JPH0367356B2 - - Google Patents

Info

Publication number
JPH0367356B2
JPH0367356B2 JP58073654A JP7365483A JPH0367356B2 JP H0367356 B2 JPH0367356 B2 JP H0367356B2 JP 58073654 A JP58073654 A JP 58073654A JP 7365483 A JP7365483 A JP 7365483A JP H0367356 B2 JPH0367356 B2 JP H0367356B2
Authority
JP
Japan
Prior art keywords
bath
nickel
borane
present
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58073654A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58202595A (ja
Inventor
Daburyuu Boodorando Donarudo
Pawaazu Furemingu Rebetsuka
Jei Guniiueku Jon
Emu Haauiruchutsuku Josefu
Efu Shumetsukenbetsuchaa Aanorudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS58202595A publication Critical patent/JPS58202595A/ja
Publication of JPH0367356B2 publication Critical patent/JPH0367356B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemically Coating (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58073654A 1982-04-27 1983-04-26 誘電支持体上の冶金学的パタ−ン上にニツケル−ホウ素の被膜を選択的に析出する方法およびそれにより製造された製品 Granted JPS58202595A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37210182A 1982-04-27 1982-04-27
US372101 1982-04-27

Publications (2)

Publication Number Publication Date
JPS58202595A JPS58202595A (ja) 1983-11-25
JPH0367356B2 true JPH0367356B2 (enExample) 1991-10-22

Family

ID=23466722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58073654A Granted JPS58202595A (ja) 1982-04-27 1983-04-26 誘電支持体上の冶金学的パタ−ン上にニツケル−ホウ素の被膜を選択的に析出する方法およびそれにより製造された製品

Country Status (5)

Country Link
US (2) US5403650A (enExample)
EP (1) EP0092971B1 (enExample)
JP (1) JPS58202595A (enExample)
CA (1) CA1207464A (enExample)
DE (1) DE3380413D1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380413D1 (en) * 1982-04-27 1989-09-21 Richardson Chemical Co Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
JPH0634442B2 (ja) * 1986-11-25 1994-05-02 株式会社日立製作所 ムライト配線基板の製造方法
US4954370A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Electroless plating of nickel on anodized aluminum
NL9100241A (nl) * 1991-02-12 1991-08-01 Koninkl Philips Electronics Nv Werkwijze voor de vervaardiging van een halfgeleiderinrichting.
JPH06216184A (ja) * 1992-08-20 1994-08-05 Toyota Autom Loom Works Ltd 配線基板上の配線の表面処理方法
US5601684A (en) * 1992-09-03 1997-02-11 Olympus Optical Co., Ltd. Method for manufacturing an ion flow electrostatic recording head
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
US5846598A (en) * 1995-11-30 1998-12-08 International Business Machines Corporation Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating
US6060176A (en) * 1995-11-30 2000-05-09 International Business Machines Corporation Corrosion protection for metallic features
US5721014A (en) * 1995-12-19 1998-02-24 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
DE19716356A1 (de) * 1996-04-26 1997-10-30 Murata Manufacturing Co Verfahren zur Herstellung von monolithischen elektronischen Teilen
DE19705745C2 (de) * 1997-02-14 2002-02-07 Fraunhofer Ges Forschung Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
GB2326976A (en) * 1997-06-30 1999-01-06 Harris Corp Varistor nickel barrier electrode
IT1297448B1 (it) * 1997-12-18 1999-12-17 Soprin S R L Metodo per la zincatura a caldo di materiali ferrosi
US6214523B1 (en) * 1998-01-09 2001-04-10 International Business Machines Corporation Pattern formation by removal of paste material
JP4811543B2 (ja) * 2000-09-08 2011-11-09 学校法人早稲田大学 微細パターンの作製方法
JP2002226974A (ja) * 2000-11-28 2002-08-14 Ebara Corp 無電解Ｎｉ−Ｂめっき液、電子デバイス装置及びその製造方法
US7078796B2 (en) * 2003-07-01 2006-07-18 Freescale Semiconductor, Inc. Corrosion-resistant copper bond pad and integrated device
JP4802867B2 (ja) * 2006-05-31 2011-10-26 富士ゼロックス株式会社 電子部品、レーザ装置、光書込み装置及び画像形成装置
JP5764882B2 (ja) * 2010-08-13 2015-08-19 株式会社村田製作所 積層型セラミック電子部品およびその製造方法
CN104475951B (zh) * 2014-11-09 2016-06-08 北京工业大学 一种电阻加热金属丝材熔积成形方法
JP6803137B2 (ja) * 2015-09-30 2020-12-23 浜松ホトニクス株式会社 裏面入射型固体撮像素子
US10446336B2 (en) 2016-12-16 2019-10-15 Abb Schweiz Ag Contact assembly for electrical devices and method for making

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US3045334A (en) * 1958-10-01 1962-07-24 Du Pont Alloy and composite metal plate
US3096182A (en) * 1958-10-01 1963-07-02 Du Pont Chemical plating solution and process for plating therewith
US3338726A (en) * 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
DE1254935B (de) * 1960-12-31 1967-11-23 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
US4061802A (en) * 1966-10-24 1977-12-06 Costello Francis E Plating process and bath
US3540894A (en) * 1967-03-29 1970-11-17 Ibm Eutectic lead bisilicate ceramic compositions and fired ceramic bodies
US3532541A (en) * 1967-06-19 1970-10-06 Ibm Boron containing composite metallic films and plating baths for their electroless deposition
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
US3666527A (en) * 1970-07-31 1972-05-30 Rca Corp Method of electroless deposition of metals with improved sensitizer
US3767583A (en) * 1971-08-13 1973-10-23 Enthone Activator solutions their preparation and use in electroless plating of surfaces
US3841881A (en) * 1972-09-13 1974-10-15 Rca Corp Method for electroless deposition of metal using improved colloidal catalyzing solution
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
BE818613A (fr) * 1973-08-15 1975-02-10 Procede chimique de nickelage et de cobaltage
US4232060A (en) * 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US4131692A (en) * 1974-07-11 1978-12-26 Siemens Aktiengesellschaft Method for making ceramic electric resistor
US4061588A (en) * 1975-09-30 1977-12-06 Shipley Company Inc. Catalyst composition and method of preparation
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
JPS556822A (en) * 1978-06-30 1980-01-18 Oki Electric Ind Co Ltd Method of manufacturing ceramic multiilayer wiring board
JPS5524446A (en) * 1978-08-09 1980-02-21 Ngk Insulators Ltd Ceramic circuit board
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen
US4278707A (en) * 1980-05-19 1981-07-14 Hewlett-Packard Company Method for coating the edge of a printed circuit board to improve its moisture resistance
US4340618A (en) * 1981-03-20 1982-07-20 International Business Machines Corporation Process for forming refractory metal layers on ceramic substrate
US4407860A (en) * 1981-06-30 1983-10-04 International Business Machines Corporation Process for producing an improved quality electrolessly deposited nickel layer
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate
DE3380413D1 (en) * 1982-04-27 1989-09-21 Richardson Chemical Co Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby

Also Published As

Publication number Publication date
EP0092971A1 (en) 1983-11-02
JPS58202595A (ja) 1983-11-25
CA1207464A (en) 1986-07-08
DE3380413D1 (en) 1989-09-21
EP0092971B1 (en) 1989-08-16
US5565235A (en) 1996-10-15
US5403650A (en) 1995-04-04

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