JPH0227764U - - Google Patents
Info
- Publication number
- JPH0227764U JPH0227764U JP10557888U JP10557888U JPH0227764U JP H0227764 U JPH0227764 U JP H0227764U JP 10557888 U JP10557888 U JP 10557888U JP 10557888 U JP10557888 U JP 10557888U JP H0227764 U JPH0227764 U JP H0227764U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- shaped electronic
- electrode
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の実装工程の説明図、第
１図ｃは、本考案の部品実装構造を示す正面図、
第２図は第１図ｃの説明用側面図、第３図は、本
考案の他の実施例を示す説明用側面図、第４図は
、本考案の更に他の実施例を示す説明用側面図、
第５図ａ，ｂは、従来の部品実装工程の説明図、
第５図ｃは、従来の部品実装構造を示す正面図で
ある。
１…回路基板、２…チツプ状電子部品、３，３
…半田、４，４…電極ランド、５，５…電子部品
の電極、６…絶縁体。
Figures 1a and b are explanatory diagrams of the mounting process of the present invention, Figure 1c is a front view showing the component mounting structure of the present invention,
FIG. 2 is an explanatory side view of FIG. 1c, FIG. 3 is an explanatory side view showing another embodiment of the present invention, and FIG. 4 is an explanatory side view showing still another embodiment of the present invention. Side view,
FIGS. 5a and 5b are explanatory diagrams of the conventional component mounting process,
FIG. 5c is a front view showing a conventional component mounting structure. 1... Circuit board, 2... Chip-shaped electronic component, 3, 3
...Solder, 4, 4... Electrode land, 5, 5... Electrode of electronic component, 6... Insulator.
Claims (1)
成し、この電極ランドにチツプ状電子部品を載せ
、同チツプ状電子部品の両端部の電極を、上記電
極ランドに半田付けしてなる回路基板の部品実装
部において、上記電極ランド間の中央部に、チツ
プ状電子部品の中央部に点又は線で接する絶縁体
を設けたことを特徴とする回路基板の部品実装構
造。 At least one pair of electrode lands is formed on a circuit board, a chip-shaped electronic component is placed on the electrode land, and electrodes at both ends of the chip-shaped electronic component are soldered to the electrode lands. 1. A component mounting structure for a circuit board, characterized in that an insulator is provided in the center between the electrode lands, the insulator touching the center of the chip-shaped electronic component at a point or a line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557888U JPH0227764U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557888U JPH0227764U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227764U true JPH0227764U (en) | 1990-02-22 |
Family
ID=31338320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10557888U Pending JPH0227764U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227764U (en) |
-
1988
- 1988-08-10 JP JP10557888U patent/JPH0227764U/ja active Pending