JPH0332917B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a superconducting element package for mounting superconducting elements used at extremely low temperatures with high density and exhibiting high performance.

Background of the Technology Conventionally, this type of superconducting element mounting body includes a silicon board (hereinafter referred to as a board) 1 having a socket hole 101 formed by shape etching and a hole inside the socket hole 101, as shown in the cross-sectional view of the main part of FIG. A mercury bulb 102 injected into the substrate, a silicon card substrate (hereinafter referred to as a card) 3 on which a superconducting element 2 is mounted, and a platinum micro pin 40 bonded to the card 3 in an L shape.
1 mounted thereon (hereinafter referred to as the foot) 4, a superconducting element disposed on the opposite side of the superconducting element 2 with respect to the board 1, a wiring module 5 for controlling the operation between the superconducting elements, and a wiring module 5. It is composed of platinum micro pins 501 attached to the. 103, 104, and 105 are the wiring for the wiring module, foot, and card, respectively; 201
are solder bumps. For example, the number of micro pins and micro sockets for one set of card board is
Since 16 to 32 sets of cards are inserted into one board, around 10 socket holes are drilled, and each wiring module has thousands of socket holes. micropins were implanted,
The dimensions of each socket hole are around 100 μm in diameter, and the dimensions of the micro pins are around 60 μm in diameter.

Prior Art and Problems Conventional superconducting element mounting bodies have the above-mentioned configuration, and the number of cards that can be inserted and assembled on the board is limited by the width of the foot 4. Mounting a larger number of cards, that is, mounting superconducting elements at a higher density, is not possible. In the future, when the number of signal transmission terminals increases as the size of superconducting elements becomes smaller, the number of micro pins installed on the foot will not be sufficient. If the number of micro pin rows were increased, the width of the foot would have to be increased, and high-density mounting would not be possible due to the above-mentioned relationship.
It is extremely difficult to plant thousands of micro-pins, which are difficult to form, on a single wiring module board while guaranteeing mutual positional accuracy.The board has many holes formed in the silicon substrate. Moreover, since it is made by bonding two perforated substrates with adhesive, its strength is weak when it is enlarged for high-density mounting, and it bends at extremely low temperatures, causing micro- It also reduces the reliability of the connection between the pin and the mercury bulb. In particular, there were many problems, including the fact that it was extremely difficult to securely connect and maintain the thousands of micro pins and socket holes in a large wiring module.

Purpose of the Invention In order to solve these drawbacks, the present invention is to separate boards and vertically install them on opposing wiring modules, and to stack superconducting element towers vertically on two opposing wiring modules in the form of shelves. The present invention is characterized by the fact that mounting boards are stacked and mounted, and its purpose is to provide a superconducting element package that is highly reliable and has a high packaging density. The drawings will be explained in detail below.

Embodiment of the Invention FIG. 2 shows an embodiment of the invention, in which the same symbols as in FIG. 1 indicate the same parts. In the superconducting element assembly of this embodiment, the board 1 has a board component 108 having a mercury bulb 102 housed in a socket hole 101.
and a platinum washer 1 formed on the on-board wiring 107.
06 to form a mercury cavity microsocket portion, and the board 1 is vertically adhered to the wiring module 5. 2 is a superconducting element mounted on the card 3 by solder bumps 201, and on both ends of the card 3 there are holes in the same position corresponding to the socket holes 101 of the board 1 so as to be loosely inserted into the socket holes 101. , the same number of platinum micropins 401 are planted. Both end surfaces of a Si frame plate 502 for fixing the distance between two opposing wiring modules 5 and forming an assembly are adhered to the surfaces of the wiring modules 5. Reference numeral 6 denotes a liquid plate-like spring material inserted between the bottom surface of the board 1 and the top surface of the card 3 in order to stably hold the card 3 after it is mounted on the board 1. 503 is a wiring pattern of the wiring module 5.

The operation of such a mounting body is based on the wiring module 5.
The signal from the upper wiring pattern 503 is transmitted to the wiring 107 on the board 1, and then from the platinum washer 106 through the mercury bulb 102, from the micro pin 401 to the wiring 301 on the board, and is transmitted to the superconducting element 2, and the card is transferred to the superconducting element 2 through the board wiring 301. The superconducting elements on the top 3 are connected through a microconnector side consisting of a mercury cavity microsocket section and a micropin, which shortens the signal propagation length.

In addition, in the example of wiring module 5, a format was described in which a wiring pattern was formed on only one side and mounted, but in consideration of the problem of curving in extremely low temperatures, wiring patterns were formed on both sides and boards were mounted on both sides. A method may be adopted in which cards are mounted on both sides.

Effects of the Invention As described above, the superconducting element mounting according to the present invention can narrow the gap between cards, so
Micro connectors, which are signal transmission terminals for superconducting elements, can be formed on both sides of the card, increasing the spatial density of superconducting element mounting, increasing the number of terminals and supporting future miniaturization of superconducting element dimensions. Although there are multiple rows of micro pins planted on the card, the micro pin rows that are difficult to form and plant can be formed at a high yield because they are dispersed in each row and on both sides, and the board substrate is also cut into small pieces. It has many advantages over conventional superconducting element mounts, such as having no problems with strength because it has a similar shape.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a main part of a conventional superconducting element package, and FIG. 2 is a sectional view of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 101... Socket hole, 102... Mercury bulb, 103... Wiring of wiring module, 104...
Foot wiring, 105... Card wiring, 106... Platinum washer, 107... Wiring on board, 108, 109...
Board component, 2... Superconducting element, 201... Solder bump, 3... Card board, 301... Card wiring, 4... Foot board, 401... Micro pin, 5
...Wiring module, 501...Micro pin, 50
2...Si frame plate, 503...wiring pattern, 6...corrugated plate-shaped presser spring.

Claims (1)

[Claims] 1. In a superconducting element mounting body that performs signal transmission between multiple superconducting elements by connecting a card board on which superconducting elements are mounted and a wiring module via a micro connector, Two wiring modules with wiring drawn on opposing surfaces, and multiple rows of mercury cavity microsockets installed perpendicularly to each wiring module and individually electrically connected to the wiring of the wiring module. A plurality of superconducting elements are mounted on the central part, and both ends are arranged opposite to the mercury cavity/micro socket part of the board. It is characterized by comprising a card board with micro pins planted at the positions inserted through each of the card boards, and electrical connections are made between the superconducting elements mounted on the card board and between the superconducting elements and the wiring module. A superconducting element mounted body.