JPS60165732A - フィルム・キャリアｌｓｉ - Google Patents

フィルム・キャリアｌｓｉ

Info

Publication number
JPS60165732A
JPS60165732A JP2145284A JP2145284A JPS60165732A JP S60165732 A JPS60165732 A JP S60165732A JP 2145284 A JP2145284 A JP 2145284A JP 2145284 A JP2145284 A JP 2145284A JP S60165732 A JPS60165732 A JP S60165732A
Authority
JP
Japan
Prior art keywords
holes
lsi
film
arrays
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2145284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365659B2 (enrdf_load_stackoverflow
Inventor
Tadashi Tomino
冨野　忠
Masahiro Higami
日上　雅弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2145284A priority Critical patent/JPS60165732A/ja
Publication of JPS60165732A publication Critical patent/JPS60165732A/ja
Publication of JPH0365659B2 publication Critical patent/JPH0365659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2145284A 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ Granted JPS60165732A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2145284A JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2145284A JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Publications (2)

Publication Number Publication Date
JPS60165732A true JPS60165732A (ja) 1985-08-28
JPH0365659B2 JPH0365659B2 (enrdf_load_stackoverflow) 1991-10-14

Family

ID=12055352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2145284A Granted JPS60165732A (ja) 1984-02-07 1984-02-07 フィルム・キャリアｌｓｉ

Country Status (1)

Country Link
JP (1) JPS60165732A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6468098B1 (en) 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer

Also Published As

Publication number Publication date
JPH0365659B2 (enrdf_load_stackoverflow) 1991-10-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees