JPS63140616U - - Google Patents
Info
- Publication number
- JPS63140616U JPS63140616U JP3210887U JP3210887U JPS63140616U JP S63140616 U JPS63140616 U JP S63140616U JP 3210887 U JP3210887 U JP 3210887U JP 3210887 U JP3210887 U JP 3210887U JP S63140616 U JPS63140616 U JP S63140616U
- Authority
- JP
- Japan
- Prior art keywords
- chip capacitor
- recess
- dielectric material
- dielectric
- terminal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 239000003989 dielectric material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図はこの考案の一実施例によるチツプコン
デンサの斜視図、第２図は第１図のチツプコンデ
ンサの実装例を示す斜視図、第３図は第１図の複
数のコンデンサの実装例を示す平面図、第４図は
従来のチツプコンデンサの斜視図、第５図は従来
のチツプコンデンサの断面図、第６図は従来のチ
ツプコンデンサの実装図である。
１は誘電体、２は端子電極、３は内部電極、４
ははんだ、５は部品取付パターン、６は凹部。な
お、図中、同一符号は同一、又は相当部分を示す
。
FIG. 1 is a perspective view of a chip capacitor according to an embodiment of this invention, FIG. 2 is a perspective view showing an example of mounting the chip capacitor of FIG. 1, and FIG. 4 is a perspective view of a conventional chip capacitor, FIG. 5 is a sectional view of a conventional chip capacitor, and FIG. 6 is a mounting diagram of a conventional chip capacitor. 1 is a dielectric, 2 is a terminal electrode, 3 is an internal electrode, 4
1 is solder, 5 is a component mounting pattern, and 6 is a recess. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
電体と、この誘電体の凹部内に配設された端子電
極により構成されたことを特徴とするチツプコン
デンサ。 (2) 凹部は誘電体の対向する２つの壁面に形成
されたことを特徴とする実用新案登録請求の範囲
第１項記載のチツプコンデンサ。[Claims for Utility Model Registration] (1) A chip capacitor comprising a dielectric material having a recess formed on at least one wall thereof, and a terminal electrode disposed within the recess of the dielectric material. (2) The chip capacitor according to claim 1, wherein the recesses are formed on two opposing wall surfaces of the dielectric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3210887U JPS63140616U (en) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3210887U JPS63140616U (en) | 1987-03-05 | 1987-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140616U true JPS63140616U (en) | 1988-09-16 |
Family
ID=30838465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3210887U Pending JPS63140616U (en) | 1987-03-05 | 1987-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140616U (en) |
-
1987
- 1987-03-05 JP JP3210887U patent/JPS63140616U/ja active Pending