JPH0365910B2 - - Google Patents

Info

Publication number
JPH0365910B2
JPH0365910B2 JP59273466A JP27346684A JPH0365910B2 JP H0365910 B2 JPH0365910 B2 JP H0365910B2 JP 59273466 A JP59273466 A JP 59273466A JP 27346684 A JP27346684 A JP 27346684A JP H0365910 B2 JPH0365910 B2 JP H0365910B2
Authority
JP
Japan
Prior art keywords
circuit
resin
thickness
board
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59273466A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61154096A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59273466A priority Critical patent/JPS61154096A/ja
Publication of JPS61154096A publication Critical patent/JPS61154096A/ja
Publication of JPH0365910B2 publication Critical patent/JPH0365910B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59273466A 1984-12-26 1984-12-26 多層印刷配線板の製造方法 Granted JPS61154096A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273466A JPS61154096A (ja) 1984-12-26 1984-12-26 多層印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273466A JPS61154096A (ja) 1984-12-26 1984-12-26 多層印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS61154096A JPS61154096A (ja) 1986-07-12
JPH0365910B2 true JPH0365910B2 (de) 1991-10-15

Family

ID=17528313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273466A Granted JPS61154096A (ja) 1984-12-26 1984-12-26 多層印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS61154096A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62147798A (ja) * 1985-12-23 1987-07-01 東芝ケミカル株式会社 多層プリント配線板
JPS6324695A (ja) * 1986-07-17 1988-02-02 東芝ケミカル株式会社 多層プリント配線板の製造方法
JPS6484698A (en) * 1987-09-26 1989-03-29 Matsushita Electric Works Ltd Manufacture of multilayer circuit board
JPH01143294A (ja) * 1987-11-27 1989-06-05 Hitachi Chem Co Ltd 多層プリント配線板の製造法
JP2646711B2 (ja) * 1988-11-01 1997-08-27 日本電気株式会社 多層印刷配線板の製造方法
JP2682093B2 (ja) * 1988-12-27 1997-11-26 日本電気株式会社 多層印刷配線板の製造方法
JPH0458591A (ja) * 1990-06-28 1992-02-25 Shin Kobe Electric Mach Co Ltd 多層印刷配線板の製造法
JPH07123185B2 (ja) * 1992-09-25 1995-12-25 松下電工株式会社 回路基板
KR100209259B1 (ko) * 1996-04-25 1999-07-15 이해규 Ic 카드 및 그 제조방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132772A (en) * 1977-04-22 1978-11-18 Tokyo Shibaura Electric Co Multilayer printed circuit board
JPS55120649A (en) * 1979-03-12 1980-09-17 Hitachi Chem Co Ltd Resin composition used for prepreg for multiply lamination
JPS56148895A (en) * 1980-04-21 1981-11-18 Fujitsu Ltd Both-side printed circuit board and multilayer board
JPS56159229A (en) * 1980-05-14 1981-12-08 Mitsubishi Gas Chem Co Inc Production of multilayer board
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
JPS59121995A (ja) * 1982-12-28 1984-07-14 日本電気株式会社 多層プリント配線板の製造方法
JPS59149095A (ja) * 1983-02-15 1984-08-25 三菱瓦斯化学株式会社 多層板の製造法
JPS6062194A (ja) * 1983-09-14 1985-04-10 松下電工株式会社 多層印刷配線板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132772A (en) * 1977-04-22 1978-11-18 Tokyo Shibaura Electric Co Multilayer printed circuit board
JPS55120649A (en) * 1979-03-12 1980-09-17 Hitachi Chem Co Ltd Resin composition used for prepreg for multiply lamination
JPS56148895A (en) * 1980-04-21 1981-11-18 Fujitsu Ltd Both-side printed circuit board and multilayer board
JPS56159229A (en) * 1980-05-14 1981-12-08 Mitsubishi Gas Chem Co Inc Production of multilayer board
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
JPS59121995A (ja) * 1982-12-28 1984-07-14 日本電気株式会社 多層プリント配線板の製造方法
JPS59149095A (ja) * 1983-02-15 1984-08-25 三菱瓦斯化学株式会社 多層板の製造法
JPS6062194A (ja) * 1983-09-14 1985-04-10 松下電工株式会社 多層印刷配線板の製造方法

Also Published As

Publication number Publication date
JPS61154096A (ja) 1986-07-12

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