JPH0365034B2 - - Google Patents
Info
- Publication number
- JPH0365034B2 JPH0365034B2 JP61259168A JP25916886A JPH0365034B2 JP H0365034 B2 JPH0365034 B2 JP H0365034B2 JP 61259168 A JP61259168 A JP 61259168A JP 25916886 A JP25916886 A JP 25916886A JP H0365034 B2 JPH0365034 B2 JP H0365034B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wiring
- conductor
- pattern
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61259168A JPS63111697A (ja) | 1986-10-30 | 1986-10-30 | 配線基板およびその製造方法 |
| DE8787309593T DE3784213T2 (de) | 1986-10-29 | 1987-10-29 | Elektronischer apparat mit einem keramischen substrat. |
| EP87309593A EP0266210B1 (en) | 1986-10-29 | 1987-10-29 | Electronic apparatus comprising a ceramic substrate |
| US07/817,996 US5153709A (en) | 1986-10-29 | 1992-01-09 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61259168A JPS63111697A (ja) | 1986-10-30 | 1986-10-30 | 配線基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63111697A JPS63111697A (ja) | 1988-05-16 |
| JPH0365034B2 true JPH0365034B2 (enExample) | 1991-10-09 |
Family
ID=17330299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61259168A Granted JPS63111697A (ja) | 1986-10-29 | 1986-10-30 | 配線基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63111697A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101545U (enExample) * | 1989-01-30 | 1990-08-13 | ||
| JP3162485B2 (ja) * | 1992-06-24 | 2001-04-25 | 株式会社東芝 | マルチチップモジュール |
| JP6923316B2 (ja) * | 2016-12-19 | 2021-08-18 | ローム株式会社 | センサモジュール |
-
1986
- 1986-10-30 JP JP61259168A patent/JPS63111697A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63111697A (ja) | 1988-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |