JPH0376025B2 - - Google Patents
Info
- Publication number
- JPH0376025B2 JPH0376025B2 JP12727886A JP12727886A JPH0376025B2 JP H0376025 B2 JPH0376025 B2 JP H0376025B2 JP 12727886 A JP12727886 A JP 12727886A JP 12727886 A JP12727886 A JP 12727886A JP H0376025 B2 JPH0376025 B2 JP H0376025B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- lead frame
- glass substrate
- sintered
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 89
- 239000000758 substrate Substances 0.000 claims description 45
- 239000006059 cover glass Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12727886A JPS62285449A (ja) | 1986-06-03 | 1986-06-03 | 回路チツプのパツケ−ジ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12727886A JPS62285449A (ja) | 1986-06-03 | 1986-06-03 | 回路チツプのパツケ−ジ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62285449A JPS62285449A (ja) | 1987-12-11 |
| JPH0376025B2 true JPH0376025B2 (fr) | 1991-12-04 |
Family
ID=14956020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12727886A Granted JPS62285449A (ja) | 1986-06-03 | 1986-06-03 | 回路チツプのパツケ−ジ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62285449A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2706278B2 (ja) * | 1988-10-24 | 1998-01-28 | 東京電波株式会社 | 混成ｉｃパッケージとその製造方法 |
-
1986
- 1986-06-03 JP JP12727886A patent/JPS62285449A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62285449A (ja) | 1987-12-11 |
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