JPH0368187A - フレキシブル回路基板 - Google Patents
フレキシブル回路基板Info
- Publication number
- JPH0368187A JPH0368187A JP30408489A JP30408489A JPH0368187A JP H0368187 A JPH0368187 A JP H0368187A JP 30408489 A JP30408489 A JP 30408489A JP 30408489 A JP30408489 A JP 30408489A JP H0368187 A JPH0368187 A JP H0368187A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- section
- circuit pattern
- mounting
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 claims abstract description 26
- 230000007704 transition Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 9
- 238000000059 patterning Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 28
- 239000011888 foil Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132253A Division JPS6112094A (ja) | 1984-06-27 | 1984-06-27 | フレキシブル回路基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0368187A true JPH0368187A (ja) | 1991-03-25 |
| JPH0346992B2 JPH0346992B2 (enrdf_load_stackoverflow) | 1991-07-17 |
Family
ID=17928837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30408489A Granted JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0368187A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (ja) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | プリント配線板および半導体装置 |
| WO2008035416A1 (fr) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Plaquette de circuit imprimé flexorigide et procédé de fabrication de la plaquette de circuit imprimé flexorigide |
-
1989
- 1989-11-22 JP JP30408489A patent/JPH0368187A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (ja) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | プリント配線板および半導体装置 |
| WO2008035416A1 (fr) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Plaquette de circuit imprimé flexorigide et procédé de fabrication de la plaquette de circuit imprimé flexorigide |
| CN101518163B (zh) | 2006-09-21 | 2011-06-08 | 株式会社大昌电子 | 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法 |
| US8188372B2 (en) | 2006-09-21 | 2012-05-29 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
| US9155209B2 (en) | 2006-09-21 | 2015-10-06 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346992B2 (enrdf_load_stackoverflow) | 1991-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |