JPH0365033B2 - - Google Patents

Info

Publication number
JPH0365033B2
JPH0365033B2 JP61259164A JP25916486A JPH0365033B2 JP H0365033 B2 JPH0365033 B2 JP H0365033B2 JP 61259164 A JP61259164 A JP 61259164A JP 25916486 A JP25916486 A JP 25916486A JP H0365033 B2 JPH0365033 B2 JP H0365033B2
Authority
JP
Japan
Prior art keywords
conductor
pattern
layer
wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61259164A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63111696A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP61259164A priority Critical patent/JPS63111696A/ja
Priority to DE8787309593T priority patent/DE3784213T2/de
Priority to EP87309593A priority patent/EP0266210B1/en
Publication of JPS63111696A publication Critical patent/JPS63111696A/ja
Publication of JPH0365033B2 publication Critical patent/JPH0365033B2/ja
Priority to US07/817,996 priority patent/US5153709A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP61259164A 1986-10-29 1986-10-30 配線基板およびその製造方法 Granted JPS63111696A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61259164A JPS63111696A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法
DE8787309593T DE3784213T2 (de) 1986-10-29 1987-10-29 Elektronischer apparat mit einem keramischen substrat.
EP87309593A EP0266210B1 (en) 1986-10-29 1987-10-29 Electronic apparatus comprising a ceramic substrate
US07/817,996 US5153709A (en) 1986-10-29 1992-01-09 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61259164A JPS63111696A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS63111696A JPS63111696A (ja) 1988-05-16
JPH0365033B2 true JPH0365033B2 (enExample) 1991-10-09

Family

ID=17330236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61259164A Granted JPS63111696A (ja) 1986-10-29 1986-10-30 配線基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS63111696A (enExample)

Also Published As

Publication number Publication date
JPS63111696A (ja) 1988-05-16

Similar Documents

Publication Publication Date Title
EP0266210B1 (en) Electronic apparatus comprising a ceramic substrate
US5828093A (en) Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
US5897724A (en) Method of producing a hybrid integrated circuit
US5227583A (en) Ceramic package and method for making same
EP0725981B1 (en) Component stacking in multi-chip semiconductor packages
US6583019B2 (en) Perimeter anchored thick film pad
JPH08274575A (ja) 素子複合搭載回路基板
KR100665151B1 (ko) 회로 장치
US4639830A (en) Packaged electronic device
JPH0365034B2 (enExample)
JP4013339B2 (ja) バンプを有する電子部品の製造方法
JPH0365033B2 (enExample)
JP2002373961A (ja) 樹脂封止型電子装置
JPH0478181B2 (enExample)
JPH07135394A (ja) 厚膜コンデンサ付きセラミック配線基板及びその製造方法
JPS6318335B2 (enExample)
JP3314609B2 (ja) 半導体装置
JPS6016749B2 (ja) 集積回路用パツケ−ジ
JP3105362B2 (ja) 高密度icパッケージ及びその製造方法
JPH0864925A (ja) チップ型電子部品及びその実装方法
JPH10125503A (ja) 複数のスルーホール電極部を備えた電子部品
JPH05343470A (ja) 半導体装置
JPS6235552A (ja) 半導体搭載装置の製造方法
JPH05343476A (ja) 半導体装置
JPH0824215B2 (ja) 厚膜回路装置の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term