JPH0351900Y2 - - Google Patents
Info
- Publication number
- JPH0351900Y2 JPH0351900Y2 JP13891684U JP13891684U JPH0351900Y2 JP H0351900 Y2 JPH0351900 Y2 JP H0351900Y2 JP 13891684 U JP13891684 U JP 13891684U JP 13891684 U JP13891684 U JP 13891684U JP H0351900 Y2 JPH0351900 Y2 JP H0351900Y2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- board
- connector
- gold
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 230000005405 multipole Effects 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multi-Conductor Connections (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13891684U JPH0351900Y2 (US20010021848A1-20010913-M00008.png) | 1984-09-13 | 1984-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13891684U JPH0351900Y2 (US20010021848A1-20010913-M00008.png) | 1984-09-13 | 1984-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153935U JPS6153935U (US20010021848A1-20010913-M00008.png) | 1986-04-11 |
| JPH0351900Y2 true JPH0351900Y2 (US20010021848A1-20010913-M00008.png) | 1991-11-08 |
Family
ID=30697307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13891684U Expired JPH0351900Y2 (US20010021848A1-20010913-M00008.png) | 1984-09-13 | 1984-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351900Y2 (US20010021848A1-20010913-M00008.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428634U (US20010021848A1-20010913-M00008.png) * | 1987-08-13 | 1989-02-20 |
-
1984
- 1984-09-13 JP JP13891684U patent/JPH0351900Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428634U (US20010021848A1-20010913-M00008.png) * | 1987-08-13 | 1989-02-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153935U (US20010021848A1-20010913-M00008.png) | 1986-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5774342A (en) | Electronic circuit with integrated terminal pins | |
| JPH0351900Y2 (US20010021848A1-20010913-M00008.png) | ||
| JP3237449B2 (ja) | 金属ベース回路基板と外部リード線との接続装置 | |
| JP3156630B2 (ja) | パワー回路実装ユニット | |
| JPH04316897A (ja) | Ｉｃカード | |
| JP2572415Y2 (ja) | 金属ベース回路基板と外部リード線との接続装置 | |
| JP3259217B2 (ja) | ノイズ低減パッケージ | |
| JPH05335709A (ja) | 印刷配線基板 | |
| JP2953893B2 (ja) | プリント基板ジャンパー配線方法及びジャンパー配線用射出成形プリント基板 | |
| JPH06164096A (ja) | 回路基板 | |
| JPH0528917B2 (US20010021848A1-20010913-M00008.png) | ||
| JP2556204B2 (ja) | フィルムキャリア半導体装置の実装方法 | |
| JPH0969584A (ja) | 集積回路のパッケージ | |
| JPH03138876A (ja) | 金属ベース基板への表面実装コネクタの取付け方法 | |
| JPH11260959A (ja) | 半導体パッケージ | |
| JPH0399488A (ja) | 両面回路基板の表裏接続具および接続方法 | |
| JPH11219762A (ja) | 電子部品及び基板 | |
| JPH0331085Y2 (US20010021848A1-20010913-M00008.png) | ||
| JP2873101B2 (ja) | 基板接続装置 | |
| JPS60196994A (ja) | 回路の接続方式 | |
| JPH0685165A (ja) | 半導体装置及び半導体装置の製造方法 | |
| JPS62244156A (ja) | 表面実装用パツケ−ジ | |
| JPS6135702B2 (US20010021848A1-20010913-M00008.png) | ||
| JPH01273384A (ja) | 集積回路装置 | |
| JPH09191193A (ja) | 電子回路装置 |
