JPH0365659B2 - - Google Patents

Info

Publication number
JPH0365659B2
JPH0365659B2 JP2145284A JP2145284A JPH0365659B2 JP H0365659 B2 JPH0365659 B2 JP H0365659B2 JP 2145284 A JP2145284 A JP 2145284A JP 2145284 A JP2145284 A JP 2145284A JP H0365659 B2 JPH0365659 B2 JP H0365659B2
Authority
JP
Japan
Prior art keywords
lsi
film
film carrier
input
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2145284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60165732A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2145284A priority Critical patent/JPS60165732A/ja
Publication of JPS60165732A publication Critical patent/JPS60165732A/ja
Publication of JPH0365659B2 publication Critical patent/JPH0365659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2145284A 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ Granted JPS60165732A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2145284A JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2145284A JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Publications (2)

Publication Number Publication Date
JPS60165732A JPS60165732A (ja) 1985-08-28
JPH0365659B2 true JPH0365659B2 (enrdf_load_stackoverflow) 1991-10-14

Family

ID=12055352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2145284A Granted JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Country Status (1)

Country Link
JP (1) JPS60165732A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6937037B2 (en) 1995-11-09 2005-08-30 Formfactor, Et Al. Probe card assembly for contacting a device with raised contact elements
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
US7455540B2 (en) 1999-08-17 2008-11-25 Formfactor, Inc. Electrical contactor, especially wafer level contactor, using fluid pressure
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same
US6937037B2 (en) 1995-11-09 2005-08-30 Formfactor, Et Al. Probe card assembly for contacting a device with raised contact elements
US7455540B2 (en) 1999-08-17 2008-11-25 Formfactor, Inc. Electrical contactor, especially wafer level contactor, using fluid pressure
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer

Also Published As

Publication number Publication date
JPS60165732A (ja) 1985-08-28

Similar Documents

Publication Publication Date Title
US3715629A (en) Wiring device for interconnecting module circuit units
JPS6343279A (ja) 電気コネクタおよび電気コネクタ用接点部材
JPH0864315A (ja) リセプタクル型電気コネクタ
JP2001143798A (ja) ほぼ平坦な面に使用するのに適した電気コネクタ
EP0880178B1 (en) Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from single lead frame
JPH0365659B2 (enrdf_load_stackoverflow)
JPS61139894A (ja) Ｉｄカ−ドおよびその製造方法
US5894411A (en) Stackable data carrier arrangement
JPH04196253A (ja) 半導体装置用パッケージ
JPS6013186Y2 (ja) 電気コネクタ
JP3206676B2 (ja) 基板用コネクタ
JPS61294875A (ja) 光発電素子
JPH0528705Y2 (enrdf_load_stackoverflow)
JP2641912B2 (ja) 格子配列形半導体素子パッケージ
JPS62206868A (ja) 電子装置
JP2618891B2 (ja) メモリカートリツジ
JP2577640Y2 (ja) リ−ドフレ−ム
JPS61145888A (ja) 印刷配線基板接続装置
JPS63158764A (ja) メモリカ−トリツジ
JPS5915500Y2 (ja) 半導体記憶装置
JPH04304659A (ja) 混成集積回路装置
JPH0316308Y2 (enrdf_load_stackoverflow)
JPH0735427Y2 (ja) カードエッジコネクタ
JPH04118852A (ja) 薄型電池
JPH0282543A (ja) Ｉｃ実装構造

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees