JPH0365021B2 - - Google Patents
Info
- Publication number
- JPH0365021B2 JPH0365021B2 JP61168577A JP16857786A JPH0365021B2 JP H0365021 B2 JPH0365021 B2 JP H0365021B2 JP 61168577 A JP61168577 A JP 61168577A JP 16857786 A JP16857786 A JP 16857786A JP H0365021 B2 JPH0365021 B2 JP H0365021B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hoop
- insulated circuit
- leads
- shaped clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16857786A JPS6323344A (ja) | 1986-07-16 | 1986-07-16 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16857786A JPS6323344A (ja) | 1986-07-16 | 1986-07-16 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6323344A JPS6323344A (ja) | 1988-01-30 |
| JPH0365021B2 true JPH0365021B2 (enExample) | 1991-10-09 |
Family
ID=15870628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16857786A Granted JPS6323344A (ja) | 1986-07-16 | 1986-07-16 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323344A (enExample) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5622076B2 (enExample) * | 1973-06-27 | 1981-05-22 | ||
| JPS51129671A (en) * | 1975-05-06 | 1976-11-11 | Hitachi Ltd | Method of fixing terminals of hybrid ic |
-
1986
- 1986-07-16 JP JP16857786A patent/JPS6323344A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6323344A (ja) | 1988-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |