JPH0366107B2 - - Google Patents

Info

Publication number
JPH0366107B2
JPH0366107B2 JP57209389A JP20938982A JPH0366107B2 JP H0366107 B2 JPH0366107 B2 JP H0366107B2 JP 57209389 A JP57209389 A JP 57209389A JP 20938982 A JP20938982 A JP 20938982A JP H0366107 B2 JPH0366107 B2 JP H0366107B2
Authority
JP
Japan
Prior art keywords
wafer
wafers
polishing
flatness
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57209389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59102570A (ja
Inventor
Kyoshi Akamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57209389A priority Critical patent/JPS59102570A/ja
Publication of JPS59102570A publication Critical patent/JPS59102570A/ja
Publication of JPH0366107B2 publication Critical patent/JPH0366107B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP57209389A 1982-12-01 1982-12-01 ウエハの研磨方法 Granted JPS59102570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57209389A JPS59102570A (ja) 1982-12-01 1982-12-01 ウエハの研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57209389A JPS59102570A (ja) 1982-12-01 1982-12-01 ウエハの研磨方法

Publications (2)

Publication Number Publication Date
JPS59102570A JPS59102570A (ja) 1984-06-13
JPH0366107B2 true JPH0366107B2 (enrdf_load_stackoverflow) 1991-10-16

Family

ID=16572092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57209389A Granted JPS59102570A (ja) 1982-12-01 1982-12-01 ウエハの研磨方法

Country Status (1)

Country Link
JP (1) JPS59102570A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61230865A (ja) * 1985-04-05 1986-10-15 Mitsui Mining & Smelting Co Ltd 両面ポリシ盤

Also Published As

Publication number Publication date
JPS59102570A (ja) 1984-06-13

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