JPH0379416B2 - - Google Patents

Info

Publication number
JPH0379416B2
JPH0379416B2 JP60265621A JP26562185A JPH0379416B2 JP H0379416 B2 JPH0379416 B2 JP H0379416B2 JP 60265621 A JP60265621 A JP 60265621A JP 26562185 A JP26562185 A JP 26562185A JP H0379416 B2 JPH0379416 B2 JP H0379416B2
Authority
JP
Japan
Prior art keywords
wire
weight
bonding
gold
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60265621A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62127438A (ja
Inventor
Harumichi Okamoto
Takashi Ogata
Norimichi Matsusue
Takatoki Fukuda
Eiichi Fujimoto
Toshitake Ootaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Nihon Kogyo KK
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Tatsuta Electric Wire and Cable Co Ltd filed Critical Nihon Kogyo KK
Priority to JP60265621A priority Critical patent/JPS62127438A/ja
Publication of JPS62127438A publication Critical patent/JPS62127438A/ja
Publication of JPH0379416B2 publication Critical patent/JPH0379416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
JP60265621A 1985-11-26 1985-11-26 半導体素子用ボンディング線 Granted JPS62127438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60265621A JPS62127438A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60265621A JPS62127438A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Publications (2)

Publication Number Publication Date
JPS62127438A JPS62127438A (ja) 1987-06-09
JPH0379416B2 true JPH0379416B2 (enExample) 1991-12-18

Family

ID=17419675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60265621A Granted JPS62127438A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Country Status (1)

Country Link
JP (1) JPS62127438A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785483B2 (ja) * 1986-07-15 1995-09-13 株式会社東芝 半導体装置
JPH0785484B2 (ja) * 1986-07-16 1995-09-13 株式会社東芝 半導体装置
JPH0785485B2 (ja) * 1986-07-23 1995-09-13 株式会社東芝 半導体装置
JPS63241127A (ja) * 1987-03-27 1988-10-06 Mitsubishi Metal Corp 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金
US6455937B1 (en) 1998-03-20 2002-09-24 James A. Cunningham Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects
US6113761A (en) 1999-06-02 2000-09-05 Johnson Matthey Electronics, Inc. Copper sputtering target assembly and method of making same
US6858102B1 (en) 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
US6551872B1 (en) 1999-07-22 2003-04-22 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
US6521532B1 (en) 1999-07-22 2003-02-18 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance
US6441492B1 (en) 1999-09-10 2002-08-27 James A. Cunningham Diffusion barriers for copper interconnect systems
JP2003529206A (ja) 1999-11-24 2003-09-30 ハネウェル・インターナショナル・インコーポレーテッド 物理蒸着ターゲット、導電性集積回路金属合金相互接続配線、電気めっきアノード、集積回路における導電性相互接続配線として用いるための金属合金
JP4750112B2 (ja) 2005-06-15 2011-08-17 Ｊｘ日鉱日石金属株式会社 超高純度銅及びその製造方法並びに超高純度銅からなるボンディングワイヤ

Also Published As

Publication number Publication date
JPS62127438A (ja) 1987-06-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees