JPH0332917B2 - - Google Patents

Info

Publication number
JPH0332917B2
JPH0332917B2 JP57185094A JP18509482A JPH0332917B2 JP H0332917 B2 JPH0332917 B2 JP H0332917B2 JP 57185094 A JP57185094 A JP 57185094A JP 18509482 A JP18509482 A JP 18509482A JP H0332917 B2 JPH0332917 B2 JP H0332917B2
Authority
JP
Japan
Prior art keywords
wiring
board
superconducting
card
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57185094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5974690A (ja
Inventor
Junji Watanabe
Fumikazu Oohira
Junpei Suzuki
Kenichi Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP57185094A priority Critical patent/JPS5974690A/ja
Publication of JPS5974690A publication Critical patent/JPS5974690A/ja
Publication of JPH0332917B2 publication Critical patent/JPH0332917B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP57185094A 1982-10-20 1982-10-20 超伝導素子実装体 Granted JPS5974690A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57185094A JPS5974690A (ja) 1982-10-20 1982-10-20 超伝導素子実装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57185094A JPS5974690A (ja) 1982-10-20 1982-10-20 超伝導素子実装体

Publications (2)

Publication Number Publication Date
JPS5974690A JPS5974690A (ja) 1984-04-27
JPH0332917B2 true JPH0332917B2 (enrdf_load_stackoverflow) 1991-05-15

Family

ID=16164733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57185094A Granted JPS5974690A (ja) 1982-10-20 1982-10-20 超伝導素子実装体

Country Status (1)

Country Link
JP (1) JPS5974690A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040052A (en) * 1987-12-28 1991-08-13 Texas Instruments Incorporated Compact silicon module for high density integrated circuits
JPH0710005B2 (ja) * 1989-08-31 1995-02-01 アメリカン テレフォン アンド テレグラフ カムパニー 超伝導体相互接続装置
JP2003101088A (ja) * 2001-09-25 2003-04-04 Hitachi Kokusai Electric Inc 超伝導回路の実装構造

Also Published As

Publication number Publication date
JPS5974690A (ja) 1984-04-27

Similar Documents

Publication Publication Date Title
US5015191A (en) Flat IC chip connector
US4089575A (en) Connector for connecting a circuit element to the surface of a substrate
US5829988A (en) Socket assembly for integrated circuit chip carrier package
US7453157B2 (en) Microelectronic packages and methods therefor
KR101171842B1 (ko) 초미세 피치의 적층을 갖는 마이크로전자 조립체
EP0826152B1 (en) Method and apparatus for testing semiconductor dice
JP4389209B2 (ja) プリント回路基板用相互接続アセンブリ及び製造方法
US6286205B1 (en) Method for making connections to a microelectronic device having bump leads
US6096576A (en) Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6320397B1 (en) Molded plastic carrier for testing semiconductor dice
US4924353A (en) Connector system for coupling to an integrated circuit chip
US7120999B2 (en) Methods of forming a contact array in situ on a substrate
US3484534A (en) Multilead package for a multilead electrical device
CN102332646B (zh) 用于电子模块的电连接器
US5227995A (en) High density semiconductor memory module using split finger lead frame
JPS62584B2 (enrdf_load_stackoverflow)
US20060042821A1 (en) Memory modules and methods for manufacturing memory modules
KR20080073739A (ko) 적층형 마이크로전자 패키지
US20030042591A1 (en) Electronic component with at least two stacked semiconductor chips, and fabrication method
JPH0332917B2 (enrdf_load_stackoverflow)
US20060141667A1 (en) Bare die socket
US20250125551A1 (en) Electrical connector
JPS5973873A (ja) マイクロコネクタ
JPH0716317Y2 (ja) Lsiソケット
JP2002270760A (ja) 電子部品、そのアセンブリ及びその製造方法