JPH0298667U - - Google Patents
Info
- Publication number
- JPH0298667U JPH0298667U JP678589U JP678589U JPH0298667U JP H0298667 U JPH0298667 U JP H0298667U JP 678589 U JP678589 U JP 678589U JP 678589 U JP678589 U JP 678589U JP H0298667 U JPH0298667 U JP H0298667U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed
- printed wiring
- circuit element
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の１実施例に係る印刷配線板の
斜視図である。第２図ａは第１図に示す印刷配線
板の要部断面図であり、ｂはハンダ付け後の要部
断面図である。第３図はリード電極を有しない回
路素子の取付状態を示す断面図である。第４図は
リード電極を有しない回路素子を完全に埋め込ん
で取り付けた場合の断面図である。
１０……印刷配線板、１１……表面、１２……
プリント配線、１３，１４……凹部、１６……抵
抗、１７……コンデンサ、２１，２２……リード
電極、２６……裏面、２７……ハンダフイレツト
、３１，４１……回路素子。
FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention. FIG. 2a is a sectional view of the main part of the printed wiring board shown in FIG. 1, and FIG. 2b is a sectional view of the main part after soldering. FIG. 3 is a cross-sectional view showing how a circuit element without lead electrodes is attached. FIG. 4 is a cross-sectional view when a circuit element having no lead electrodes is completely embedded and attached. 10...Printed wiring board, 11...Surface, 12...
Printed wiring, 13, 14... recess, 16... resistor, 17... capacitor, 21, 22... lead electrode, 26... back surface, 27... solder fillet, 31, 41... circuit element.
Claims (1)
において、 予め基板上に配線を印刷した印刷配線板上に前
記回路素子を受け入れる凹部を設けたことを特徴
とする印刷配線板。[Claims for Utility Model Registration] A printed wiring board on which circuit elements are attached at predetermined positions, characterized in that a recessed portion for receiving the circuit element is provided on the printed wiring board on which wiring is printed on the substrate in advance. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP678589U JPH0298667U (en) | 1989-01-24 | 1989-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP678589U JPH0298667U (en) | 1989-01-24 | 1989-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298667U true JPH0298667U (en) | 1990-08-06 |
Family
ID=31211245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP678589U Pending JPH0298667U (en) | 1989-01-24 | 1989-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298667U (en) |
-
1989
- 1989-01-24 JP JP678589U patent/JPH0298667U/ja active Pending