JPH0369192B2 - - Google Patents
Info
- Publication number
- JPH0369192B2 JPH0369192B2 JP59125803A JP12580384A JPH0369192B2 JP H0369192 B2 JPH0369192 B2 JP H0369192B2 JP 59125803 A JP59125803 A JP 59125803A JP 12580384 A JP12580384 A JP 12580384A JP H0369192 B2 JPH0369192 B2 JP H0369192B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- double
- copper
- sided copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 238000007747 plating Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 230000000873 masking effect Effects 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 2
- 238000005253 cladding Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12580384A JPS614295A (ja) | 1984-06-19 | 1984-06-19 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12580384A JPS614295A (ja) | 1984-06-19 | 1984-06-19 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS614295A JPS614295A (ja) | 1986-01-10 |
| JPH0369192B2 true JPH0369192B2 (es) | 1991-10-31 |
Family
ID=14919288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12580384A Granted JPS614295A (ja) | 1984-06-19 | 1984-06-19 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS614295A (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2702773B1 (fr) * | 1993-03-19 | 1995-06-16 | Deslog | Procede de preparation de fractions de matieres grasses d'origine vegetale enrichies en matieres insaponifiables. |
| JP6477364B2 (ja) * | 2015-08-28 | 2019-03-06 | 住友金属鉱山株式会社 | フレキシブル多層回路基板用の金属張積層体の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285366A (en) * | 1976-01-09 | 1977-07-15 | Ok Print Haisen Kk | Method of producing solder through hole substrate |
| JPS54156167A (en) * | 1978-05-31 | 1979-12-08 | Matsushita Electric Ind Co Ltd | Method of producing double side printed circuit board |
| JPS57207396A (en) * | 1981-06-16 | 1982-12-20 | Asahi Chemical Ind | Method of producing ultrafine thick film printed circuit board |
-
1984
- 1984-06-19 JP JP12580384A patent/JPS614295A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285366A (en) * | 1976-01-09 | 1977-07-15 | Ok Print Haisen Kk | Method of producing solder through hole substrate |
| JPS54156167A (en) * | 1978-05-31 | 1979-12-08 | Matsushita Electric Ind Co Ltd | Method of producing double side printed circuit board |
| JPS57207396A (en) * | 1981-06-16 | 1982-12-20 | Asahi Chemical Ind | Method of producing ultrafine thick film printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS614295A (ja) | 1986-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5369881A (en) | Method of forming circuit wiring pattern | |
| US3786172A (en) | Printed circuit board method and apparatus | |
| US2777193A (en) | Circuit construction | |
| JPH0369192B2 (es) | ||
| JP2700259B2 (ja) | プリント配線板における凹所を有する半田層の形成方法 | |
| JP2741238B2 (ja) | フレキシブルプリント配線板及びその製造方法 | |
| JPH0492496A (ja) | プリント基板の製造方法と電子部品の実装方法 | |
| JPH01173694A (ja) | 両面スルホールフィルムキャリアの製造方法 | |
| JPH0296389A (ja) | 両面プリント回路基板 | |
| JPH04335596A (ja) | スルーホールプリント配線基板の製造方法 | |
| JPS59198791A (ja) | 配線基板 | |
| KR100259081B1 (ko) | 다층 배선 기판 및 그의 제조방법 | |
| JP3130707B2 (ja) | プリント基板およびその製造方法 | |
| JPH0336319B2 (es) | ||
| JPH01196196A (ja) | プリント配線板における半田層の形成方法 | |
| JPS6355236B2 (es) | ||
| JPS63246894A (ja) | フレキシブルスル−ホ−ル基板の製造方法 | |
| JPH05327184A (ja) | 電子部品搭載用基板の製造方法 | |
| JPS60260195A (ja) | 複数層プリント回路基板及びその組付体の製造方法 | |
| JPH04158596A (ja) | 電子部品実装方法 | |
| JP2942401B2 (ja) | メッキ用治具 | |
| JPS592400B2 (ja) | プリント板の製造方法 | |
| JPH0417387A (ja) | プリント回路基板の製造方法 | |
| JPS581557B2 (ja) | 配線基板の製造方法 | |
| JPH05275830A (ja) | 電子部品搭載用基板の製造方法 |