジメント株式会社 | Mounting structure of chip resistor |
-
1985
- 1985-02-27 JP JP2900385U patent/JPS61144628U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007013029A (en) * | 2005-07-04 | 2007-01-18 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method for manufacturing the same |
| JP4513129B2 (en) * | 2005-07-04 | 2010-07-28 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component and multilayer ceramic electronic component |
| JP2015026730A (en) * | 2013-07-26 | 2015-02-05 | 京セラ株式会社 | Chip type electronic component |
| JP2018139248A (en) * | 2017-02-24 | 2018-09-06 | パナソニックＩｐマネジメント株式会社 | Mounting structure of chip resistor |