JPH0353502Y2 - - Google Patents
Info
- Publication number
- JPH0353502Y2 JPH0353502Y2 JP1985046937U JP4693785U JPH0353502Y2 JP H0353502 Y2 JPH0353502 Y2 JP H0353502Y2 JP 1985046937 U JP1985046937 U JP 1985046937U JP 4693785 U JP4693785 U JP 4693785U JP H0353502 Y2 JPH0353502 Y2 JP H0353502Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- fixed
- movable
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000001746 injection moulding Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985046937U JPH0353502Y2 (US20100268047A1-20101021-C00003.png) | 1985-03-30 | 1985-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985046937U JPH0353502Y2 (US20100268047A1-20101021-C00003.png) | 1985-03-30 | 1985-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61164032U JPS61164032U (US20100268047A1-20101021-C00003.png) | 1986-10-11 |
JPH0353502Y2 true JPH0353502Y2 (US20100268047A1-20101021-C00003.png) | 1991-11-22 |
Family
ID=30561799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985046937U Expired JPH0353502Y2 (US20100268047A1-20101021-C00003.png) | 1985-03-30 | 1985-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0353502Y2 (US20100268047A1-20101021-C00003.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5714437B2 (US20100268047A1-20101021-C00003.png) * | 1975-03-12 | 1982-03-24 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5714437U (US20100268047A1-20101021-C00003.png) * | 1980-06-27 | 1982-01-25 |
-
1985
- 1985-03-30 JP JP1985046937U patent/JPH0353502Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5714437B2 (US20100268047A1-20101021-C00003.png) * | 1975-03-12 | 1982-03-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS61164032U (US20100268047A1-20101021-C00003.png) | 1986-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3849903B2 (ja) | 成形金型及び成形方法 | |
JPH0353502Y2 (US20100268047A1-20101021-C00003.png) | ||
JPH05154847A (ja) | 金型装置 | |
JPS6290213A (ja) | 集積回路素子ケ−シングの射出成形による成形方法 | |
JPH0525655B2 (US20100268047A1-20101021-C00003.png) | ||
JPH01209119A (ja) | モールド成形用金型 | |
JPH11277589A (ja) | 射出成形用金型 | |
JPH0852769A (ja) | 樹脂成形用金型 | |
JPH047890B2 (US20100268047A1-20101021-C00003.png) | ||
JP2837335B2 (ja) | 薄肉成形用金型構造 | |
JPH0356050Y2 (US20100268047A1-20101021-C00003.png) | ||
JP3404187B2 (ja) | モールド金型の離型装置 | |
JPH0591824U (ja) | 転写成形用射出成形金型 | |
JPH1044162A (ja) | 突き出し機構付き金型 | |
JP2807042B2 (ja) | リードフレームのモールド装置 | |
JPH07290521A (ja) | ランナー取出方法および射出成形用金型 | |
JPS6212570Y2 (US20100268047A1-20101021-C00003.png) | ||
JPH09225968A (ja) | プラスチックレンズ成形用の射出成形用金型 | |
JP3301192B2 (ja) | 射出成形用金型装置 | |
TW202335827A (zh) | 注塑模具及模內封裝方法 | |
JPH028740Y2 (US20100268047A1-20101021-C00003.png) | ||
JP2701530B2 (ja) | オーディオカセット収納用上ケースの成形用金型 | |
JPH04325221A (ja) | 射出圧縮成形用金型 | |
JPH0716414Y2 (ja) | 射出成形金型 | |
JPH03261527A (ja) | カセットハーフ成形方法及びカセットハーフ成形用金型 |