JPH0277891U - - Google Patents
Info
- Publication number
- JPH0277891U JPH0277891U JP15751688U JP15751688U JPH0277891U JP H0277891 U JPH0277891 U JP H0277891U JP 15751688 U JP15751688 U JP 15751688U JP 15751688 U JP15751688 U JP 15751688U JP H0277891 U JPH0277891 U JP H0277891U
- Authority
- JP
- Japan
- Prior art keywords
- block
- lsi
- lsi socket
- package
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは側面断面図、ｂ
は部材の平面図、ｃはブロツクの斜視図、第３図
は従来の説明図で、ａはパツケージの取付側面図
、ｂはソケツトの側面断面図、ｃはコンタクトプ
ローブの取付説明図を示す。
図において、１は基板、２はパツド、３はブロ
ツク、４はコンタクトプローブ、５は中空部、６
Ａ，６Ｂはガイドピン、７はＬＳＩパツケージ、
８はリード端子、４Ａは一端、４Ｂは他端を示す
。
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a side sectional view, and b
3 is a plan view of the member, c is a perspective view of the block, FIG. 3 is an explanatory view of a conventional structure, a is a side view of the installation of the package, b is a side sectional view of the socket, and c is an explanatory view of the installation of the contact probe. In the figure, 1 is a substrate, 2 is a pad, 3 is a block, 4 is a contact probe, 5 is a hollow part, 6 is a
A, 6B are guide pins, 7 is LSI package,
8 is a lead terminal, 4A is one end, and 4B is the other end.
Claims (1)
貫通することで配列されたコンタクトプローブ４
と、突出するように該ブロツク３に固着され、Ｌ
ＳＩパツケージ７の挿脱を案内するガイドピン６
Ａ，６Ｂとを備え、コンタクトプローブ４の一端
４Ａが基板１のパッド２にボンデイグされ、他端
４Ｂが該ＬＳＩパツケージ７のリード端子８に圧
接されるＬＳＩソケツトであつて、 前記ブロツク３の所定個所に中空部５を形成し
、前記コンタクトプローブ４の貫通が該中空部５
を通して行われるように構成されることを特徴と
するＬＳＩソケツト。[Claims for Utility Model Registration] A block 3 made of an insulating material, and contact probes 4 arranged by penetrating the block 3.
and is fixed to the block 3 so as to protrude, and L
Guide pin 6 that guides the insertion and removal of the SI package 7
A and 6B, one end 4A of the contact probe 4 is bonded to the pad 2 of the substrate 1, and the other end 4B is pressure-contacted to the lead terminal 8 of the LSI package 7, and the LSI socket is provided with a predetermined position of the block 3. A hollow portion 5 is formed at the location, and the contact probe 4 penetrates the hollow portion 5.
An LSI socket characterized in that the LSI socket is configured to be operated through the LSI socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988157516U JPH0716317Y2 (en) | 1988-11-30 | 1988-11-30 | LSI socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988157516U JPH0716317Y2 (en) | 1988-11-30 | 1988-11-30 | LSI socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0277891U true JPH0277891U (en) | 1990-06-14 |
| JPH0716317Y2 JPH0716317Y2 (en) | 1995-04-12 |
Family
ID=31437031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988157516U Expired - Lifetime JPH0716317Y2 (en) | 1988-11-30 | 1988-11-30 | LSI socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0716317Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012475A (en) * | 2005-06-30 | 2007-01-18 | Fujitsu Ltd | Socket and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343382U (en) * | 1986-09-08 | 1988-03-23 | ||
| JPS63288048A (en) * | 1987-05-20 | 1988-11-25 | Fujitsu Ltd | Socket for lsi |
-
1988
- 1988-11-30 JP JP1988157516U patent/JPH0716317Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343382U (en) * | 1986-09-08 | 1988-03-23 | ||
| JPS63288048A (en) * | 1987-05-20 | 1988-11-25 | Fujitsu Ltd | Socket for lsi |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012475A (en) * | 2005-06-30 | 2007-01-18 | Fujitsu Ltd | Socket and electronic equipment |
| JP4598614B2 (en) * | 2005-06-30 | 2010-12-15 | 富士通株式会社 | Socket and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0716317Y2 (en) | 1995-04-12 |