JPH0716317Y2 - LSI socket - Google Patents

Description

[Detailed Description of the Invention] [Outline] The present invention relates to an LSI socket in which a large number of contact probes are penetratingly arranged in an insulating block, and by reducing the capacitive coupling between the closely arranged contact probes. For the purpose of improving electrical characteristics and facilitating manufacturing, a block made of an insulating material and one end of a terminal part connected to a predetermined circuit of the device and a terminal of the LSI package are pressure-contact connected. A rod-shaped contact probe which is arranged in the block corresponding to the terminal of the LSI package to be connected and which has the other end of the part and is attached through the block; Guide means provided to match the position of the other end of the block, the middle part of the block is a hollow part of the space. The contact probe is configured such that the intermediate portion is inside the hollow portion and one end side and the other end side are supported by the block.

[Industrial application field]

The present invention relates to an LSI socket having a plurality of contact probes penetratingly arranged in an insulating material block.

Various sockets are used to connect an LSI package having an LSI element to a predetermined circuit of the device, depending on the function of the device. Among such sockets, there is a device that requires a socket that allows easy and easy attachment / detachment of an LSI package.

Even if it can be easily attached and detached, since the LSI package has a large number of terminals for inputting and outputting signals, the connection of these terminals and sockets is done according to the attachment and detachment of the LSI package. In addition, it is important to ensure that the separation is performed.

[Conventional technology]

A conventional socket that can meet such a demand will be described with reference to FIG. FIG. 3A is a side view of the state where the LSI package is attached, FIG. 3B is a side sectional view of the socket, and FIG. 3C is a sectional view of the contact probe portion.

As shown in each drawing, the socket 11 is a guide means for positioning an LSI pattern, in which a large number of contact probes 4 are arranged and penetrated in a block 12 made of an insulating material so as to be at predetermined positions. Guide pins 6A, 6B
Is provided so as to project to a specified position.

This socket 11 is the lower end of the contact probe 4 in the figure,
That is, one end 4A of the terminal portion to be connected to the predetermined circuit of the device
In this case, however, it is soldered 13 to the pad 2 of the circuit pattern of the substrate 1 on which the predetermined circuit is formed. in this way,
On a socket 11 mounted on the circuit board 1, a semiconductor LSI package 7 having a semiconductor chip 7A mounted inside a chip carrier 7B is mounted while being guided by guide pins 6A and 6B.

A heat dissipation member 10 for dissipating internally generated heat to the outside is provided above the LSI package 7 and above the semiconductor chip 7A, and the pressing force applied in the arrow F direction from above the contact probe 4 of each contact probe 4 All the terminals 8 are pressure-connected to the upper part of the drawing.

To remove the LSI package 7 from the substrate 1, the heat dissipation member 1
By removing the pressing force applied to 0, the LSI package 7 is lifted and pulled out from the guide pins 6A and 6B, it can be taken out easily.

The socket 11 as described above, as shown in FIG.
As the density of the LSI package 7 increases and the number of terminals 8 increases, the terminal spacing becomes narrower, and the pitch spacing p between the contact probes 4 also becomes narrower.

The block 12 made of an insulator that penetrates and supports the contact probe 4 is usually made of, for example, a glass epoxy resin material selected as a material having a dielectric constant as low as possible. The block 12 made of such a material is formed into a cube-shaped block by drilling holes,
The contact probe 4 is press-fitted into the through hole, or an appropriate adhesive is applied and inserted and fixed.

In order to make a hole by drilling in this way, it is difficult to advance the drill straight to a block having a thickness corresponding to the length of the contact probe 4, which causes bending and accuracy. I can't get good holes.

In general, there is a fixed ratio to the length of the drill in which an accurate state can be obtained, and the thickness of the block in which the elongated contact probe 4 is embedded exceeds such a limit.

The conventional block drilling requiring such a thickness is performed by thin plate members 12-1, 12-2, 12-2,
12-3 and 12-4 are appropriately divided, and through holes 12A and 12B and 12C are precisely positioned and opened in the central portion and diagonal corner portions of these members, respectively. Each thin member can be easily drilled accurately.

After the drilling process, the block 12 is configured by stacking and integrating the members 12-1, 12-2, 12-3, 12-4.

The contact probe 4 is provided in the through hole 12A of the block 12 thus configured, and the guide pin 6A is provided in the through hole 12B.
The guide pin 6B was inserted into the through hole 12C to form the socket 11.

As shown in FIG. (C), the contact probe 4 has a compression coil spring 4C provided inside a tubular shape.
The other end of the contact part where the terminals of the LSI package are contact-connected by pressure contact by the pressing force on the spring 4C and the elastic restoring force.
The 4B side part is configured to be expandable / contractible in the direction indicated by the arrow. As described above, the contact probe 4 has a rod-like shape with a small diameter in appearance.

The LSI package 7 mounted and connected to the socket 11 having the contact probe 4 thus configured is connected to the circuit board 1 via the contact probe 4 such as a ground circuit, a power supply circuit, and a signal input / output circuit. Connected to each.

[Problems to be solved by the device]

According to the conventional socket 11 described above, although the low dielectric constant selected as the material forming the block 12 is used, for example, the glass epoxy resin material is used, the contact probe 4 is used as the density of the LSI package 7 increases. When the spacing pitch p between adjacent ones of the contact probe 4 becomes small and they are brought close to each other, even if the insulating material has a low dielectric constant, the mutual capacitive coupling between the adjacent ones of the contact probes 4 becomes large, resulting in interference between the input and output of signals. There is a risk that the obstacles will not be negligible and may affect each other. In particular, a speeded-up electronic circuit has a problem that its electrical characteristics are deteriorated.

As described above, each member in the state where the block is divided, 12
According to the manufacturing method of -1, 12, 2-2, 12-3, and 12-4, which are subjected to precise processing to be laminated and integrated, there is a problem that an increase in cost cannot be avoided.

In view of the above-mentioned various problems, the present invention provides a socket that can reduce electrical capacitance coupling between contact probes to deteriorate electrical characteristics and facilitate manufacturing. That is the purpose of the invention.

[Means for Solving the Problems]

For the purpose of achieving the above object, the construction of the present invention is described with reference to FIG. 1. The socket of the present invention comprises a block 3 made of an insulating material and a terminal portion connected to a predetermined circuit 2 of the device. Has one end 4A and the other end 4B of the contact portion to which the terminal 8 of the LSI package 7 is pressure-connected, and is arranged in the block 3 corresponding to the terminal 8 of the LSI package to be connected and penetrates the block 3. And a guide means 6A, 6B provided for aligning the terminal 8 of the LSI package with the position of the other end 4B of the contact probe 4, and the block 3
The middle part of the space is the hollow part 5 of the space, and the contact probe 4
Is configured such that the middle portion is inside the hollow portion 5 and one end 4A side and the other end 4B side are supported by the block 3.

[Action]

According to the above-mentioned gist of the present invention, since the intermediate portion of the block 3 is the hollow portion 5 of the space, the insulating material forming the block 3 does not exist between the adjacent contact probes 4 in this section. . That is, the permittivity in this section is the permittivity of air. Therefore, the overall composite permittivity including the permittivity of the insulating material portion of the block 3 supporting both end portions of the contact probe 4 can be significantly reduced, and the electrical characteristics of the contact probe 4 portion can be prevented from deteriorating. Can be reduced.

Providing such a hollow portion 5 makes it possible to eliminate the need for drilling a portion corresponding to the conventional intermediate layer portion,
The simplification of the configuration and the reduction of the manufacturing time can be obtained as compared with the conventional case.

〔Example〕

Hereinafter, the LSI socket of the present invention will be described in detail with reference to the drawings based on an embodiment based on the structure. Note that the same portions are denoted by the same reference numerals throughout the drawings.

FIG. 2 shows an embodiment of the socket of the present invention.
Is a side sectional view, FIG. 6B is a plan view of the block, and FIG. 7C is a perspective view of the block in a separated state. As shown in FIG. (A), the plate-shaped members 3-1 and 3-2 made of a glass epoxy resin material having a low dielectric constant and the frame-shaped member 3-3 are superposed and integrated, Frame-shaped member 3 interposed in the middle
-3 configures the block 3 in which the hollow portion 5 of the space is formed in the central portion.

As shown in FIG. 2B, the plate-shaped member 3-1 has
A through hole 3A into which the contact probe 4 is inserted, a through hole 3B into which a guide pin 6A which is a guide means is inserted, and a through hole 3C into which a guide pin 6B similar to that are inserted are formed.

A through hole 3A into which the contact probe 4 is inserted is formed in the plate member 3-2.

The frame member 3-3 has a through hole 3B into which the guide pin 6A as a guide member is inserted and a through hole 3C into which the guide pin 6B is inserted.
And are formed.

One end of the terminal portion, which is inserted into the through hole 3A of the plate-shaped members 3-1 and 3-2, into the block-shaped contact hole 4 of the block 3 having the through-holes formed therein and is connected to a predetermined circuit of the device. 4A is fixed and supported in a protruding state.

Guide pins 6A and 6B, which are guide means, are inserted into the plate-shaped member 3-1 and the through holes 3B and 3C of the frame-shaped member 3-3 to be fixedly supported.

On one end 4A side of the contact probe 4 arranged in this way, for example, in the case of the present embodiment, a predetermined circuit necessary for constructing various devices as shown in FIG. 1 or 3 is formed. It is connected to the pad 2 of the circuit pattern of the circuit board 1 by soldering 3. The other end 4B side is also LS
Matched to each terminal 8 of the I package 7.

By inserting and placing the LSI package 7 in alignment with the guide pins 6A and 6B as the guide means, the terminal 8 can be accurately brought into contact with the other end 4B of the contact probe 4 of the socket. By pressing, all the terminals 8 and the other end 4B can be surely contact-connected.

Here, a method of manufacturing the socket block 3 will be described. As shown in FIG. 7C, the plate-shaped members 3-1 and 3-2 and the frame-shaped member 3-3, which are perforated respectively, are formed.
By superposing each of them and joining and integrating them, the hollow portion 5 which is the space of the intermediate portion through which the contact probe 4 is arranged can be formed and the contact probe 4 can be manufactured accurately and easily.

In this way, the block 3 is, for example, a plate-shaped member 3-1.
By constructing by interposing a frame-shaped member 3-3 in the middle of 3-2, the plate-shaped members 12-1, 12-2, 12-3,
Precise drilling is applied to many members such as 12-4,
Since they are not laminated, the manufacturing is facilitated, the accuracy is improved, and the time is significantly shortened, so that the cost can be reduced.

Since the block 3 is provided with the hollow portions 5 as described above, the space between the contact probes 4 arranged at a high density with a minute interval is a space in the section of the hollow portions 5 and is made of an insulating material. Since the contact probe 4 does not exist, the total composite permittivity between the contact probes 4 including the supported regions at both ends can be significantly reduced as compared with the conventional one, and therefore the electrical capacity based on the electric capacitance between the contact probes 4 can be reduced. The number of connections is significantly reduced, and the original purpose of the invention is achieved.

[Effect of device]

As described in detail above, according to the socket of the present invention,
A block made of an insulating material and one end of a terminal portion connected to a predetermined circuit of the device and the other end of a contact portion to which a terminal of the LSI package is pressure-connected and corresponding to the terminal of the LSI package to be connected. And a guide means provided to align the terminal of the LSI package with the position of the other end of the contact probe. Is a hollow part of the space and the contact probe is configured such that one end side and the other end side are supported by the block with the middle part inside the hollow part, so the contact probe supported through the block is The hollow space in the middle of the contact probe greatly reduces the electrical capacitive engagement due to the small densities between the contact probes, which are highly densified. Interference fault takes signal is reduced, it is possible to eliminate the deterioration of the electric characteristics. Further, the practical effects such as reduction in cost due to the ease of manufacturing are extremely remarkable.

[Brief description of drawings]

1 is an explanatory view of the principle of the present invention, and FIG. 2 is an explanatory view of an embodiment according to the present invention. FIG. 1 (a) is a side sectional view, FIG. 2 (b) is a plan view of members, and FIG. FIG. 3 is a perspective view of a block in a separated state, FIG. 3 is a conventional explanatory view, FIG. 3A is a side sectional view of an LSI package attached state, FIG. 3B is a side sectional view of a socket, and FIG. A cross-sectional view of the part is shown. In each figure, 1 is a circuit board, 2 is a pad, 3 is a block, 4 is a contact probe, 5 is a hollow portion, 6A and 6B are guide pins, 7 is an LSI package, 8 is a terminal, a lead terminal, and 4A is a One end and 4B are the other end.

Claims (1)

[Scope of utility model registration request] 1. A block made of an insulating material, having one end of a terminal portion connected to a predetermined circuit of the device and the other end of a contact portion to which a terminal of an LSI package is pressure-connected and to be connected.
A rod-shaped contact probe that is arranged in the block corresponding to the terminals of the LSI package and is attached through the block, and is provided to align the terminals of the LSI package with the positions of the other ends of the contact probes. Guide means, wherein the intermediate portion of the block is a hollow portion of the space, and the contact probe is configured such that the intermediate portion is inside the hollow portion and one end side and the other end side are supported by the block. Characteristic LSI socket.