JPH037128B2 - - Google Patents

Info

Publication number

JPH037128B2

JPH037128B2 JP11966283A JP11966283A JPH037128B2 JP H037128 B2 JPH037128 B2 JP H037128B2 JP 11966283 A JP11966283 A JP 11966283A JP 11966283 A JP11966283 A JP 11966283A JP H037128 B2 JPH037128 B2 JP H037128B2

Authority

JP

Japan

Prior art keywords

capacitance

capacitor

grain

aluminum

semiconductor porcelain

Prior art date

1983-06-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004065 semiconductor Substances 0.000 claims description 36
• 239000013078 crystal Substances 0.000 claims description 22
• 229910052573 porcelain Inorganic materials 0.000 claims description 21
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
• 239000003990 capacitor Substances 0.000 claims description 17
• 239000012212 insulator Substances 0.000 claims description 5
• VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 5
• 229910052782 aluminium Inorganic materials 0.000 description 12
• 239000003985 ceramic capacitor Substances 0.000 description 12
• 239000002245 particle Substances 0.000 description 8
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
• 230000000052 comparative effect Effects 0.000 description 7
• 229910052709 silver Inorganic materials 0.000 description 7
• 239000004332 silver Substances 0.000 description 7
• 239000000463 material Substances 0.000 description 6
• 238000000034 method Methods 0.000 description 4
• 239000000203 mixture Substances 0.000 description 3
• IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
• 229910002113 barium titanate Inorganic materials 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 238000007772 electroless plating Methods 0.000 description 2
• 238000009413 insulation Methods 0.000 description 2
• 239000007800 oxidant agent Substances 0.000 description 2
• 239000002994 raw material Substances 0.000 description 2
• 238000007751 thermal spraying Methods 0.000 description 2
• 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
• 229910010413 TiO 2 Inorganic materials 0.000 description 1
• XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 229910052796 boron Inorganic materials 0.000 description 1
• 239000005388 borosilicate glass Substances 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 239000002131 composite material Substances 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 230000018044 dehydration Effects 0.000 description 1
• 238000006297 dehydration reaction Methods 0.000 description 1
• 238000009792 diffusion process Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000001257 hydrogen Substances 0.000 description 1
• 229910052739 hydrogen Inorganic materials 0.000 description 1
• 238000007733 ion plating Methods 0.000 description 1
• 229910052745 lead Inorganic materials 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 150000002739 metals Chemical class 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 229910052757 nitrogen Inorganic materials 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000004544 sputter deposition Methods 0.000 description 1
• 230000003068 static effect Effects 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1
• 238000001771 vacuum deposition Methods 0.000 description 1
• 239000002966 varnish Substances 0.000 description 1